| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 12/06/2006 | EP1729342A1 Heat sink board and manufacturing method thereof |
| 12/06/2006 | EP1729341A2 Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method |
| 12/06/2006 | EP1729340A1 High frequency package, transmitting and receiving module and wireless equipment |
| 12/06/2006 | EP1729337A2 Electronic device and method of manufacturing the same |
| 12/06/2006 | EP1729334A1 Solder composition and method of bump formation therewith |
| 12/06/2006 | EP1729174A1 Photolithographically-patterned out-of-plane coil structures and method of making |
| 12/06/2006 | EP1728287A2 Combination insulator and organic semiconductor formed from self-assembling block co-polymers |
| 12/06/2006 | EP1728278A1 Heat exchanger |
| 12/06/2006 | EP1728277A1 Housing for an electronic circuit and method for sealing the housing |
| 12/06/2006 | EP1728276A1 Electronic device with stress relief element |
| 12/06/2006 | EP1728234A1 Electroluminescent display devices |
| 12/06/2006 | EP1661178B1 Electronic component comprising a cooling surface |
| 12/06/2006 | EP1602155B1 Integrated thermal sensor for optoelectronic modules |
| 12/06/2006 | EP1504469B1 Semiconductor package and method of preparing same |
| 12/06/2006 | CN2845416Y 电子系统 Electronic Systems |
| 12/06/2006 | CN2845415Y Adjustable radiating ribs |
| 12/06/2006 | CN2845170Y Double IC card system |
| 12/06/2006 | CN2845169Y Plastic packed diode bound on surface |
| 12/06/2006 | CN2845168Y Chip package body with embedded inductance element |
| 12/06/2006 | CN2845167Y Reversed sheet packing structure |
| 12/06/2006 | CN2845166Y Heat pipe radiator and radiating fin therefor |
| 12/06/2006 | CN2845165Y Clamping device with adjustable elasticity |
| 12/06/2006 | CN2845164Y Electronic with heat conducting mould |
| 12/06/2006 | CN2845163Y IC fixing sheet and IC chip radiation fixing structure |
| 12/06/2006 | CN1875670A Method of conformal coating using noncontact dispensing |
| 12/06/2006 | CN1875485A Structure and programming of laser fuse |
| 12/06/2006 | CN1875484A Variable inductor for integrated circuit and printed circuit board |
| 12/06/2006 | CN1875483A Process for forming a dielectric on a copper-containing metallization and capacitor arrangement |
| 12/06/2006 | CN1875481A Semiconductor device and process for fabricating the same |
| 12/06/2006 | CN1875480A Thermal conductive material utilizing electrically conductive nanoparticles |
| 12/06/2006 | CN1875479A Method and arrangement in inverter |
| 12/06/2006 | CN1875478A Solvent-modified resin compositions and methods of use thereof |
| 12/06/2006 | CN1875477A Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
| 12/06/2006 | CN1875476A Structure and method of making capped chips including a flowable conductive medium |
| 12/06/2006 | CN1875238A Flow distributing unit and cooling unit |
| 12/06/2006 | CN1875068A No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
| 12/06/2006 | CN1874889A Sandwiched thermal heat treatment |
| 12/06/2006 | CN1874670A Display module |
| 12/06/2006 | CN1874663A Captive shoulder nut assembly |
| 12/06/2006 | CN1874090A Silicon optical package with 45 degree turning mirror |
| 12/06/2006 | CN1874015A Semiconductor illuminator integrated heat conducting/radiating moudule |
| 12/06/2006 | CN1873994A Pixel of image sensor and method for fabricating the same |
| 12/06/2006 | CN1873991A Display device substrate and liquid crystal display device having the same |
| 12/06/2006 | CN1873988A Semiconductor memory device and method of production |
| 12/06/2006 | CN1873980A Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method |
| 12/06/2006 | CN1873979A 半导体集成电路 The semiconductor integrated circuit |
| 12/06/2006 | CN1873978A Electrostatic discharge protection process and device for the improvement of a semiconductor circuit |
| 12/06/2006 | CN1873977A Electrostatic discharge protection circuit and semiconductor structure for electrostatic discharge |
| 12/06/2006 | CN1873976A Semiconductor device and display device thereof |
| 12/06/2006 | CN1873975A High-brightness led with protective function of electrostatic discharge damage |
| 12/06/2006 | CN1873974A LED device with protective circuit of diode |
| 12/06/2006 | CN1873973A Envelope for luminous elements of semiconductor in large power |
