H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/13/2006	CN1876720A Rtv silicone rubber composition for electric and electronic part protection, circuit boards, silver electrodes, and silver chip resistors
12/13/2006	CN1876710A Epoxy resin composition for sealing and packing optical semiconductor element and optical semiconductor element using the said composition
12/13/2006	CN1876246A Droplet discharge method, electro-optic device, and electronic apparatus
12/13/2006	CN1876245A Droplet discharge method, electro optical device and electronic apparatus
12/13/2006	CN1290393C Cooling apparatus, producing method and portable equipment thereof
12/13/2006	CN1290392C Electronic device
12/13/2006	CN1290389C Circuit-board having internal electronic element and making method thereof
12/13/2006	CN1290386C Interconnect
12/13/2006	CN1290383C Sheet-like matter for heat-transfer base plate and its mfg. method, and heat-transfer base plate and mfg. method using it
12/13/2006	CN1290205C Light-emitting diode evenly emitting light around
12/13/2006	CN1290196C Semiconductor device and making process
12/13/2006	CN1290189C Semiconductor device with redundant function
12/13/2006	CN1290188C Semiconductor device with fuse
12/13/2006	CN1290187C Standard unit for multi-power source and its corresponding technology
12/13/2006	CN1290186C Semiconductor device and method for manufacturing the same
12/13/2006	CN1290185C Integrated circuit package device and its manufacturing method
12/13/2006	CN1290184C Wire pad structure capable of improving impedance matching
12/13/2006	CN1290183C Moulded resin encapsulated power semiconductor device and its mfg. method
12/13/2006	CN1290182C Inversion encapsulation structure
12/13/2006	CN1290181C Power delivery and other systems for integrated circuits
12/13/2006	CN1290177C Semiconductor device with seal ring
12/13/2006	CN1290173C Manufacturing method of inlaid metal
12/13/2006	CN1290165C Method for manufacturing semiconductor device
12/13/2006	CN1290164C Ruthenium silicide wet etch
12/13/2006	CN1289621C Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
12/13/2006	CN1289614C Substance for forming electrically-conducting film and electrically-conducting film and its manufacturing method
12/13/2006	CN1289225C Method for making pathway pattern and use thereof
12/13/2006	CN1289207C Interchangeable microdeposition head apparatus and method
12/13/2006	CA2528736A1 Light-emitting device
12/12/2006	USRE39426 Thermally enhanced flip chip package and method of forming
12/12/2006	US7149113 Semiconductor integrated circuit device
12/12/2006	US7149095 Stacked microelectronic assemblies
12/12/2006	US7149092 Printed circuit board
12/12/2006	US7149091 Electronic circuit device
12/12/2006	US7149084 Redundant liquid cooling system and electronic apparatus having the same therein
12/12/2006	US7149024 Optical modulator module
12/12/2006	US7148752 Integrated power amplifier module with power sensor
12/12/2006	US7148578 Semiconductor multi-chip package
12/12/2006	US7148577 Materials for electronic devices
12/12/2006	US7148576 Semiconductor device and method of fabricating the same
12/12/2006	US7148575 Semiconductor device having bonding pad above low-k dielectric film
12/12/2006	US7148574 Bonding pad structure and method of forming the same
12/12/2006	US7148573 Semiconductor integrated circuit
12/12/2006	US7148572 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
12/12/2006	US7148571 Semiconductor device and method of manufacturing the same
12/12/2006	US7148570 Low resistivity titanium silicide on heavily doped semiconductor
12/12/2006	US7148569 Pad surface finish for high routing density substrate of BGA packages
12/12/2006	US7148567 Semiconductor integrated circuit device
12/12/2006	US7148566 Method and structure for an organic package with improved BGA life
12/12/2006	US7148565 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
12/12/2006	US7148564 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
12/12/2006	US7148563 Multi-chip package for reducing parasitic load of pin
12/12/2006	US7148562 Power semiconductor device and power semiconductor module
12/12/2006	US7148561 Ball grid array substrate strip with warpage-preventive linkage structure
