H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/05/2006	US7145356 Circuits for transistor testing
12/05/2006	US7145254 Transfer-molded power device and method for manufacturing transfer-molded power device
12/05/2006	US7145253 Encapsulated sensor device
12/05/2006	US7145252 Configuration for testing the bonding positions of conductive drops and test method for using the same
12/05/2006	US7145251 Colored conductive wires for a semiconductor package
12/05/2006	US7145250 LSI package, LSI element testing method, and semiconductor device manufacturing method
12/05/2006	US7145249 Semiconducting device with folded interposer
12/05/2006	US7145248 Common connection method for flip-chip assembled devices
12/05/2006	US7145247 Offset-bonded, multi-chip semiconductor device
12/05/2006	US7145246 Method of fabricating an ultra-narrow channel semiconductor device
12/05/2006	US7145245 Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—therein
12/05/2006	US7145244 Hardening of copper to improve copper CMP performance
12/05/2006	US7145243 Photo-thermal induced diffusion
12/05/2006	US7145242 Highly integrated and reliable DRAM
12/05/2006	US7145241 Semiconductor device having a multilayer interconnection structure and fabrication process thereof
12/05/2006	US7145240 Semiconductor device having a capacitor and method of manufacturing the same
12/05/2006	US7145239 Circuit board with trace configuration for high-speed digital differential signaling
12/05/2006	US7145238 Semiconductor package and substrate having multi-level vias
12/05/2006	US7145237 Electrode employing nitride-based semiconductor of III-V group compound, and producing method thereof
12/05/2006	US7145236 Semiconductor device having solder bumps reliably reflow solderable
12/05/2006	US7145235 Hermetic passivation structure with low capacitance
12/05/2006	US7145234 Circuit carrier and package structure thereof
12/05/2006	US7145233 Decoupling capacitor closely coupled with integrated circuit
12/05/2006	US7145232 Construction to improve thermal performance and reduce die backside warpage
12/05/2006	US7145231 Electronic apparatus
12/05/2006	US7145230 Semiconductor device with a solder creep-up prevention zone
12/05/2006	US7145229 Silicone metalization
12/05/2006	US7145228 Microelectronic devices
12/05/2006	US7145227 Stacked memory and manufacturing method thereof
12/05/2006	US7145226 Scalable microelectronic package using conductive risers
12/05/2006	US7145225 Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
12/05/2006	US7145224 Semiconductor device
12/05/2006	US7145223 Semiconductor device
12/05/2006	US7145222 Leadless semiconductor package
12/05/2006	US7145221 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
12/05/2006	US7145218 Thin-film resistor and method of manufacturing the same
12/05/2006	US7145216 Antifuse programming with relaxed upper current limit
12/05/2006	US7145204 Guardwall structures for ESD protection
12/05/2006	US7145201 Semiconductor component
12/05/2006	US7145200 Nonvolatile semiconductor memory device
12/05/2006	US7145199 Nonvolatile semiconductor memory
12/05/2006	US7145193 Semiconductor integrated circuit device and process for manufacturing the same
12/05/2006	US7145187 Substrate independent multiple input bi-directional ESD protection structure
12/05/2006	US7145171 Probe unit and its manufacturing method
12/05/2006	US7144970 comprises dielectric polyarylene ethers; for use with multilayer semiconductors; heat/crack resistance
12/05/2006	US7144812 Method of forming copper wire
12/05/2006	US7144809 thin metal films by atomic layer deposition: tungsten nucleation layer over a silicon wafer; copper film from CuCl and triethylboron; vapor phase pulses in inert gas
12/05/2006	US7144807 Low resistivity titanium silicide on heavily doped semiconductor
12/05/2006	US7144804 Semiconductor device and method of manufacturing the same
12/05/2006	US7144802 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects
12/05/2006	US7144800 Multichip packages with exposed dice
12/05/2006	US7144798 Semiconductor memory devices having extending contact pads and related methods
