Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2007
01/03/2007CN1889260A Semiconductor device capable of holding large size chip and producing method and relative carrier thereof
01/03/2007CN1889259A Anti-electrostatic discharging radiating module and system thereof
01/03/2007CN1889258A Vertical electrostatic discharging protection component structure
01/03/2007CN1889257A Welding pad structure for electronic device
01/03/2007CN1889256A LED micro liquid cooling system
01/03/2007CN1889255A Electronic component package including joint material for higher heat conductivity
01/03/2007CN1889254A 热管散热装置 Heat pipe cooling device
01/03/2007CN1889244A Focusing ion beam modifying integrated circuit method and integrated circuit
01/03/2007CN1889241A Packaged substrate technology and chip package
01/03/2007CN1293793C Line base-plate
01/03/2007CN1293790C Built-in module in element and its making process
01/03/2007CN1293682C Processing memory link with set of at least two laser pulses
01/03/2007CN1293641C 电子电路 Electronic circuit
01/03/2007CN1293638C Semiconductor memory device and method for making said device by adopting mosaic bit line process
01/03/2007CN1293633C Semiconductor integrated circuit apparatus and method for producing semiconductor integrated circuit apparatus
01/03/2007CN1293630C Protection circuit
01/03/2007CN1293629C Electrostatic discharge protector and producing method
01/03/2007CN1293628C Semiconductor packaging element with wire-holder as chip carrier and making method thereof
01/03/2007CN1293627C Energy transfer method and device with unidirectional airflow and hollow cavity
01/03/2007CN1293626C Module shell and power semiconductor module
01/03/2007CN1293622C Semiconductor device and mfg. method thereof
01/03/2007CN1293616C Electric device structure and forming method, etching and method for depth measuring
01/03/2007CN1293440C Hot plug fan and coupling device thereof
01/03/2007CN1292861C Copper flake powder, method for producing same
01/02/2007US7158549 Support structure for an optical device
01/02/2007US7158387 Film carrier tape for mounting electronic part
01/02/2007US7158381 Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard
01/02/2007US7158357 Capacitor design in ESD circuits for eliminating current leakage
01/02/2007US7157984 MEMS-based, computer systems, clock generation and oscillator circuits and LC-tank apparatus for use therein
01/02/2007US7157927 Test pattern for testing resistance of pattern of semiconductor substrate
01/02/2007US7157925 Test structure for speeding a stress-induced voiding test and method of using same
01/02/2007US7157800 Bonded structure using conductive adhesives, and a manufacturing method thereof
01/02/2007US7157799 Semiconductor die package including carrier with mask and semiconductor die
01/02/2007US7157798 Selective refractory metal and nitride capping
01/02/2007US7157797 Semiconductor device with suppressed copper migration
01/02/2007US7157796 Semiconductor device and the method of producing the same
01/02/2007US7157795 Composite tantalum nitride/tantalum copper capping layer
01/02/2007US7157794 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
01/02/2007US7157793 Direct contact semiconductor cooling
01/02/2007US7157792 Forming a substantially planar upper surface at the outer edge of a semiconductor topography
01/02/2007US7157791 Semiconductor chip assembly with press-fit ground plane
01/02/2007US7157790 Single die stitch bonding
01/02/2007US7157789 Semiconductor device and method for manufacturing the same
01/02/2007US7157788 Metal oxide dispersion for dye-sensitized solar cells, photoactive electrode and dye-sensitized solar cell
01/02/2007US7157787 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
01/02/2007US7157782 Electrically-programmable transistor antifuses
01/02/2007US7157777 Semiconductor device including silicided source and drain electrodes
01/02/2007US7157776 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device
01/02/2007US7157752 Semiconductor device
01/02/2007US7157744 Surface mount package for a high power light emitting diode
01/02/2007US7157742 Integrated circuit device
01/02/2007US7157734 Semiconductor bond pad structures and methods of manufacturing thereof
01/02/2007US7157387 Techniques to create low K ILD for BEOL
01/02/2007US7157373 Sidewall sealing of porous dielectric materials
01/02/2007US7157370 Semiconductor device and method for manufacturing the same
01/02/2007US7157365 Semiconductor device having a dummy conductive via and a method of manufacture therefor
01/02/2007US7157363 Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion
01/02/2007US7157360 Memory device and method for forming a passivation layer thereon
01/02/2007US7157353 Method for fabricating encapsulated semiconductor components
01/02/2007US7157352 Method for producing ultra-thin semiconductor device
01/02/2007US7157331 Ultraviolet blocking layer
01/02/2007US7157313 Epoxy resin composition and semiconductor device using thereof
01/02/2007US7157312 Surface mount package and method for forming multi-chip microsensor device
01/02/2007US7157311 Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
01/02/2007US7157309 Manufacture of microelectronic fold packages
01/02/2007US7157308 Circuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
01/02/2007US7157301 Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
01/02/2007US7157292 Leadframe for a multi-chip package and method for manufacturing the same
01/02/2007US7157290 Magnetically shielded circuit board
01/02/2007US7157289 Method for homogenizing the thickness of a coating on a patterned layer
01/02/2007US7157192 Square dummy patters uniformize pattern density; dielectrics; plasma enhance chemical vapor deposition; chemical mechanical polishing
01/02/2007US7157187 Heat resistance; performance; ultrathin electrolyte/dielectric films
01/02/2007US7157131 Prevention of counterfeit markings on semiconductor devices
01/02/2007US7156669 Anisotropic conductive film
01/02/2007US7156633 Apparatus for encapsulating a multi-chip substrate array
01/02/2007US7156161 Lightweight thermal heat transfer apparatus
01/02/2007US7156160 Integrated liquid cooling system for electronic components
01/02/2007US7156159 Multi-level microchannel heat exchangers
01/02/2007US7156158 Heat pipe type cooler
01/02/2007US7155963 Cleaning evaluation method for a substrate
01/02/2007US7155914 Cooling structure for electronic equipment
01/02/2007US7155816 Method for producing a multilayer ceramic substrate
01/02/2007CA2418683C Area-array with low inductance connecting device
12/2006
12/28/2006WO2006138502A2 Methods for data classification
12/28/2006WO2006138494A2 Chip capacitive coupling
12/28/2006WO2006138492A2 Post & penetration interconnection
12/28/2006WO2006138491A2 Back-to-front via process
12/28/2006WO2006138457A2 Isolating chip-to-chip contact
12/28/2006WO2006138426A2 Electronic chip contact structure
12/28/2006WO2006138425A2 Chip spanning connection
12/28/2006WO2006138423A2 Chip connector
12/28/2006WO2006138410A2 Method and system for using pattern matching to process an integrated circuit design
12/28/2006WO2006138223A2 Storage assembly
12/28/2006WO2006137819A2 High density vertically stacked semiconductor device
12/28/2006WO2006137523A1 Electronic control unit and manufacturing method thereof
12/28/2006WO2006137504A1 Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method
12/28/2006WO2006137384A1 Interlayer insulating film and wiring structure, and process for producing the same
12/28/2006WO2006137359A1 White semiconductor light emitting element and manufacturing method thereof
12/28/2006WO2006137237A1 Semiconductor device and method for manufacturing same
12/28/2006WO2006137219A1 Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus