| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/19/2006 | US7151051 Interconnect structure for an integrated circuit and method of fabrication |
| 12/19/2006 | US7151041 Methods of forming semiconductor circuitry |
| 12/19/2006 | US7151037 Processes of forming stacked resistor constructions |
| 12/19/2006 | US7151014 Underfilling process in a molded matrix array package using flow front modifying solder resist |
| 12/19/2006 | US7151012 Redistribution layer of wafer and the fabricating method thereof |
| 12/19/2006 | US7151011 Integrated circuit die having an interference shield |
| 12/19/2006 | US7151009 Method for manufacturing wafer level chip stack package |
| 12/19/2006 | US7150920 Metal-carbon composite powders |
| 12/19/2006 | US7150914 Heat spreader for emissive display device |
| 12/19/2006 | US7150811 Ion beam for target recovery |
| 12/19/2006 | US7150406 Thin electronic label and method for making same |
| 12/19/2006 | US7150313 Heat dissipation device |
| 12/19/2006 | US7150312 Stacked low profile cooling system and method for making same |
| 12/14/2006 | WO2006133318A1 Carbon nanotube interconnect contacts |
| 12/14/2006 | WO2006133117A2 Quantum-dot cellular automata methods and devices |
| 12/14/2006 | WO2006132957A2 Integrated electronic circuitry and heat sink |
| 12/14/2006 | WO2006132822A2 Method for making electronic devices |
| 12/14/2006 | WO2006132803A2 Reduced inductance interconnect for enhanced microwave and millimeter-wave systems |
| 12/14/2006 | WO2006132253A1 Thermally conductive oil composition, heat radiating agent and electronic equipment |
| 12/14/2006 | WO2006132168A1 Electronic component package, method for manufacturing the same, and lid material for electronic component package |
| 12/14/2006 | WO2006132151A1 Interposer and semiconductor device |
| 12/14/2006 | WO2006132130A1 Semiconductor device, substrate and semiconductor device manufacturing method |
| 12/14/2006 | WO2006132087A1 Metal-ceramic composite substrate and method for manufacturing same |
| 12/14/2006 | WO2006132063A1 Multilayer substrate and semiconductor package |
| 12/14/2006 | WO2006131776A1 Leadframe, semiconductor package and methods of producing the same |
| 12/14/2006 | WO2006104525A3 Esd foam ground clip |
| 12/14/2006 | WO2006101861A3 Microelectronic packages and methods therefor |
| 12/14/2006 | WO2006101769A3 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom |
| 12/14/2006 | WO2006036447A3 A compact scr device and method for integrated circuits |
| 12/14/2006 | WO2006007144A3 Scribe street structure in semiconductor wafer |
| 12/14/2006 | WO2005122253A3 PE-ALD OF TaN DIFFUSION BARRIER REGION ON LOW-K MATERIALS |
| 12/14/2006 | US20060282804 Novel test structure for automatic dynamic negative-bias temperature instability testing |
| 12/14/2006 | US20060281337 Method and apparatus for forming silicon oxide film |
| 12/14/2006 | US20060281334 Method for forming high-resolution pattern and substrate having prepattern formed thereby |
| 12/14/2006 | US20060281333 Method for forming high-resolution pattern with direct writing means |
| 12/14/2006 | US20060281332 Structure for a semiconductor arrangement and a method of manufacturing a semiconductor arrangement |
| 12/14/2006 | US20060281328 Compound semiconductor substrate, epitaxial substrate, processes for producing compound semiconductor substrate, and epitaxial substrate |
| 12/14/2006 | US20060281304 Semiconductor device and method of manufacturing the same |
| 12/14/2006 | US20060281302 Semiconductor damascene trench and methods thereof |
| 12/14/2006 | US20060281299 Method of fabricating silicon carbide-capped copper damascene interconnect |
| 12/14/2006 | US20060281297 Multilayer electronic part and structure for mounting multilayer electronic part |
| 12/14/2006 | US20060281294 Method of forming a penetration electrode and substrate having a penetration electrode |
| 12/14/2006 | US20060281290 Semiconductor device and method of manufacturing the same |
| 12/14/2006 | US20060281269 Method and structure of an auxiliary transistor arrangement used for fabricating a semiconductor memory device |
| 12/14/2006 | US20060281235 Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display |
| 12/14/2006 | US20060281231 Semiconductor module |
| 12/14/2006 | US20060281228 Lead-frame type semiconductor package and lead frame thereof |
| 12/14/2006 | US20060281227 Bond method and structure using selective application of spin on glass |
| 12/14/2006 | US20060281224 Compliant passivated edge seal for low-k interconnect structures |
