H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/27/2006	CN1292476C Heat sink machining process
12/27/2006	CN1292475C Semiconductor package and making method thereof
12/27/2006	CN1292474C Package for electronic parts, lid thereof, material for the lid and method for producing the lid material
12/27/2006	CN1292469C Semiconductor device and its manufacture method
12/27/2006	CN1292462C Multi-layer circuit board and mfg method, electronic device and electronic apparatus
12/27/2006	CN1292459C Method for forming transparent electrode membrane
12/27/2006	CN1292457C Temperature calibration method for heating processing apparatus, adjustment method for development processing apparatus, and method of manufacturing semiconductor apparatus
12/27/2006	CN1292456C Photomask group of forming multilayer interlconnection line and semiconductor device made by such photomask
12/27/2006	CN1292447C MEMS device having a trilayered beam
12/27/2006	CN1292099C Apparatus for plating treatment
12/26/2006	US7155695 Signal shielding technique using active shields for non-interacting driver design
12/26/2006	US7155686 Placement and routing method to reduce Joule heating
12/26/2006	US7155684 Integrated circuit device and method for forming the same
12/26/2006	US7155197 High-frequency module and communication apparatus
12/26/2006	US7154760 Power amplifier module
12/26/2006	US7154758 Method and semi-product for producing a chip card with a coil
12/26/2006	US7154751 Interface module-mounted LSI package
12/26/2006	US7154724 Output buffer ESD protection using parasitic SCR protection circuit for CMOS VLSI integrated circuits
12/26/2006	US7154721 Electrostatic discharge input protection circuit
12/26/2006	US7154374 Plated terminations
12/26/2006	US7154356 Radio frequency (RF) circuit board topology
12/26/2006	US7154354 High permeability layered magnetic films to reduce noise in high speed interconnection
12/26/2006	US7154206 Surface acoustic wave device and method for manufacturing same
12/26/2006	US7154189 Semiconductor device and method for fabricating the same
12/26/2006	US7154188 Semiconductor chip, semiconductor device, circuit board, and electronic instrument
12/26/2006	US7154187 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
12/26/2006	US7154186 Multi-flip chip on lead frame on over molded IC package and method of assembly
12/26/2006	US7154185 Encapsulation method for SBGA
12/26/2006	US7154184 Interconnection structure of semiconductor device
12/26/2006	US7154183 Semiconductor device having multilevel interconnection
12/26/2006	US7154182 Localized slots for stress relieve in copper
12/26/2006	US7154181 Semiconductor device and method of manufacturing the same
12/26/2006	US7154180 Electronic device, method of manufacture of the same, and sputtering target
12/26/2006	US7154179 Semiconductor device
12/26/2006	US7154178 Multilayer diffusion barrier for copper interconnections
12/26/2006	US7154176 Conductive bumps with non-conductive juxtaposed sidewalls
12/26/2006	US7154175 Ground plane for integrated circuit package
12/26/2006	US7154174 Power supply packaging system
12/26/2006	US7154173 Semiconductor device and manufacturing method of the same
12/26/2006	US7154172 Integrated circuit carrier
12/26/2006	US7154171 Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
12/26/2006	US7154170 Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
12/26/2006	US7154169 Substrate for IC package
12/26/2006	US7154168 Flip chip in leaded molded package and method of manufacture thereof
12/26/2006	US7154166 Low profile ball-grid array package for high power
12/26/2006	US7154165 Flashless lead frame with horizontal singulation
12/26/2006	US7154164 Semiconductor integrated circuit device and process for manufacturing the same
12/26/2006	US7154162 Integrated circuit capacitor structure
12/26/2006	US7154161 Composite ground shield for passive components in a semiconductor die
12/26/2006	US7154160 Semiconductor fuse box and method for fabricating the same
12/26/2006	US7154156 Solid-state imaging device and method for producing the same
12/26/2006	US7154152 Semiconductor device
12/26/2006	US7154151 Semiconductor device
12/26/2006	US7154150 Low triggering N MOS transistor for ESD protection working under fully silicided process without silicide blocks
12/26/2006	US7154149 EDS protection configuration and method for light emitting diodes
12/26/2006	US7154139 Embedded capacitors using conductor filled vias
12/26/2006	US7154132 Semiconductor device with dummy electrode
12/26/2006	US7154123 Nitride-based semiconductor light-emitting device
12/26/2006	US7154116 Rewiring substrate strip with a number of semiconductor component positions
12/26/2006	US7154115 Zoom in pin nest structure, test vehicle having the structure, and method of fabricating the structure
12/26/2006	US7154053 Optoelectronic package with wire-protection lid
12/26/2006	US7154048 Common electrode wire for plating
12/26/2006	US7154047 Via structure of packages for high frequency semiconductor devices
12/26/2006	US7154046 Flexible dielectric electronic substrate and method for making same
12/26/2006	US7153773 TiSiN film forming method, diffusion barrier TiSiN film, semiconductor device, method of fabricating the same and TiSiN film forming system
12/26/2006	US7153766 Metal barrier cap fabrication by polymer lift-off
12/26/2006	US7153754 Forming a layer of organic polymer on a semiconductor device structure;polymerizing the organic polymer to form solid matrix; forming voids in the organic polymer, includingembedding microcapsule, exposing the semiconductor device structure to a catalyst to substantially remove the filler
12/26/2006	US7153727 Semiconductor device and method of manufacturing the same
12/26/2006	US7153726 Semiconductor device with magnetically permeable heat sink
12/26/2006	US7153725 Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
12/26/2006	US7153724 Method of fabricating no-lead package for semiconductor die with half-etched leadframe
12/26/2006	US7153712 Electrically-programmable integrated circuit fuses and sensing circuits
12/26/2006	US7153589 Composed of 20 to 95% of tungsten and balance of molybdenum and inevitable impurities by atomic percentage; low resistivity and high workability; liquid crystal display
12/26/2006	US7153580 Low κ dielectric inorganic/organic hybrid films and method of making
12/26/2006	US7153462 Injection casting system for encapsulating semiconductor devices and method of use
12/26/2006	US7153143 Circuit carrier and production thereof
12/26/2006	US7153042 Optic device
12/26/2006	US7152667 Tower type finned heat pipe type heat sink
12/26/2006	US7152666 Heat sink
12/26/2006	US7152319 Method of making high speed circuit board
12/26/2006	US7152316 Hybrid integrated circuit device and method of manufacturing the same
12/26/2006	US7152313 Package substrate for integrated circuit and method of making the substrate
12/26/2006	US7152291 Method for forming plated terminations
12/21/2006	WO2006135926A1 Fabrication of high thermal conductivity arrays of carbon nanotubes and their composites
12/21/2006	WO2006135874A2 Dfn semiconductor package having reduced electrical resistance
12/21/2006	WO2006135643A1 Hybrid conductive coating method for electrical bridging connection of rfid die chip to composite antenna
12/21/2006	WO2006135502A1 High power solid-state lamp
12/21/2006	WO2006135337A1 Semiconductor nanowire vertical device architecture
12/21/2006	WO2006134977A1 Multilayer printed wiring board
12/21/2006	WO2006134914A1 Printed wiring board
12/21/2006	WO2006134897A1 Semiconductor integrated circuit device
12/21/2006	WO2006134858A1 Heat dissipating graphite sheet and electronic device using same
12/21/2006	WO2006134534A1 Layer sequence and method of manufacturing a layer sequence
12/21/2006	WO2006134316A1 A heat dissipating fan
12/21/2006	WO2006134217A1 Method for manufacturing a circuit board structure, and a circuit board structure
12/21/2006	WO2006134216A2 Circuit board structure and method for manufacturing a circuit board structure
12/21/2006	WO2006133664A1 Power semiconductor component stack of planar conductor design with surface-mountable outer contacts and a method for production thereof
12/21/2006	WO2006100690A3 Selectively grooved cold plate for electronics cooling
12/21/2006	WO2006037056A3 Stacked die module
12/21/2006	WO2006036548A3 Method of forming a semiconductor package and structure thereof

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