H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/20/2006	EP1497862B1 Semiconductor component comprising an integrated latticed capacitance structure
12/20/2006	EP1488284B1 Photomask and method for photolithographic patterning of a substrate by use of phase shifted assist features
12/20/2006	EP0988650B1 Method of manufacturing semiconductor devices with "chip size package"
12/20/2006	CN2850134Y Rectifying bridge arm
12/20/2006	CN2850063Y Processor socket with buffer and heat radiating effect
12/20/2006	CN2849979Y High heat radiation LED module
12/20/2006	CN2849971Y Protective structure of photosensitive chip
12/20/2006	CN2849968Y Riveting structure of IC lead frame
12/20/2006	CN2849967Y Lug joining structure
12/20/2006	CN2849966Y Liquid cooler for integrated computer chip
12/20/2006	CN2849965Y Fastening structure of fastener for radiator
12/20/2006	CN2849964Y Combined radiating fin
12/20/2006	CN2849963Y Semiconductor cooling radiator
12/20/2006	CN2849962Y Radiator
12/20/2006	CN2849961Y Structure of radiating fin
12/20/2006	CN2849960Y Substrate structure of electronic device packaged by liquid resin
12/20/2006	CN2849680Y Electronic circuit apparatus
12/20/2006	CN1883049A Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step
12/20/2006	CN1883048A Customized microelectronic device and method for making customized electrical interconnections
12/20/2006	CN1883018A High frequency thin film electrical circuit element
12/20/2006	CN1882655A 固化性树脂组合物 Curable resin composition
12/20/2006	CN1882237A Loop type heat-exchange device
12/20/2006	CN1882220A Wiring board and method for manufacturing the same
12/20/2006	CN1882218A Substrate with composite medium and multilayer substrate made by the same
12/20/2006	CN1881638A Light source with improved life
12/20/2006	CN1881603A CMOS image sensor and method for fabrication thereof
12/20/2006	CN1881598A Electromagnetic radiation detection device, radiation detection device and system, and laser processing method
12/20/2006	CN1881591A Ferroelectric memory and method for manufacturing same
12/20/2006	CN1881587A Semiconductor device and fabrication process thereof
12/20/2006	CN1881585A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/20/2006	CN1881584A Semiconductor integrated circuit device, electronic part mounting plate and layout design method thereof
12/20/2006	CN1881583A Semiconductor device, method of manufacturing the same, and information managing system for the same
12/20/2006	CN1881582A Esd protection circuit and semiconductor structure
12/20/2006	CN1881580A Layout structure for ESD protection circuits
12/20/2006	CN1881579A Light emitting apparatus
12/20/2006	CN1881578A Laminated semiconductor package
12/20/2006	CN1881577A Semiconductor device and method of fabricating the same
12/20/2006	CN1881576A Reprogrammable fuse structure and method
12/20/2006	CN1881575A Electronic member
12/20/2006	CN1881574A Wiring substrate
12/20/2006	CN1881573A Semiconductor device and manufacturing method of the same
12/20/2006	CN1881572A Semiconductor device and manufacturing method of the same
12/20/2006	CN1881571A Heat radiation structure of integrated circuit chip of plasma display module and plasma display module including the same
12/20/2006	CN1881570A Integrated circuit package encapsulating a hermetically sealed device
12/20/2006	CN1881559A Low inductance via structures
12/20/2006	CN1881558A Dual mosaic structure, interconnect structure and methods for fabricating the same
12/20/2006	CN1881557A Protective structure on a top metal line on semiconductor interconnect structure and forming method thereof
12/20/2006	CN1881553A Electronic component,semiconductor device and method of making the same, circuit board, and electronic instrument
12/20/2006	CN1881543A Method and apparatus for forming silicon oxide film and program
12/20/2006	CN1881542A Substrate processing method,computer-readable recording medium and substrate processing device
12/20/2006	CN1881537A Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
12/20/2006	CN1881535A Semiconductor device having through electrode and method of manufacturing the same
12/20/2006	CN1881241A Non-contact data carrier and method of fabricating the same
12/20/2006	CN1881126A Power integrated circuit and electrostatic discharge protection method thereof
12/20/2006	CN1880775A Radiating mould assembly with double fan
12/20/2006	CN1879552A Soft physiological signal monitoring device
12/20/2006	CN1291629C An electronic assembly and a method of constructing an electronic assembly
12/20/2006	CN1291495C Semiconductor device
12/20/2006	CN1291493C Anti-static protective circuit for luminous tube
12/20/2006	CN1291492C Semiconductor switch circuit device and making method therefor
12/20/2006	CN1291491C Semiconductor unit and method for making the same
12/20/2006	CN1291490C Semiconductor device and camera assembly for small electronic apparatus
12/20/2006	CN1291489C Power amplifier with radiator
12/20/2006	CN1291488C Press in sealed electronic part and its producing method
12/20/2006	CN1291487C Semiconductor device and its making method, and electronic device with the same
12/20/2006	CN1291480C Manufacturing method of semiconductor device and semiconductor device
12/20/2006	CN1291476C Virtual pattern on integrated circuit
12/20/2006	CN1291466C Semiconductor package method with heat sink
12/20/2006	CN1291456C Semiconductor device and method for manufacturing the same, circuit board, electrooptical device and electronic instrument
12/20/2006	CN1291346C System for providing an open-cavity low profile encapsulated semiconductor package
12/20/2006	CN1291296C Diameter-variable support of CPU radiator fan
12/20/2006	CN1291069C Technology for electrolyzing and manufacturing micro-gap counter-assembled welding projects
12/20/2006	CN1290963C Phase change thermal interface composition having induced bonding property
12/19/2006	US7152215 Dummy fill for integrated circuits
12/19/2006	US7151674 Mold-type electronic control unit
12/19/2006	US7151671 Power supply
12/19/2006	US7151669 Configurable heat sink with matrix clipping system
12/19/2006	US7151429 Inductor element having a high quality factor
12/19/2006	US7151426 Latching micro magnetic relay packages and methods of packaging
12/19/2006	US7151387 Analysis module, integrated circuit, system and method for testing an integrated circuit
12/19/2006	US7151321 Laminated electronic component
12/19/2006	US7151320 Semiconductor device with improved design freedom of external terminal
12/19/2006	US7151319 Semiconductor device
12/19/2006	US7151318 Semiconductor component and method for contacting said semiconductor component
12/19/2006	US7151317 Multi-chip package structure
12/19/2006	US7151316 Semiconductor device
12/19/2006	US7151315 Method of a non-metal barrier copper damascene integration
12/19/2006	US7151314 Semiconductor device with superimposed poly-silicon plugs
12/19/2006	US7151313 Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment
12/19/2006	US7151312 Semiconductor device and method of manufacturing the same
12/19/2006	US7151311 Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer
12/19/2006	US7151310 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
12/19/2006	US7151309 Apparatus for improved power distribution in wirebond semiconductor packages
12/19/2006	US7151308 Semiconductor chip package
12/19/2006	US7151306 Electronic part, and electronic part mounting element and an process for manufacturing such the articles
12/19/2006	US7151298 Electrostatic discharge protection network having distributed components
12/19/2006	US7151288 Semiconductor device and method of manufacturing the same
12/19/2006	US7151229 Printed circuit board with improved cooling of electrical component
12/19/2006	US7151053 Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications
12/19/2006	US7151052 Multiple etch-stop layer deposition scheme and materials

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