H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/07/2006	WO2006130250A1 Technique for forming copper-containing lines embedded in a low-k dielectric by providing a stiffening layer
12/07/2006	WO2006129926A1 Mold for manufacturing semiconductor device and semiconductor device manufactred using the same
12/07/2006	WO2006129848A1 Production method of glass penetrating wiring board, glass penetrating wiring board, and probe card and packaging element using glass penetrating wiring board
12/07/2006	WO2006129832A1 Semiconductor device and mounting structure thereof
12/07/2006	WO2006129817A1 Semiconductor device, manufacturing method thereof, and manufacturing method of antenna
12/07/2006	WO2006129421A1 Three level power converter
12/07/2006	WO2006129354A1 Circuit board, method for manufacturing such circuit board, and electronic component using such circuit board
12/07/2006	WO2006129135A1 An interconnection structure for electronic components, an electronic component and methods for producing the same
12/07/2006	WO2006128813A1 Heat sink for board
12/07/2006	WO2006091612A3 Superconductive articles having density characteristics
12/07/2006	WO2006032823A3 Generating an integrated circuit identifier
12/07/2006	WO2005074027A3 Integrated circuit chip with electrostatic discharge protection device
12/07/2006	WO2005050714A3 High temperature electronic devices
12/07/2006	US20060277506 System and method for product yield prediction
12/07/2006	US20060276053 Spin-on glass composition, method of preparing the spin-on glass composition and method of forming a porous silicon oxide layer using the spin-on glass composition
12/07/2006	US20060276029 Semiconductor device and method for manufacturing same
12/07/2006	US20060276027 Interconnects with harmonized stress and methods for fabricating the same
12/07/2006	US20060276022 Capping copper bumps
12/07/2006	US20060276016 Nickel bonding cap over copper metalized bondpads
12/07/2006	US20060276000 Semiconductor wafer marking apparatus having marking interlock system and semiconductor wafer marking method using the same
12/07/2006	US20060275999 Semiconductor device and method of manufacturing the same
12/07/2006	US20060275993 Low OHMIC layout technique for MOS transistors
12/07/2006	US20060275990 Semiconductor device and method of producing same
12/07/2006	US20060275958 Fabricating nanoscale and atomic scale devices
12/07/2006	US20060275957 Semiconductor device
12/07/2006	US20060275955 Patterned nanorod arrays and methods of making same
12/07/2006	US20060275951 Microelectronic assemblies having low profile connections
12/07/2006	US20060275949 Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
12/07/2006	US20060275934 Management of computer processes
12/07/2006	US20060275933 Thermally conductive ceramic tipped contact thermocouple
12/07/2006	US20060275932 Semiconductor device, function setting method thereof, and evaluation method thereof
12/07/2006	US20060274503 Heat sink clip with cammed handle
12/07/2006	US20060274477 DRAM cells and electronic systems
12/07/2006	US20060273469 Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film
12/07/2006	US20060273468 Configuration for multi-layer ball grid array
12/07/2006	US20060273467 Flip chip package and method of conducting heat therefrom
12/07/2006	US20060273466 Adhesion of tungsten nitride films to a silicon surface
12/07/2006	US20060273465 Semiconductor device and manufacturing method therefor
12/07/2006	US20060273464 Semiconductor device and method of manufacturing a semiconductor device
12/07/2006	US20060273463 Semiconductor device and mounting structure thereof
12/07/2006	US20060273462 System and method based on field-effect transistors for addressing nanometer-scale devices
12/07/2006	US20060273461 Electronic device and method of manufacturing the same
12/07/2006	US20060273460 Method and structure for determining thermal cycle reliability
12/07/2006	US20060273459 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry
12/07/2006	US20060273458 Substrate structure of semiconductor package
12/07/2006	US20060273456 Multiple spacer steps for pitch multiplication
12/07/2006	US20060273455 Electronic packaging including die with through silicon via
12/07/2006	US20060273454 Locking mechanism for die assembly
12/07/2006	US20060273453 Heat sink and display panel including heat sink
12/07/2006	US20060273452 Semiconductor package and fabrication method thereof
12/07/2006	US20060273451 Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method
12/07/2006	US20060273450 Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor
12/07/2006	US20060273449 Hermetically sealed package for optical, electronic, opto-electronic and other devices
12/07/2006	US20060273448 Semiconductor structures having electrophoretically insulated vias
12/07/2006	US20060273447 Electronic package structures and methods
12/07/2006	US20060273446 Circuit board device and method of interconnecting wiring boards
12/07/2006	US20060273445 Three-dimensional structure composed of silicon fine wires, method for producing the same, and device including the same
12/07/2006	US20060273444 Packaging chip and packaging method thereof
12/07/2006	US20060273443 Package for an electronic component and method for its production
12/07/2006	US20060273442 Semiconductor device for accommodating large chips, fabrication method thereof, and carrier used in the semiconductor device
