H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/30/2006	US20060270215 Semiconductor device and method of manufacturing the same
11/30/2006	US20060270214 Semiconductor device and method for fabricating the same
11/30/2006	US20060270210 Waveguide integrated circuit
11/30/2006	US20060270208 Methods of making semiconductor fuses
11/30/2006	US20060270205 Methods of fabricating a semiconductor device having a metal gate pattern
11/30/2006	US20060270196 Methods of forming semiconductor devices and electrical interconnect structures in semiconductor devices and intermediate structures formed thereby
11/30/2006	US20060270194 Semiconductor package and method for forming the same
11/30/2006	US20060270193 Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device
11/30/2006	US20060270189 Manufacturing method of semiconductor device including peeling step and semiconductor device using the same
11/30/2006	US20060270163 Semiconductor chip with flip chip contacts, and method for producing semiconductor chip with flip chip contacts
11/30/2006	US20060270135 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
11/30/2006	US20060270118 Surface mount type semiconductor device and method of manufacturing the same
11/30/2006	US20060270117 Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
11/30/2006	US20060270116 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
11/30/2006	US20060270115 Chip type solid electrolytic capacitor having a small size and a simple structure
11/30/2006	US20060270114 Semiconductor device and method for manufacturing the same
11/30/2006	US20060270111 Integrated circuit package substrate having a thin film capacitor structure
11/30/2006	US20060270108 Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
11/30/2006	US20060270107 Method of making semiconductor BGA package having a segmented voltage plane
11/30/2006	US20060270102 Phase change RAM device and method for fabricating the same
11/30/2006	US20060270093 Semiconductor device and manufacturing method thereof
11/30/2006	US20060270079 Method and circuit structure employing a photo-imaged solder mask
11/30/2006	US20060269666 Optical element
11/30/2006	US20060268523 Heat sink for memory
11/30/2006	US20060268522 Interface module-mounted LSI package
11/30/2006	US20060268213 Low-cost flexible film package module and method of manufacturing the same
11/30/2006	US20060267223 Materials for integrated circuit packaging
11/30/2006	US20060267222 Semiconductor element and manufacturing method thereof
11/30/2006	US20060267221 Integrated-circuit die having redundant signal pads and related integrated circuit, system, and method
11/30/2006	US20060267220 Semiconductor device
11/30/2006	US20060267219 Wiring board and semiconductor device
11/30/2006	US20060267218 Electronic part mounting method, semiconductor module, and semiconductor device
11/30/2006	US20060267217 Apparatuses and associated methods for improved solder joint reliability
11/30/2006	US20060267216 Inductive filters and methods of fabrication therefor
11/30/2006	US20060267215 Semiconductor device, semiconductor device mounting board, and method for mounting semiconductor device
11/30/2006	US20060267214 Micro electronic component
11/30/2006	US20060267213 Stackable tier structure comprising prefabricated high density feedthrough
11/30/2006	US20060267212 Semiconductor device
11/30/2006	US20060267211 Manufacturing method of composite sheet material using ultrafast laser pulses
11/30/2006	US20060267210 Through electrode and method for forming the same
11/30/2006	US20060267209 High-frequency semiconductor device and method of manufacturing the same
11/30/2006	US20060267208 Method of forming closed air gap interconnects and structures formed thereby
11/30/2006	US20060267207 Method of forming electrically conductive lines in an integrated circuit
11/30/2006	US20060267206 Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
11/30/2006	US20060267205 Integrated circuit arrangement with layer stack, and process
11/30/2006	US20060267204 Semiconductor device and manufacturing method thereof
11/30/2006	US20060267203 Structure and method for bond pads of copper-metallized integrated circuits
11/30/2006	US20060267202 Semiconductor device and manufacturing method thereof