| 12/06/2006 | CN1873972A Stack architecture of multiple chips |
| 12/06/2006 | CN1873971A Solder foil, semiconductor device and electronic device |
| 12/06/2006 | CN1873970A Electronic device and method of manufacturing the same |
| 12/06/2006 | CN1873969A Circuit substrate, electro-optical device and electronic apparatus |
| 12/06/2006 | CN1873968A Wiring board and semiconductor device |
| 12/06/2006 | CN1873967A Wiring board, semiconductor device and display module |
| 12/06/2006 | CN1873966A Improved structure of lead frame for packaging semiconductor chip |
| 12/06/2006 | CN1873965A Wire rack type package of semiconductor, and wire rack |
| 12/06/2006 | CN1873964A 半导体器件和其制造方法 Semiconductor device and manufacturing method thereof |
| 12/06/2006 | CN1873963A Semiconductor device and method of manufacturing a semiconductor device |
| 12/06/2006 | CN1873962A 半导体元件及其制造方法 Semiconductor device and manufacturing method |
| 12/06/2006 | CN1873961A Heat sink of heat pipe |
| 12/06/2006 | CN1873960A Heat radiating structure for cpu |
| 12/06/2006 | CN1873959A Driver ic package with improved heat dissipation |
| 12/06/2006 | CN1873958A Technique for riveting base plate of radiator and fins |
| 12/06/2006 | CN1873946A Method for forming contact holes on display device, and base plate of display device |
| 12/06/2006 | CN1873944A Semiconductor device and method for fabricating the same |
| 12/06/2006 | CN1873939A Manufacturing method for semiconductor device |
| 12/06/2006 | CN1873938A Mold for manufacturing semiconductor device and semiconductor device manufactred using the same |
| 12/06/2006 | CN1873934A Fabricating method for lead frame of integrated circuit, and lead frame prepared by the method |
| 12/06/2006 | CN1873750A Drive circuit board and plane display device with the same |
| 12/06/2006 | CN1288948C Power delivery connector for integrated circuits utilizing integrated capacitors |
| 12/06/2006 | CN1288947C Multi-layer wire distributed substrate and mfg method |
| 12/06/2006 | CN1288753C Electromagnetic noise eliminator, semiconductor device using the eliminator and making method thereof |
| 12/06/2006 | CN1288752C Silicon based micro passage heat exchanger |
| 12/06/2006 | CN1288751C Clamping heat sinks to circuit boards over processors |
| 12/06/2006 | CN1288750C Semiconductor device and method of enveloping an integrated circuit |
| 12/06/2006 | CN1288749C Resin for encapsulating optical semiconductor component, appts, contg. same encapsulated component and its prodn method |
| 12/06/2006 | CN1288748C Resin sealing type semiconductor device and method of making the same |
| 12/06/2006 | CN1288747C Staircase shape pattern for semiconductor chip welding |
| 12/06/2006 | CN1288746C Ceramic package sealing structure and ceramic package having said sealing structure and manufacture thereof |
| 12/06/2006 | CN1288743C Hierarchy type programmable interconnecting line structure |
| 12/06/2006 | CN1288742C Manufacturing method of semiconductor memory device |
| 12/06/2006 | CN1288736C Method for manufacturing semiconductor device |
| 12/06/2006 | CN1288732C Connecting gasket and its manufacturing method |
| 12/06/2006 | CN1288731C Semiconductor device, adhesive and adhesive film |
| 12/06/2006 | CN1288729C Semiconductor packaging member and method for making same |
| 12/06/2006 | CN1288727C Forming of embedded seal cavity in low-temp. co-sintered ceramic |
| 12/06/2006 | CN1288668C Compliant and crosslinkable thermal interface materials |
| 12/06/2006 | CN1287977C Coupling structure for component and coupling method |
| 12/05/2006 | USRE39418 Mounting apparatus for ball grid array device |
| 12/05/2006 | US7146597 CAD method for arranging via-holes, a CAD tool, photomasks produced by the CAD method, a semiconductor integrated circuit manufactured with photomasks and a computer program product for executing the CAD method |
| 12/05/2006 | US7146596 Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid |
| 12/05/2006 | US7145823 Method and apparatus to implement a temperature control mechanism on a memory device |
| 12/05/2006 | US7145782 Reducing loadline impedance in a system |
| 12/05/2006 | US7145775 Chassis conducted cooling thermal dissipation apparatus for servers |
| 12/05/2006 | US7145774 Backside cooling apparatus for modular platforms |
| 12/05/2006 | US7145428 Circuit substrate |