12/05/2006	US7144763 light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging
12/05/2006	US7144762 Semiconductor device with pins and method of assembling the semiconductor device
12/05/2006	US7144761 Semiconductor device and method for fabricating the same
12/05/2006	US7144760 Semiconductor device, method of manufacturing the same, circuit board, and electronic equipment
12/05/2006	US7144758 Manufacturing method of semiconductor device, including differently spaced bump electrode arrays
12/05/2006	US7144757 Circuit suitable for vertical integration and method of producing same
12/05/2006	US7144756 Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate
12/05/2006	US7144754 Device having resin package and method of producing the same
12/05/2006	US7144749 Method of etching a semiconductor device
12/05/2006	US7144745 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced
12/05/2006	US7144655 Thin-film battery having ultra-thin electrolyte
12/05/2006	US7144624 Dendritic fiber material
12/05/2006	US7144618 Multilayer composite and method for preparing the same
12/05/2006	US7144538 Method for making a direct chip attach device and structure
12/05/2006	US7144490 Forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad
12/05/2006	US7144265 Socket for electric component
12/05/2006	US7144245 Packages for semiconductor die
12/05/2006	US7143929 Ceramic circuit board and method for manufacturing the same
12/05/2006	US7143819 Heat sink with angled heat pipe
12/05/2006	US7143815 Liquid cooling device
12/05/2006	CA2434161C Process for the manufacture of printed circuit boards with plated resistors
12/03/2006	CA2549232A1 Led luminaire and arrangement comprising a luminaire body and an led operating device
11/2006
11/30/2006	WO2006127988A1 Low inductance via structures
11/30/2006	WO2006127745A2 Apparatus and methods for maintaining integrated circuit performance at reduced power
11/30/2006	WO2006127107A2 Semiconductor package and method for forming the same
11/30/2006	WO2006126621A1 Printed wiring board
11/30/2006	WO2006126536A1 Semiconductor device and method for fabricating the same
11/30/2006	WO2006126527A1 Silver-coated ball and method for manufacturing same
11/30/2006	WO2006126525A1 Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME
11/30/2006	WO2006126460A1 Active matrix substrate, display device, and pixel defect correcting method
11/30/2006	WO2006126441A1 Package for electronic component, electronic component using such package, and method for producing package for electronic component
11/30/2006	WO2006126323A1 Semiconductor device, method for manufacturing such semiconductor device, and liquid crystal display device
11/30/2006	WO2006126110A1 Anti-fuse memory device
11/30/2006	WO2006125571A1 Ubm pad solder contact and method for production of a solder connection
11/30/2006	WO2006125431A1 Method for generating and/or memorising a retrievable cryptographic key during the production of a topographical structure
11/30/2006	WO2006125375A1 Light-emitting diode cluster lamp
11/30/2006	WO2006094040A3 A method for pattern metalization of substrates
11/30/2006	WO2006091032A8 Lead frame
11/30/2006	WO2006059907A3 Carrier for electrical components with soldered-on cooling body
11/30/2006	US20060271793 Reliable generation of a device-specific value
11/30/2006	US20060271792 Data protection and cryptographic functions using a device-specific value
11/30/2006	US20060270828 Curable resin composition and products of curing thereof
11/30/2006	US20060270249 Semiconductor device and method of fabricating the same
11/30/2006	US20060270233 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects
11/30/2006	US20060270228 Method of forming metal pattern using selective electroplating process
11/30/2006	US20060270227 Hillock reduction in copper films
11/30/2006	US20060270226 Reflective mask blank, reflective mask, and method for manufacturing semiconductor device
11/30/2006	US20060270225 Silicon carbide semiconductor device fabrication method

1 ... 1142 1143 1144 1145 1146 1147 1148 1149 1150 1151 1152 1153 1154 1155 1156 1157 1158 1159 1160 1161 1162 ... 2262