| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 12/28/2006 | US20060289863 Semiconductor device evaluation apparatus and semiconductor device evaluation method |
| 12/28/2006 | US20060289862 Systems and methods for thermal sensing |
| 12/28/2006 | US20060289861 Systems and arrangements to interconnect components of a semiconductor device |
| 12/28/2006 | US20060289429 Drive circuit board and flat panel display apparatus having the same |
| 12/28/2006 | US20060289384 Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal |
| 12/28/2006 | US20060289203 Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring board |
| 12/28/2006 | US20060288826 Method of preparing terminal board |
| 12/28/2006 | US20060288567 Sacrificial component |
| 12/28/2006 | US20060288563 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 12/28/2006 | DE112004001102T5 Verfahren zur Steuerung der Planheit und der Elektronenbeweglichkeit von mit Diamant beschichtetem Silizium und dadurch gebildeten Strukturen Method for controlling the flatness and the electron mobility of silicon coated with diamond and structures formed thereby |
| 12/28/2006 | DE10333840B4 Halbleiterbauteil mit einem Kunststoffgehäuse, das eine Umverdrahrungsstruktur aufweist und Verfahren zu deren Herstellung A semiconductor device comprising a plastic housing having a Umverdrahrungsstruktur and processes for their preparation |
| 12/28/2006 | DE10302623B4 Halbleiterstruktur mit einer reduzierten Anschlußkapazität sowie ein Verfahren zum Herstellen der Halbleiterstruktur Semiconductor structure having a reduced terminal capacity and a method for manufacturing the semiconductor structure |
| 12/28/2006 | DE102006022136A1 Halbleiterspeicherbauelement The semiconductor memory device |
| 12/28/2006 | DE102005029511A1 Device used in medical X-ray devices comprises screen consisting of at least two materials for absorbing X-ray radiation |
| 12/28/2006 | DE102005029495A1 Integrated power circuit for e.g. measuring on-state resistance of MOSFET, has power component with ports, and internal switch connecting ports of MOSFET with one internal circuit point that is connected with one external circuit point |
| 12/28/2006 | DE102005029464A1 Compensation signal generating device for compensating mechanical stress on semiconductor circuit, has evaluation mechanism providing compensation signal that is measure for mechanical stress acting on semiconductor circuit substrate |
| 12/28/2006 | DE102005028996A1 Electronic component e.g. temperature sensor, arranging method, involves arranging component in sleeve, and subsequently producing casing so that sleeve is surrounded by casing, where heat developed during casting is dissipated by sleeve |
| 12/28/2006 | DE102005028951A1 Anordnung zur elektrischen Verbindung einer Halbleiter-Schaltungsanordnung mit einer äusseren Kontakteinrichtung und Verfahren zur Herstellung derselben Arrangement for the electrical connection of a semiconductor circuit arrangement having an outer contact means and methods for making the same |
| 12/28/2006 | DE102005028919A1 Verfahren zum Herstellen eines elektronischen Bauelementes und elektronisches Bauelement A method of manufacturing an electronic component and electronic component |
| 12/28/2006 | DE102005028905A1 Transistor component for complementary MOS logic circuit, has substrate connecting contact arranged in substrate connecting region for conductively connecting substrate connecting region to supply voltage lead |
| 12/28/2006 | DE102005028704A1 Semiconductor device used in electronic apparatus, has adhesion promoter layer with microporous morphology between semiconductor device components and plastic compositions, and having nanoscale ceramic grains applied by wet chemical process |
| 12/28/2006 | DE102005028202A1 Production of silicon semiconductor wafers for fabrication of electronic components comprises controlling ratio of pulling rate to axial temperature gradient to produce agglomerated vacancy defects above critical size in single crystal |
| 12/28/2006 | DE102005027945A1 Verlustarmes elektrisches Bauelement mit einem Verstärker Low-loss electrical component with an amplifier |
| 12/28/2006 | DE102005027368A1 Halbleiterschutzstruktur für eine elektrostatische Entladung Semiconductor structure for electrostatic discharge |
| 12/28/2006 | DE102005024945A1 Semiconductor integrated circuit (IC) arrangement used in e.g. logic circuits, high-frequency (HF) amplifier circuits, has stress-compensated and low-resistant contact arrangement formed on semiconductor substrate for semiconductor circuit |
| 12/28/2006 | DE10059143B4 Oberflächenbehandlungs- und Deckschichtverfahren zur Herstellung einer Kupfergrenzfläche in einem Halbleiterbauteil Surface treatment and overcoat process for preparing a copper interface in a semiconductor device |
| 12/27/2006 | EP1737052A1 Heat adjustment device |
| 12/27/2006 | EP1737039A2 Semiconductor Package |
| 12/27/2006 | EP1737038A2 Circuitry component and method for forming the same |
| 12/27/2006 | EP1737037A2 Circuitry component and method for forming the same |
| 12/27/2006 | EP1737036A2 Semiconductor device and manufacturing method of the same |
| 12/27/2006 | EP1737035A1 Heat sink manufacturing method |
| 12/27/2006 | EP1737034A1 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE AND PROCESS FOR PRODUCING Al/AlN JOINT MATERIAL |
| 12/27/2006 | EP1737029A1 Substrate for device bonding and method for manufacturing same |