12/12/2006	US7148560 IC chip package structure and underfill process
12/12/2006	US7148558 Versatile system for limiting mobile charge ingress in SOI semiconductor structures
12/12/2006	US7148556 High performance diode-implanted voltage-controlled poly resistors for mixed-signal and RF applications
12/12/2006	US7148554 Discrete electronic component arrangement including anchoring, thermally conductive pad
12/12/2006	US7148553 Semiconductor device with inductive component and method of making
12/12/2006	US7148550 Semiconductor device and semiconductor device data write method having magneto-resistance effect element
12/12/2006	US7148544 Semiconductor-on-insulator constructions
12/12/2006	US7148540 Graded conductive structure for use in a metal-oxide-semiconductor device
12/12/2006	US7148535 Zero capacitance bondpad utilizing active negative capacitance
12/12/2006	US7148529 Semiconductor package
12/12/2006	US7148523 Molecular rectifier device
12/12/2006	US7148505 Method for using a chip carrier substrate with a land grid array and external bond terminals
12/12/2006	US7148504 Semiconductor device
12/12/2006	US7148503 Semiconductor device, function setting method thereof, and evaluation method thereof
12/12/2006	US7148447 Method and apparatus for laser marking by ablation
12/12/2006	US7148430 Electronic component mounting structure onto board
12/12/2006	US7148427 Wiring substrate, display device, semiconductor chip, and electronic equipment
12/12/2006	US7148426 Lead-free solder, and connection lead and electrical component using said lead-free solder
12/12/2006	US7148425 Power plane system of high-speed digital circuit for suppressing ground bounce noise
12/12/2006	US7148150 Method of forming metal line layer in semiconductor device
12/12/2006	US7148141 Method for manufacturing metal structure having different heights
12/12/2006	US7148134 Integrated circuitry and a semiconductor processing method of forming a series of conductive lines
12/12/2006	US7148119 Process for production of semiconductor substrate
12/12/2006	US7148116 Semiconductor device with load resistor and fabrication method
12/12/2006	US7148113 Semiconductor device and fabricating method thereof
12/12/2006	US7148089 Method for forming copper fuse links
12/12/2006	US7148087 Electronic package having a folded flexible substrate and method of manufacturing the same
12/12/2006	US7148085 Gold spot plated leadframes for semiconductor devices and method of fabrication
12/12/2006	US7148084 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
12/12/2006	US7148083 Transfer mold semiconductor packaging processes
12/12/2006	US7148081 Method of manufacturing a semiconductor device
12/12/2006	US7148080 Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
12/12/2006	US7148078 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
12/12/2006	US7147908 Semiconductor package with getter formed over an irregular structure
12/12/2006	US7147736 Tape composition and process for internally constrained sintering of low temperature co-fired ceramic
12/12/2006	US7147367 For transferring heat between a microprocessor and a heat sink, composed of a matrix material that softens at the operating temperature of the microprocessor and containing a lower melting alloy dispersed in it and free of agglomerated particles
12/12/2006	US7147141 Preconditioning via plug material for a via-in-pad ball grid array package
12/12/2006	US7147045 Toroidal low-profile extrusion cooling system and method thereof
12/12/2006	US7147043 Integratied liquid cooling system for electrical components
12/12/2006	US7147042 Heat collector
12/12/2006	US7147041 Lightweight heat sink
12/12/2006	US7146722 Method of forming a bond pad structure
12/12/2006	US7146720 Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial
12/12/2006	US7146719 Multilayer circuit component and method for manufacturing the same
12/12/2006	CA2116746C Ohmic contact structure of high integrated semiconductor device and method for making the same
12/07/2006	WO2006130609A1 Solder joints for copper metallization having reduced interfacial voids

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