| 12/14/2006 | US20060281220 Semiconductor device packaging substrate and semiconductor device packaging structure |
| 12/14/2006 | US20060281215 Solid-state imaging device and method for manufacturing the same |
| 12/14/2006 | US20060281200 Method and system for using pattern matching to process an integrated circuit design |
| 12/14/2006 | US20060281198 Pattern drawing system, electrically charged beam drawing method, photomask manufacturing method, and semiconductor device manufacturing method |
| 12/14/2006 | US20060279941 Non-contact id card and manufacturing method thereof |
| 12/14/2006 | US20060279940 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors |
| 12/14/2006 | US20060279930 Cooling apparatus of liquid-cooling type |
| 12/14/2006 | US20060279735 Application of 2-dimensional photonic crystals in alignment devices |
| 12/14/2006 | US20060279361 Power amplifier having high heat dissipation |
| 12/14/2006 | US20060279300 Probe Card Assembly And Kit |
| 12/14/2006 | US20060279201 Droplet discharge method, electro optical device and electronic apparatus |
| 12/14/2006 | US20060279200 Droplet discharge method, electro-optic device, and electronic apparatus |
| 12/14/2006 | US20060279004 Mold, pattern forming method, and pattern forming apparatus |
| 12/14/2006 | US20060279003 Semiconductor device having an alignment mark formed by the same material with a metal post |
| 12/14/2006 | US20060279002 Protected chip stack |
| 12/14/2006 | US20060279001 Semiconductor device and manufacturing method therefor |
| 12/14/2006 | US20060279000 Pre-solder structure on semiconductor package substrate and method for fabricating the same |
| 12/14/2006 | US20060278999 Substrate for Pre-Soldering Material and Fabrication Method Thereof |
| 12/14/2006 | US20060278998 Integrated electronic chip and interconnect device and process for making the same |
| 12/14/2006 | US20060278997 Soldered assemblies and methods of making the same |
| 12/14/2006 | US20060278995 Chip spanning connection |
| 12/14/2006 | US20060278994 Inverse chip connector |
| 12/14/2006 | US20060278993 Chip connector |
| 12/14/2006 | US20060278991 Stack circuit member and method |
| 12/14/2006 | US20060278990 Etch stop in a damascene interconnect structure |
| 12/14/2006 | US20060278989 Triaxial through-chip connection |
| 12/14/2006 | US20060278988 Profiled contact |
| 12/14/2006 | US20060278987 Integrated circuit having a programmable conductive path on each conductive layer and related method of modifying a version number assigned to the integrated circuit |
| 12/14/2006 | US20060278986 Chip capacitive coupling |
| 12/14/2006 | US20060278985 Multilevel semiconductor devices and methods of manufacturing the same |
| 12/14/2006 | US20060278984 Semiconductor device |
| 12/14/2006 | US20060278983 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus |
| 12/14/2006 | US20060278982 Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump |
| 12/14/2006 | US20060278981 Electronic chip contact structure |
| 12/14/2006 | US20060278980 Patterned contact |
| 12/14/2006 | US20060278979 Die stacking recessed pad wafer design |
| 12/14/2006 | US20060278978 Semiconductor component with a media channel and method for manufacturing same |
| 12/14/2006 | US20060278977 Carrier to hold semiconductor device using opposed rollers |
| 12/14/2006 | US20060278976 Semiconductor device, method and manufacturing same, identification label and information carrier |
| 12/14/2006 | US20060278975 Ball grid array package with thermally-enhanced heat spreader |
| 12/14/2006 | US20060278974 Method for forming wafer-level heat spreader structure and package structure thereof |
| 12/14/2006 | US20060278973 Semiconductor device with improved design freedom of external terminal |
| 12/14/2006 | US20060278972 Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
| 12/14/2006 | US20060278971 Method and apparatus for applying external coating to grid array packages for increased reliability and performance |
| 12/14/2006 | US20060278970 Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device |
| 12/14/2006 | US20060278969 Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods |
| 12/14/2006 | US20060278968 Laminated semiconductor package |
| 12/14/2006 | US20060278967 Method for manufacturing an electronic module and an electronic module |
| 12/14/2006 | US20060278966 Contact-based encapsulation |
| 12/14/2006 | US20060278965 Hermetically sealed package and methods of making the same |
| 12/14/2006 | US20060278964 Plastic integrated circuit package, leadframe and method for use in making the package |