| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/04/2007 | US20070001271 Lead frame and method of manufacturing the lead frame |
| 01/04/2007 | US20070001270 Communication board |
| 01/04/2007 | US20070001269 Nitride semiconductor device |
| 01/04/2007 | US20070001268 High-hardness and corrosion-tolerant integrated circuit packing mold |
| 01/04/2007 | US20070001260 Reducing parasitic mutual capacitances |
| 01/04/2007 | US20070001250 Micromachine and method of fabricating the same |
| 01/04/2007 | US20070001229 Electrostatic discharge device having controllable trigger voltage |
| 01/04/2007 | US20070001197 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system |
| 01/04/2007 | US20070001196 Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program |
| 01/04/2007 | US20070001189 Method of fabricating substrate for package of semiconductor light-emitting device |
| 01/04/2007 | US20070001171 Semiconductor device and manufacturing method thereof |
| 01/04/2007 | US20070001168 Semiconductor components and assemblies including vias of varying lateral dimensions |
| 01/04/2007 | US20070000656 Cooling device for heat-generating elements |
| 01/04/2007 | US20070000650 Once-through forced air-cooled heat sink for a projection display apparatus |
| 01/04/2007 | US20070000649 Auxiliary heat-dissipating device |
| 01/04/2007 | US20070000643 Heat sink |
| 01/04/2007 | US20070000599 Assembly method for semiconductor die and lead frame |
| 01/04/2007 | DE4445541B4 Kühlkörperbefestigungseinrichtung Heatsink attachment means |
| 01/04/2007 | DE4421077B4 Halbleitergehäuse und Verfahren zu dessen Herstellung Semiconductor package and method for its production |
| 01/04/2007 | DE112004002013T5 Paste für die Bildung einer Verknüpfung und die Verknüpfung gebildet aus der Paste Paste formed for the formation of a link and the link from the paste |
| 01/04/2007 | DE10325769B4 Anordnung und Verfahren zum Abgleich einer kalibrierbaren Stromquelle Apparatus and method for calibrating a calibrated current source |
| 01/04/2007 | DE10253938B4 Verfahren zur gleichzeitigen Herstellung einer Bonding-Pad-Struktur und eines Stapelkondensators in einer Halbleitervorrichtung Process for the simultaneous production of a bonding pad structure and a stacked capacitor in a semiconductor device |
| 01/04/2007 | DE10224180B4 Schaltungsanordnung zur Einstellung des Eingangswiderstandes und der Eingangskapazität eines integrierten Halbleiterschaltungschips Circuit arrangement for setting the input resistance and the input capacitance of a semiconductor integrated circuit chip |
| 01/04/2007 | DE10213296B4 Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens Electronic component having a semiconductor chip, a process for its preparation and process for the preparation of a benefit |
| 01/04/2007 | DE102005055488A1 Electronic structure and production process use lead-free solder columns comprising two materials for interconnections with the core material having the lower melting temperature |
| 01/04/2007 | DE102005030946A1 Semiconductor component for manufacturing switching power supply, has connecting unit with base ball and balls of solder stacked on base ball, where balls of solder have soldering material and electrical connected with contact pin surface |
| 01/04/2007 | DE102005030585A1 Halbleiterbauelement mit einem vertikalen Entkopplungskondensator A semiconductor device with a vertical decoupling capacitor |
| 01/04/2007 | DE102005030466A1 Semiconductor wafer with wiring structure for use in e.g. power diode, has coating material with self-supporting, stable-shaped carrier layer and containing ternary carbide, ternary nitride and carbon to cover wiring structure |
| 01/04/2007 | DE102005030465A1 Semiconductor stack for use as data processing optical semiconductor component, has semiconductor components stacked on each other with laminar wiring structure on coplanar surface in active upper side of semiconductor chip |
| 01/04/2007 | DE102005029421A1 Current supply circuit for automobile applications, has power source attached at transistor for operation of transistor at limit for saturation of constant power source, which is designed for supplying constant base current to transistor |
| 01/04/2007 | DE102005026098B3 Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung derselben Benefits and semiconductor component of a composite plate with semiconductor chips and plastic housing composition and method of making same |
| 01/04/2007 | DE102005006121A1 Vertikalthyristor zum ESD-Schutz und Verfahren zur Herstellung eines Vertikalthyristor zum ESD-Schutz Vertikalthyristor for ESD protection and process for producing a Vertikalthyristor for ESD protection |
| 01/04/2007 | DE102004049252B4 Temperaturabtastschaltung und Periodensteuerschaltung Temperaturabtastschaltung and period control circuit |
| 01/04/2007 | DE102004009567B4 Verdrahtungsträger zur Aufnahme von Chips Wiring carrier to hold chips |
| 01/04/2007 | CA2589183A1 Heat sink with microchannel cooling for power devices |
| 01/03/2007 | EP1740025A2 Wiring board and method for manufacturing the same |
| 01/03/2007 | EP1739748A2 Magnetic shielding of MRAM chips |
