H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/21/2006	WO2005089477A3 Direct cooling of leds
12/21/2006	WO2005045997A3 An electrical circuit assembly with improved shock resistance
12/21/2006	US20060286828 Contact Structures Comprising A Core Structure And An Overcoat
12/21/2006	US20060286816 Method for fabricating semiconductor device and semiconductor device
12/21/2006	US20060286815 Interlayer insulating film formation method and film structure of interlayer insulating film
12/21/2006	US20060286813 Silica and silica-like films and method of production
12/21/2006	US20060286794 Stacked structure for forming damascene structure, method of fabricating the stacked structure, and damascene process
12/21/2006	US20060286793 Stacked structure for forming damascene structure, method of fabricating the stacked structure, and damascene process
12/21/2006	US20060286791 Semiconductor wafer package and manufacturing method thereof
12/21/2006	US20060286789 Semiconductor device having through electrode and method of manufacturing the same
12/21/2006	US20060286788 Method for making a wire nanostructure in a semiconductor film
12/21/2006	US20060286787 Method of manufacturing semiconductor device and semiconductor device
12/21/2006	US20060286731 Method of fabricating conductive lines and structure of the same
12/21/2006	US20060286716 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
12/21/2006	US20060286714 Semiconductor device and system having semiconductor device mounted thereon
12/21/2006	US20060286712 Thermal interface with a patterned structure
12/21/2006	US20060286701 Apparatus for inspecting alignment film and method for fabricating liquid crystal display device using the same
12/21/2006	US20060286688 Integrated circuitry and method for manufacturing the same
12/21/2006	US20060286388 Anodically bonded stack of two conductive ceramic components separated by an intermediate film at low temperatures wherein a transition layer is formed
12/21/2006	US20060285295 Heat-dissipating device and a housing thereof
12/21/2006	US20060284324 Power-up and power-down circuit for system-on-a-chip integrated circuit
12/21/2006	US20060284323 Electronic board, method of manufacturing the same, and electronic device
12/21/2006	US20060284322 Electronic board, method of manufacturing the same, and electronic device
12/21/2006	US20060284321 LED structure for flip-chip package and method thereof
12/21/2006	US20060284320 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
12/21/2006	US20060284319 Chip-on-board assemblies
12/21/2006	US20060284318 Semiconductor device and method for fabricating the same
12/21/2006	US20060284317 Semiconductor device and a fabrication process thereof
12/21/2006	US20060284316 Chip size package
12/21/2006	US20060284315 Semiconductor device and circuit board
12/21/2006	US20060284314 Multi-package module and electronic device using the same
12/21/2006	US20060284313 Low stress chip attachment with shape memory materials
12/21/2006	US20060284312 Flip chip packaging using recessed interposer terminals
12/21/2006	US20060284311 Method of manufacturing self-aligned contact openings and semiconductor device
12/21/2006	US20060284310 Offset via on pad
12/21/2006	US20060284309 Integrated circuit package and integrated circuit module
12/21/2006	US20060284308 Power converter and semiconductor device mounting structure
12/21/2006	US20060284307 Component with sensitive component structures and method for the production thereof
12/21/2006	US20060284306 Multi-chip type semiconductor device
12/21/2006	US20060284305 Packaging base for semiconductor elements
12/21/2006	US20060284304 Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
12/21/2006	US20060284303 Light-emitting device and light source apparatus using the same
12/21/2006	US20060284302 Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit
12/21/2006	US20060284301 CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies
12/21/2006	US20060284300 Module with built-in component and method for manufacturing module
12/21/2006	US20060284299 Module Having Stacked Chip Scale Semiconductor Packages
12/21/2006	US20060284298 Chip stack package having same length bonding leads
12/21/2006	US20060284297 Memory card stack circuit wiring structure
12/21/2006	US20060284296 Semiconductor device
12/21/2006	US20060284295 Method and system for hermetically sealing packages for optics
12/21/2006	US20060284294 Optical device package
12/21/2006	US20060284293 Semiconductor integrated circuit and device and method for testing the circuit
12/21/2006	US20060284292 Package structure of chip and the package method thereof
12/21/2006	US20060284291 Lead frame structure with aperture or groove for flip chip in a leaded molded package
12/21/2006	US20060284290 Chip-package structure and fabrication process thereof
12/21/2006	US20060284289 Electronic component comprising a cooling surface
12/21/2006	US20060284288 Wafer and single chip having circuit rearranged structure and method for fabricating the same