| 12/27/2006 | EP1736954A2 Semiconductor device |
| 12/27/2006 | EP1736760A2 Nanosensors |
| 12/27/2006 | EP1736520A1 Resin composition and semiconductor devices made by using the same |
| 12/27/2006 | EP1736500A1 Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor |
| 12/27/2006 | EP1735845A2 Housing for led chip and light source |
| 12/27/2006 | EP1735832A1 Semiconductor component comprising a counter signal circuit for preventing crosstalk between electronic subassemblies |
| 12/27/2006 | EP1735831A2 Manufacture of porous diamond films |
| 12/27/2006 | EP1735830A2 Multi-substrate circuit assembly |
| 12/27/2006 | EP1735829A1 Device and method for joining substrates |
| 12/27/2006 | EP1735684A2 Modular, scalable thermal solution |
| 12/27/2006 | EP1734915A2 COSMETIC FORMULATIONS COMPRISING ZnO NANOPARTICLES |
| 12/27/2006 | EP1668697A4 Electrical circuit apparatus and methods for assembling same |
| 12/27/2006 | EP1384738B1 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
| 12/27/2006 | EP1358489B1 Production process for accelerometer protected by caps applied at the wafer scale |
| 12/27/2006 | CN2852618Y Heat radiator |
| 12/27/2006 | CN2852617Y 散热器固定装置 Sink fixtures |
| 12/27/2006 | CN2852600Y 静电放电防护电路 Electrostatic discharge protection circuit |
| 12/27/2006 | CN2852487Y Thyratron valve set mechanical structure of horizontal static reactive-load compensator |
| 12/27/2006 | CN2852390Y Fixing mechanism for heat sink |
| 12/27/2006 | CN2852389Y Improved structure of integrated circuit heat vortex |
| 12/27/2006 | CN2852388Y Micro-spraying flow water-cooling device for light-emitting diode |
| 12/27/2006 | CN2852264Y Packaging casing for safety data card and small-sized safety data card |
| 12/27/2006 | CN2850584Y Freezing skin-softening cosmetic instrument |
| 12/27/2006 | CN1887036A Electric circuit arrangement |
| 12/27/2006 | CN1886874A Light-emitting semiconductor component comprising a protective diode |
| 12/27/2006 | CN1886873A Photoelectric element with heat sink |
| 12/27/2006 | CN1886834A Semiconductor device comprising electrostatic breakdown protection element |
| 12/27/2006 | CN1886833A 电容器 Capacitors |
| 12/27/2006 | CN1886832A Method and arrangement for shielding a component against electrostatic interference |
| 12/27/2006 | CN1886828A Method for galvanising and forming a contact boss |
| 12/27/2006 | CN1886807A Conductive paste for electrode layer of multilayer ceramic electronic component and method for producing multilayer unit for multilayer ceramic electronic component |
| 12/27/2006 | CN1886707A Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same |
| 12/27/2006 | CN1886665A A ground-signal-ground (GSG) test structure |
| 12/27/2006 | CN1886039A Electronic device |
| 12/27/2006 | CN1886024A Printed circuit board having embedded RF module power stage circuit |
| 12/27/2006 | CN1885851A Wireless local area network communications module and integrated chip package |
| 12/27/2006 | CN1885850A Wireless local area network communications module and integrated chip package |
| 12/27/2006 | CN1885649A Sheet metal frame cabinet for installing frame or cabinet and method for installing frame or cabinet |
| 12/27/2006 | CN1885580A Led package with metal reflection layer and method of manufacturing the same |
| 12/27/2006 | CN1885564A Thermal dissipation structures for FinFETs and manufacturing method thereof |
| 12/27/2006 | CN1885554A Method for manufacturing electronic component and electronic component |
| 12/27/2006 | CN1885549A Electro-optic display and manufacturing method thereof |
| 12/27/2006 | CN1885544A Semiconductor device |
| 12/27/2006 | CN1885541A ESD protection system and method for multi voltage signal |
| 12/27/2006 | CN1885539A 半导体集成电路装置 The semiconductor integrated circuit device |
| 12/27/2006 | CN1885538A Semiconductor device and fuse blowout method |
| 12/27/2006 | CN1885536A 半导体封装 The semiconductor package |
| 12/27/2006 | CN1885534A Semiconductor device, manufacturing method for semiconductor device, and electronic equipment |
| 12/27/2006 | CN1885533A Protection method and structure for ESD of compound semiconductor |
| 12/27/2006 | CN1885532A Circuitry component and method for forming the same |
| 12/27/2006 | CN1885531A Gold bonding wire and method for manufacturing same |
| 12/27/2006 | CN1885530A Heat radiation module |
| 12/27/2006 | CN1885529A Heat radiator of heat pipe |
| 12/27/2006 | CN1885528A Flip-chip packaging structure |
| 12/27/2006 | CN1885525A Through-wafer vias and surface metallization for coupling thereto |
| 12/27/2006 | CN1885516A Structure of electric connection pad |
| 12/27/2006 | CN1885514A Packaging arrangement of flip chip on thin film |
| 12/27/2006 | CN1885513A Tape for tape carrier package |
| 12/27/2006 | CN1885511A Thin film transistor substrate and method of manufacturing the same |
| 12/27/2006 | CN1885369A Glue sealing method and glue sealing structure for preventing moisture infiltration |
| 12/27/2006 | CN1292627C Circuit substrate |
| 12/27/2006 | CN1292492C Method of making semiconductor device having shield case, and shield case connection method |
| 12/27/2006 | CN1292491C Package structure and producing method thereof |
| 12/27/2006 | CN1292483C Semiconductor device and method of manufacturing the same |
| 12/27/2006 | CN1292478C Semiconductor integrated circuit apparatus |
| 12/27/2006 | CN1292477C Semiconductor device and mfg method thereof |