12/07/2006	US20060273441 Assembly structure and method for chip scale package
12/07/2006	US20060273440 Stacking apparatus and method for stacking integrated circuit elements
12/07/2006	US20060273439 Three-dimensional multichip stack electronic package structure
12/07/2006	US20060273438 Stacked chip security
12/07/2006	US20060273437 Optoelectronic semiconductor assembly with an optically transparent cover, and a method for producing optoelectronic semiconductor assembly with an optically transparent cover
12/07/2006	US20060273436 Arrangement, apparatus, and associated method, for providing stored data in secured form for purposes of identification and informational storage
12/07/2006	US20060273435 Chip Package
12/07/2006	US20060273434 Semiconductor device and the manufacturing method for the same
12/07/2006	US20060273433 Semiconductor device
12/07/2006	US20060273432 Lead frame with attached components
12/07/2006	US20060273431 Interconnects having sealing structures to enable selective metal capping layers
12/07/2006	US20060273430 Method of wafer-level packaging using low-aspect ratio through-wafer holes
12/07/2006	US20060273427 Vertical metal-insulator-metal (MIM) capacitors
12/07/2006	US20060273405 Semiconductor device and method for patterning
12/07/2006	US20060273399 ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad
12/07/2006	US20060273398 Semiconductor device and manufacturing method of semiconductor device
12/07/2006	US20060273397 Protect diodes for hybrid-orientation substrate structures
12/07/2006	US20060273394 Semiconductor device and method of manufacturing same
12/07/2006	US20060273356 Single-electron transistor, field-effect transistor, sensor, method for producing sensor, and sensing method
12/07/2006	US20060273313 IC packaging technique
12/07/2006	US20060272799 Supporting seat for supporting weight of heat dissipating fins to avoid deformation of heat dissipating tubes extending through the heat dissipating fins
12/07/2006	US20060272797 Cooling device for an electric component
12/07/2006	DE4419564B4 Plattenwärmerohr Plate heat pipe
12/07/2006	DE202006014486U1 Band shaped cooling element e.g. for electronic devices, has flexible base having projections arranged in matrix fashion with projections provided to dissipate heat and have flexible thin film
12/07/2006	DE19540894B4 Verfahren zur Verhinderung der Absorption von Feuchtigkeit in eine Störstellen enthaltende Isolationsschicht A method for preventing absorption of moisture in an impurity-containing insulating layer
12/07/2006	DE19522338B4 Chipträgeranordnung mit einer Durchkontaktierung Chip carrier assembly with a via
12/07/2006	DE112004002653T5 Halbleitervorrichtungs-Modulstruktur The semiconductor device module structure
12/07/2006	DE10322628B4 Verfahren zur Herstellung einer Ansaugfläche auf einem für die SMD-Montagetechnik vorgesehenen elektrischen Bauteil, insbesondere einer Spule, sowie Vorrichtung zur Durchführung des Verfahrens A process for producing a suction surface on an intended for SMD assembly technique electrical component, in particular a coil, as well as apparatus for carrying out the method
12/07/2006	DE10250889B4 Verbesserte SiC-Barrierenschicht für eine Kupfermetallisierungsschicht mit einem Dielektrikum mit kleinem ε und Verfahren zur Herstellung derselben Improved SiC barrier layer for a copper metallization with a dielectric with a small ε, and methods for making same
12/07/2006	DE102005051497B3 Memory module e.g. registered dual in-line memory module, has two groups of semiconductor chips connected by two separate line buses, respectively, where conducting paths of line buses branch out to all semiconductor chips of groups
12/07/2006	DE102005029251A1 Speichermodul und Verfahren zum Betreiben eines Speichermoduls Memory module and method of operating a memory module
12/07/2006	DE102005026229B4 Halbleiter-Package, das ein Neuverteilungsmuster enthält, und Verfahren zu dessen Herstellung The semiconductor package containing a Neuverteilungsmuster, and process for its preparation
12/07/2006	DE102005025754A1 Halbleitersensorbauteil mit einem Sensorchip und Verfahren zur Herstellung desselben Of the same semiconductor sensor device comprising a sensor chip and method for producing
12/07/2006	DE102005025083A1 Thermoplast-Duroplast-Verbund und Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material Thermoplastic-thermoset composite and method of joining a thermoplastic material with a thermosetting material
12/07/2006	DE102004039803B4 Verfahren zur Herstellung einer Leitbahnanordnung mit erhöhter kapazitiver Kopplung sowie zugehörige Leitbahnanordnung A process for preparing a Interconnect arrangement with increased capacitive coupling and associated Interconnect arrangement
12/07/2006	DE10064194B4 Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls Power semiconductor module and the cooling body for receiving the power semiconductor module
12/07/2006	DE10024518B4 Integriertes Halbleiterschaltelement und Herstellungsverfahren Integrated semiconductor switching element and methods of manufacture
12/06/2006	EP1729557A2 Cooling device for electronic components
12/06/2006	EP1729344A2 First die indicator for integrated circuit wafer
12/06/2006	EP1729343A2 A power semiconductor device

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