12/21/2006	US20060284287 Two-pole smt miniature housing for semiconductor components and method for the manufacture thereof
12/21/2006	US20060284286 Flashless molding of integrated circuit devices
12/21/2006	US20060284285 Manufacturing method for a semiconductor device, semiconductor device, circuit substrate and electronic device
12/21/2006	US20060284276 High voltage semiconductor devices with JFET regions containing dielectrically isolated junctions
12/21/2006	US20060284258 Divided drain implant for improved CMOS ESD performance
12/21/2006	US20060284257 Display substrate and apparatus and method for testing display panel having the same
12/21/2006	US20060284256 Layout structure for ESD protection circuits
12/21/2006	US20060284247 Novel method for integrating silicon CMOS and AlGaN/GaN wideband amplifiers on engineered substrates
12/21/2006	US20060284175 Thin-film semiconductor substrate, method of manufacturing thin-film semiconductor substrate, method of crystallization, apparatus for crystallization, thin-film semiconductor device, and method of manufacturing thin-film semiconductor device
12/21/2006	US20060284174 Arrangement for testing semiconductor chips while incorporated on a semiconductor wafer
12/21/2006	US20060284173 Method to test shallow trench isolation fill capability
12/21/2006	US20060283845 Laser processing
12/21/2006	US20060283624 Method and apparatus for providing hermetic electrical feedthrough
12/21/2006	US20060283005 Conductive pattern and method of making
12/21/2006	DE19903028B4 MOS-Halbleiteranordnung MOS semiconductor device
12/21/2006	DE10318299B4 Verfahren zur Bildung einer Doppeldamaszener-Zwischenverbindung A method of forming a dual damascene interconnect
12/21/2006	DE102006025613A1 Temperatursensor Temperature sensor
12/21/2006	DE102006011473A1 Verfahren zum MCP-Häusen für eine ausgeglichene Leistung A method for MCP-housings for balanced performance
12/21/2006	DE102005027366A1 Monolithisch integrierte Halbleiteranordnung mit einem Leistungsbauelement und Verfahren zur Herstellung einer monolithisch integrierten Halbleiteranordnung Monolithic integrated semiconductor arrangement having a power component and method for manufacturing a monolithically integrated semiconductor arrangement
12/21/2006	DE102005026528A1 Halbleiterbauteil mit Medienkanal und Verfahren zur Herstellung desselben Of the same semiconductor device with media channel and methods for preparing
12/21/2006	DE102005026435B3 Eine Speicherkarte, ihre Herstellung und eine Mobiltelefonvorrichtung mit einer Speicherkarte A memory card, its preparation and a mobile phone device with a memory card
12/21/2006	DE102005026241A1 Electrical component, e.g. a thermistor, has a ceramic base body and connections using wires with insulation shrouding melted by soldering
12/21/2006	DE102005026233A1 Electrical power module for use in e.g. frequency converter, has mechanical catch device fixed on printed circuit board, and isolation bar electrically isolating external component from board and pin
12/21/2006	DE102005008476B4 Leitbahnanordnung sowie zugehöriges Herstellungsverfahren Interconnect arrangement and manufacturing method thereof
12/21/2006	DE102004062835B4 Verfahren zum Bilden einer Dual-Damascene-Struktur A method of forming a dual damascene structure
12/21/2006	DE10126565B4 Vorrichtung zum Ableiten von Wärme aus einer integrierten Schaltung An apparatus for removing heat from an integrated circuit
12/21/2006	DE10004830B4 Hochfrequenzfeste wärmehärtende Beschichtungen und daraus hergestellte hochfrequenzfeste Emaildrähte RF Fixed thermosetting coatings and high frequency solid wires Email prepared therefrom
12/21/2006	CA2611620A1 Hybrid conductive coating method for electrical bridging connection of rfid die chip to composite antenna
12/21/2006	CA2611381A1 B-stageable film, electronic device, and associated process
12/20/2006	EP1734801A1 Packaging method of electronic component
12/20/2006	EP1734581A1 Laminated semiconductor package
12/20/2006	EP1734580A2 Wiring board with core board having a ceramic sub-core and method for manufacturing the same
12/20/2006	EP1734579A2 Semiconductor device and manufacturing method of the same
12/20/2006	EP1734578A1 Cooled electronic assembly and method for cooling a printed circuit board
12/20/2006	EP1734577A1 Cooling device and semiconductor module with such a cooling device
12/20/2006	EP1734576A1 Semiconductor device having through electrode and method of manufacturing the same
12/20/2006	EP1734571A1 Thermal processing equipment calibration method
12/20/2006	EP1734569A1 Process for producing semiconductor module
12/20/2006	EP1734338A1 Angular speed measuring equipment
12/20/2006	EP1733428A1 Integrated circuit protected by an active shielding
12/20/2006	EP1733427A1 Overmolded semiconductor package with an integrated emi and rfi shield
12/20/2006	EP1733424A1 A semiconductor apparatus
12/20/2006	EP1558403A4 Thermally conductive emi shield

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