H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2006
12/28/2006	WO2006136984A2 Thin film circuit connections
12/28/2006	WO2006136893A1 Electronic module assembly with heat spreader
12/28/2006	WO2006136325A1 Heat exchanger for small components
12/28/2006	WO2006136123A1 Electronic module
12/28/2006	WO2006107365A3 Heat sink for multiple semiconductor modules
12/28/2006	WO2006096813A3 Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties
12/28/2006	WO2005122249A3 Semiconductor device module with flip chip devices on a common lead frame
12/28/2006	WO2005107345A3 Microelectronic connection components having bondable wires
12/28/2006	WO2004082180A3 Method for optimizing high frequency performance of via structures
12/28/2006	US20060293086 Method and apparatus for cooling with a phase change material and heat pipes
12/28/2006	US20060293019 Methods of operating electronic devices, and methods of providing electronic devices
12/28/2006	US20060292892 Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices
12/28/2006	US20060292885 Layout modification to eliminate line bending caused by line material shrinkage
12/28/2006	US20060292865 Semiconductor device
12/28/2006	US20060292861 Method for making integrated circuit chip having carbon nanotube composite interconnection vias
12/28/2006	US20060292858 Techniques to create low K ILD for beol
12/28/2006	US20060292852 Back end interconnect with a shaped interface
12/28/2006	US20060292849 Ultrathin semiconductor circuit having contact bumps and corresponding production method
12/28/2006	US20060292831 Spacer Die Structure and Method for Attaching
12/28/2006	US20060292825 Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material
12/28/2006	US20060292813 Electronic component and method for manufacturing the same
12/28/2006	US20060292807 Semiconductor device and method of fabricating the same
12/28/2006	US20060292801 Bit line of a semiconductor device and method for fabricating the same
12/28/2006	US20060292756 Flip chip die assembly using thin flexible substrates
12/28/2006	US20060292753 Semiconductor Device and Method of Manufacturing a Semiconductor Device
12/28/2006	US20060292752 Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
12/28/2006	US20060292750 Standoffs for centralizing internals in packaging process
12/28/2006	US20060292749 Photochromic substrate container
12/28/2006	US20060292748 Package having bond-sealed underbump
12/28/2006	US20060292747 Top-surface-mount power light emitter with integral heat sink
12/28/2006	US20060292746 Stacked die in die BGA package
12/28/2006	US20060292745 Stacked die in die BGA package
12/28/2006	US20060292743 Stacked die in die BGA package
12/28/2006	US20060292742 Manufacturing method for packaged semiconductor device
12/28/2006	US20060292740 High Temperature Packaging for Electronic Components, Modules and Assemblies
12/28/2006	US20060292739 Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfaces
12/28/2006	US20060292738 Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects
12/28/2006	US20060292737 Grid array connection device and method
12/28/2006	US20060292732 Methods of flip-chip image sensor package fabrication
12/28/2006	US20060292717 Mounting and adhesive layer for semiconductor components
12/28/2006	US20060292714 Semiconductor manufacturing apparatus and wafer processing method
12/28/2006	US20060292713 Semiconductor integrated circuit device
12/28/2006	US20060292712 Process for the detection of a malfunction in a device for wire sawing and device for practicing said process
12/28/2006	US20060292710 Sensor and method for detecting electric contact degradation
12/28/2006	US20060292707 Healing detrimental bonds in deposited materials
12/28/2006	US20060291166 Thermal structure for electric devices
12/28/2006	US20060290431 Semiconductor device
12/28/2006	US20060290011 Molded stiffener for thin substrates
12/28/2006	US20060290010 Method of embedding semiconductor chip in support plate and embedded structure thereof
12/28/2006	US20060290009 Semiconductor device and method for manufacturing the same
12/28/2006	US20060290008 SMT passive device noflow underfill methodology and structure
12/28/2006	US20060290007 Flip Chip Die Assembly Using Thin Flexible Substrates
12/28/2006	US20060290006 Semiconductor package
12/28/2006	US20060290005 Multi-chip device and method for producing a multi-chip device
12/28/2006	US20060290004 Semiconductor device
12/28/2006	US20060290003 Substrate structure and manufacturing method of the same
12/28/2006	US20060290002 Method of forming through-silicon vias with stress buffer collars and resulting devices
12/28/2006	US20060290001 Interconnect vias and associated methods of formation
12/28/2006	US20060290000 Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
12/28/2006	US20060289999 Selective copper alloy interconnections in semiconductor devices and methods of forming the same
12/28/2006	US20060289998 Semiconductor Device and a Method of Manufacturing the Same
12/28/2006	US20060289997 Semiconductor device
12/28/2006	US20060289996 Semiconductor device
12/28/2006	US20060289995 Interconnection device including one or more embedded vias and method of producing the same
12/28/2006	US20060289994 Multi-level interconnections for an integrated circuit chip
12/28/2006	US20060289993 Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
12/28/2006	US20060289992 Stacked semiconductor component, fabrication method and fabrication system
12/28/2006	US20060289991 Semiconductor device and manufacturing method of the same
12/28/2006	US20060289990 Apparatus and method for high density multi-chip structures
12/28/2006	US20060289989 Intrinsic thermal enhancement for FBGA package
12/28/2006	US20060289988 Integrated circuit with heat conducting structures for localized thermal control
12/28/2006	US20060289987 Microelectronic die cooling device including bonding posts and method of forming same
12/28/2006	US20060289986 In-package connection between integrated circuit dies via flex tape
12/28/2006	US20060289985 Glass lid, and package provided with such a lid, for the encapsulation of electronic components
12/28/2006	US20060289984 Lead contact structure for EMR elements
12/28/2006	US20060289983 System, method and device for reducing electromagnetic emissions and susceptibility from electrical and electronic devices
12/28/2006	US20060289982 Semiconductor device and method for producing same
12/28/2006	US20060289981 Packaging logic and memory integrated circuits
12/28/2006	US20060289980 Stacked memory card and method for manufacturing the same
12/28/2006	US20060289979 Bridge modules for smart labels
12/28/2006	US20060289978 Memory element conducting structure
12/28/2006	US20060289977 Lead-free semiconductor package
12/28/2006	US20060289976 Pre-patterned thin film capacitor and method for embedding same in a package substrate
12/28/2006	US20060289975 Alignment using fiducial features
12/28/2006	US20060289974 Reliable integrated circuit and package
12/28/2006	US20060289973 Lead frame for semiconductor package
12/28/2006	US20060289972 Semiconductor device
12/28/2006	US20060289971 Semiconductor device having firmly secured heat spreader
12/28/2006	US20060289970 Magnetic shielding of MRAM chips
12/28/2006	US20060289969 Laser assisted material deposition
12/28/2006	US20060289966 Silicon wafer with non-soluble protective coating
12/28/2006	US20060289955 Semiconductor composite device and method of manufacturing the same
12/28/2006	US20060289954 Method for processing a MEMS/CMOS cantilever based memory storage device
12/28/2006	US20060289937 System for ESD protection with extra headroom in relatively low supply voltage integrated circuits
12/28/2006	US20060289936 ESD protection device structure
12/28/2006	US20060289935 Layout structure for ESD protection circuits
12/28/2006	US20060289929 Structure and method for forming laterally extending dielectric layer in a trench-gate FET
12/28/2006	US20060289918 Low resistance peripheral local interconnect contacts with selective wet strip of titanium
12/28/2006	US20060289889 Display device and manufacturing method thereof
12/28/2006	US20060289864 High impedance antifuse

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