11/30/2006	US20060267201 Technique for forming copper-containing lines embedded in a low-k dielectric by providing a stiffening layer
11/30/2006	US20060267199 Semiconductor device manufacturing method
11/30/2006	US20060267198 High performance integrated circuit device and method of making the same
11/30/2006	US20060267197 Integrated circuit device
11/30/2006	US20060267196 Taped semiconductor device and method of manufacture
11/30/2006	US20060267195 Wiring substrate and radiation detector using same
11/30/2006	US20060267194 Integrated circuit package with air gap
11/30/2006	US20060267193 Semiconductor device and communication terminal using thereof
11/30/2006	US20060267192 Heat dissipation structure of an electronic device
11/30/2006	US20060267191 Carrier tape
11/30/2006	US20060267190 Semiconductor device, laminated semiconductor device, and method for producing semiconductor device
11/30/2006	US20060267189 Circuit device and method of manufacturing the same
11/30/2006	US20060267188 Memory module with improved mechanical strength of chips
11/30/2006	US20060267187 Power module package structure
11/30/2006	US20060267186 Semiconductor device
11/30/2006	US20060267185 Encapsulated power semiconductor assembly
11/30/2006	US20060267184 Varied-thickness heat sink for integrated circuit (IC) package
11/30/2006	US20060267183 Use of solder paste for heat dissipation
11/30/2006	US20060267182 Package and method for attaching an integrated heat spreader
11/30/2006	US20060267181 Graded liquid crystal polymer package
11/30/2006	US20060267180 Heat sink arrangement for electrical apparatus
11/30/2006	US20060267179 Redistribution layer with microstrips
11/30/2006	US20060267178 Electrical component and production thereof
11/30/2006	US20060267177 Semiconductor BGA package having a segmented voltage plane
11/30/2006	US20060267176 Method of assembling electronic components of an electronic system, and system thus obtained
11/30/2006	US20060267175 Stacked Semiconductor Package Assembly Having Hollowed Substrate
11/30/2006	US20060267174 Apparatus and method using stackable substrates
11/30/2006	US20060267173 Integrated circuit package having stacked integrated circuits and method therefor
11/30/2006	US20060267172 Memory-Module Board Layout for Use With Memory Chips of Different Data Widths
11/30/2006	US20060267171 Semiconductor device modules, semiconductor devices, and microelectronic devices
11/30/2006	US20060267170 Integrated circuit package with air gap
11/30/2006	US20060267169 Image sensitive electronic device packages
11/30/2006	US20060267168 Hollow package and semiconductor device using the same
11/30/2006	US20060267167 Microelectronic device with integrated energy source
11/30/2006	US20060267166 Semiconductor device
11/30/2006	US20060267165 Method for efficiently producing removable peripheral cards
11/30/2006	US20060267164 Tab package connecting host device element
11/30/2006	US20060267163 Flashless lead frame with horizontal singulation
11/30/2006	US20060267162 Lead frame, semiconductor device, method for producing semiconductor device, and injection mold
11/30/2006	US20060267161 Methods of making integrated circuits
11/30/2006	US20060267159 Electronic component and method for manufacturing the same
11/30/2006	US20060267158 Semiconductor memory apparatus having improved charge retention as a result of bit line shielding
11/30/2006	US20060267157 Solder joints for copper metallization having reduced interfacial voids
11/30/2006	US20060267156 Electrospray and enhanced electrospray deposition of thin films on semiconductor substrates
11/30/2006	US20060267155 Semiconductor wafer, and semiconductor device formed therefrom
11/30/2006	US20060267154 Scribe seal structure for improved noise isolation
11/30/2006	US20060267135 Circuit arrangement placed on a substrate and method for producing the same
11/30/2006	US20060267131 Isolation trench
11/30/2006	US20060267122 Detector arrangement, method for the detection of electrical charge carriers and use of an ono field effect transistor of r detection of an electrical charge
11/30/2006	US20060267114 Semiconductor device and method for manufacturing the same
11/30/2006	US20060267102 Npn darlington esd protection circuit
11/30/2006	US20060267101 Electrostatic Discharge Protection Networks For Triple Well Semiconductor Devices

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