| 01/03/2007 | EP1739747A2 Semiconductor chip and method of manufacturing the same |
| 01/03/2007 | EP1739746A2 Fluid-cooled Electronic System |
| 01/03/2007 | EP1739745A2 Heat-radiating sheet and heat-radiating structure |
| 01/03/2007 | EP1739744A2 Heat radiation member and production method for the same |
| 01/03/2007 | EP1739743A2 Electronic component package including joint material for higher heat conductivity |
| 01/03/2007 | EP1739742A1 Thermally conductive member and cooling system using the same |
| 01/03/2007 | EP1739741A2 Electronic assembly with backplate having at least one thermal insert |
| 01/03/2007 | EP1739740A2 Power semiconductor |
| 01/03/2007 | EP1739739A1 Through wiring board and method for producing the same |
| 01/03/2007 | EP1739737A1 Methods of manufacturing air dielectric structures |
| 01/03/2007 | EP1739736A1 Method of manufacturing a semiconductor device |
| 01/03/2007 | EP1739689A1 Conductive paste for multilayer electronic components and multilayer electronic component using same |
| 01/03/2007 | EP1739475A2 Partition-wall structure for forming a conductive pattern by ink jet printing |
| 01/03/2007 | EP1739112A1 Flame retardant epoxy resin composition and semiconductor device using the same |
| 01/03/2007 | EP1738431A2 Embedded capacitors using conductor filled vias |
| 01/03/2007 | EP1738411A1 Sensor device, sensor system and methods for manufacturing them |
| 01/03/2007 | EP1738384A1 Integrated circuit with analog connection matrix |
| 01/03/2007 | EP1738129A2 Nanoengineered thermal materials based on carbon nanotube array composites |
| 01/03/2007 | EP1738128A1 A fluid cooling system |
| 01/03/2007 | EP1738127A2 Low-profile thermosyphon-based cooling system for computers and other electronic devices |
| 01/03/2007 | EP1520057B1 Method of making a composite product and in particular a heat sink |
| 01/03/2007 | EP1516372B1 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof |
| 01/03/2007 | EP1461824A4 Metal-to-metal antifuse employing carbon-containing antifuse material |
| 01/03/2007 | EP1454956B1 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
| 01/03/2007 | EP1145314B1 High frequency power transistor device |
| 01/03/2007 | EP1142923B1 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 01/03/2007 | EP1060647B1 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 01/03/2007 | EP0963602B1 Microwave integrated circuits and process of making the same |
| 01/03/2007 | EP0938749B1 Integrated circuit with housing accommodating the latter |
| 01/03/2007 | EP0850489B1 Solder deposit support |
| 01/03/2007 | CN2855013Y Circulation heat pipe |
| 01/03/2007 | CN2855012Y Heat sink |
| 01/03/2007 | CN2854811Y Interconnection structure |
| 01/03/2007 | CN2854810Y Function region structure of surface adhesive LED support |
| 01/03/2007 | CN2854809Y Integrated circuit multiple matrix lead frame |
| 01/03/2007 | CN2854808Y Integral circuit welding lead frame |
| 01/03/2007 | CN2854807Y Integral circuit device |
| 01/03/2007 | CN2854806Y Pattern gold lug structure for semiconductor chip |
| 01/03/2007 | CN2854805Y Heat exchanger with liquid storage tank |
| 01/03/2007 | CN2854804Y Micron chip size package heat sink structure |
| 01/03/2007 | CN2854803Y Fin structure |
| 01/03/2007 | CN1891023A Method for constructing emi shielding around a component embedded in a circuit board |
| 01/03/2007 | CN1891021A System and method for self-leveling heat sink for multiple height devices |
| 01/03/2007 | CN1891020A Method of attaching non-adhesive thermal interface materials |
| 01/03/2007 | CN1890845A Small array contact with precision working range |
| 01/03/2007 | CN1890810A Electronic circuit package with cavity resonance cut off member |
| 01/03/2007 | CN1890809A Wire-bonded semiconductor component with reinforced inner connection metallization |
| 01/03/2007 | CN1890808A A method and apparatus for improved power routing |
| 01/03/2007 | CN1890807A Semiconductor chip package |
| 01/03/2007 | CN1890806A Connector for making electrical contact at semiconductor scales and method for forming same |
| 01/03/2007 | CN1890805A Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
| 01/03/2007 | CN1890804A Using external radiators with electroosmotic pumps for cooling integrated circuits |
| 01/03/2007 | CN1890803A Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 01/03/2007 | CN1890802A Inverted J-lead package for power devices |
| 01/03/2007 | CN1890801A Packaged electronic element and method of producing electronic element package |
| 01/03/2007 | CN1890800A Integrating passive components on spacer in stacked dies |
| 01/03/2007 | CN1890790A Method of making a microelectronic assembly |
| 01/03/2007 | CN1890789A Process for packaging components, and packaged components |
| 01/03/2007 | CN1890285A Encapsulant mixture having a polymer bound catalyst |
| 01/03/2007 | CN1889272A Display device panel structure and producing method thereof |
| 01/03/2007 | CN1889266A High-temperature resisting one-chip integrated micro-sensor structure and system integrating method |
| 01/03/2007 | CN1889262A Block shape water-cooling electric semiconductor device |
| 01/03/2007 | CN1889261A Large power LED extended light soure |