H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/14/2006	US20060278963 Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same
12/14/2006	US20060278962 Microelectronic loop packages
12/14/2006	US20060278961 Leadless semiconductor package
12/14/2006	US20060278959 Method for reducing leakage current in a semiconductor device
12/14/2006	US20060278958 Semiconductor arrangement and method for producing a semiconductor arrangement
12/14/2006	US20060278957 Fabrication of semiconductor integrated circuit chips
12/14/2006	US20060278956 Semiconductor wafer with non-rectangular shaped dice
12/14/2006	US20060278954 Semiconductor device having interlayer insulating film covered with hydrogen diffusion barrier film and its manufacture method
12/14/2006	US20060278946 Semiconductor device and method for manufacturing the same
12/14/2006	US20060278930 ESD protection circuit using a transistor chain
12/14/2006	US20060278929 Active matrix substrate
12/14/2006	US20060278928 Semiconductor layout structure for ESD protection circuits
12/14/2006	US20060278894 Intermeshed guard bands for multiple voltage supply structures on an integrated circuit, and methods of making same
12/14/2006	US20060278871 Detecting and improving bond pad connectivity with pad check
12/14/2006	US20060278528 Method of effecting a signal readout on a gas-sensitive field-effect transistor
12/14/2006	DE4228529B4 Verfahren zum Passivieren von Halbleiterscheiben A method for the passivation of semiconductor wafers
12/14/2006	DE102006019691A1 Flüssigkeitsgekühlte Halbleitereinheit zum Kühlen von Hochleistungshalbleiterelementen, welche in Modulen enthalten sind A liquid-cooled semiconductor device for cooling high power semiconductor elements, which are contained in modules
12/14/2006	DE102005026224A1 Integrated circuit (IC) packaging technique involves using environmental benign thermal plastic material which is injected into packaging mold cavity for packaging and molding IC chip on chip mount using heat and pressure
12/14/2006	DE102005025543A1 Gehäuse für ein elektronisches Bauteil und Verfahren zur Herstellung desselben The same housing for an electronic component and methods for making
12/14/2006	DE102005025465A1 Semiconductor unit comprises a circuit carrier with interior contact areas, a semiconductor chip with an active surface and flipside and bonding wire connections between chip contact areas and interior contact areas of the circuit carrier
12/14/2006	DE102005016751B3 Verfahren zur Herstellung gehäuster elektronischer Bauelemente Process for the preparation of packaged electronic components
12/14/2006	DE102004010614B4 Basishalbleiterbauteil für einen Halbleiterbeuteilstapel und Verfahren zur Herstellung desselben Based semiconductor device for a Halbleiterbeuteilstapel and method of manufacturing the same
12/14/2006	DE10142483B4 Elektronisches Bauteil mit Außenflachleitern und ein Verfahren zu seiner Herstellung An electronic part having external leads and a process for its preparation
12/14/2006	DE10124047B4 Verfahren zur Herstellung elektronischer Bauteile mit Halbleiterchips und Systemträger A process for producing electronic components with semiconductor chips and leadframe
12/14/2006	DE10110203B4 Elektronisches Bauteil mit gestapelten Halbleiterchips und Verfahren zu seiner Herstellung An electronic part having stacked semiconductor chips and process for its preparation
12/14/2006	CA2611304A1 Method for making electronic devices
12/14/2006	CA2609772A1 Quantum-dot cellular automata methods and devices
12/13/2006	EP1732215A2 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
12/13/2006	EP1732131A2 Assembly apted to cool a group of power electronic components
12/13/2006	EP1732130A2 Circuit assembly with surface-mount IC package and heat sink
12/13/2006	EP1732129A2 High temperature evaporator cell and method of evaporating high-melting materials
12/13/2006	EP1732128A1 Substrate for semiconductor device and semiconductor device
12/13/2006	EP1732127A2 Method for bonding and device manufactured according to such method
12/13/2006	EP1732126A1 Method for bonding and device manufactured according to such method
12/13/2006	EP1732118A1 Heater, reflow apparatus, and solder bump forming method and apparatus
12/13/2006	EP1732117A2 Semiconductor device packaging substrate and semiconductor device packaging structure
12/13/2006	EP1732113A2 Silver metallization by damascene method
12/13/2006	EP1732109A2 Mask formation over an integrated electronic circuit
12/13/2006	EP1731624A1 Copper alloy and method for production thereof
12/13/2006	EP1731002A2 Heat spreader constructions, integrated circuitry, methods of forming heat speader contruictions, and methods of forming integrated circuitry
12/13/2006	EP1730792A2 Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
12/13/2006	EP1730775A1 Semiconductor device and method of manufacturing thereof
12/13/2006	EP1730774A2 Integrated circuit stacking system and method
12/13/2006	EP1730712A2 Apparatus and method of power control
12/13/2006	EP1730506A1 An integrated electronic sensor
12/13/2006	EP1425800B1 Image sensor with recessed planarizing layers and method for making same
12/13/2006	EP1386327B1 Interface materials and methods of production and use thereof
12/13/2006	EP1344440B1 Electromagnetic noise reduction device
12/13/2006	EP1287558B1 Component assembly and method for producing the same
12/13/2006	EP1149391B1 Multi-track integrated spiral inductor
12/13/2006	EP1127031B1 High performance embedded rf filters
12/13/2006	CN2847817Y Water cool heat radiation system
12/13/2006	CN2847535Y Led发光体 Led luminous body
12/13/2006	CN2847533Y Image sensor structure with connector
12/13/2006	CN2847532Y Image senser structure capable of sharing substrate
12/13/2006	CN2847531Y Water cooling type parallel flow path heat radiation structure
12/13/2006	CN2847530Y Heat pipe radiator and its radiation fin
12/13/2006	CN2847529Y Combining structure for heat radiation fin
12/13/2006	CN2847528Y Heat radiator buckle
12/13/2006	CN2847527Y Heat radiation fin
12/13/2006	CN2847526Y Heat rediator
12/13/2006	CN2847525Y Protective structure for naked wafer package
12/13/2006	CN1879268A High-frequency signal transmitting optical module and method of fabricating the same
12/13/2006	CN1879222A Trench gate field effect devices
12/13/2006	CN1879217A Electric motor and method for producing said motor
12/13/2006	CN1879216A Bipolar and CMOS integration with reduced contact height
12/13/2006	CN1879215A Heat sink assembly
12/13/2006	CN1879214A Micropin heat exchanger
12/13/2006	CN1879213A Substrate for mounting semiconductor
12/13/2006	CN1879212A 二极管 Diode
12/13/2006	CN1879208A I/O sites for probe test and wire bond
12/13/2006	CN1879202A Zeolite-carbon doped oxide composite low K dielectric
12/13/2006	CN1878996A Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator
12/13/2006	CN1878713A Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
12/13/2006	CN1878456A Heat conductive caulking pad with composite structure
12/13/2006	CN1878455A Heat radiation member usable with a card type electronic component and display apparatus having the same
12/13/2006	CN1878451A Heat radiator
12/13/2006	CN1877974A High current switching circuit for a motor drive three phase inverter for mobile equipment
12/13/2006	CN1877876A Light emitting diode and packaging method therefor
12/13/2006	CN1877844A Repairing structure and active component array substrate
12/13/2006	CN1877842A Semiconductor device and manufacture method thereof
12/13/2006	CN1877837A Electrooptic device and manufacture thereof
12/13/2006	CN1877836A Integrated circuit and related method of modifying a version number assigned to the integrated circuit
12/13/2006	CN1877835A Semiconductor device and writing method for semiconductor device
12/13/2006	CN1877834A Semiconductor integrated circuit device and method for fabricating the same
12/13/2006	CN1877833A U-grooved integrated chip and method for fabricating same
12/13/2006	CN1877829A Semiconductor device and method for manufacturing semiconductor device
12/13/2006	CN1877828A Radiator
12/13/2006	CN1877827A Heat sink and plasma display device with heat sink
12/13/2006	CN1877826A Fixing structure for heat-conducting block
12/13/2006	CN1877825A Heat sink structure of medical apparatus
12/13/2006	CN1877824A Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
12/13/2006	CN1877823A Process for preparing silumin electronic package materials
12/13/2006	CN1877822A Process for preparing silumin electronic package materials
12/13/2006	CN1877821A Process for preparing silumin electronic package materials
12/13/2006	CN1877814A Method for forming a semiconductor device
12/13/2006	CN1877813A Method for forming a semiconductor device
12/13/2006	CN1877810A Multilevel semiconductor devices and methods of manufacturing the same
12/13/2006	CN1877803A Semiconductor device and method for manufacturing the same
12/13/2006	CN1877802A Semiconductor package and its making method

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