| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/04/2007 | WO2007002955A1 Interconnection device including one or more embedded vias and method of producing the same |
| 01/04/2007 | WO2007002948A1 Embedding thin film resistors in substrates in power delivery networks |
| 01/04/2007 | WO2007002939A2 System for liquid cooling of electrical components |
| 01/04/2007 | WO2007002902A2 Thermal interface material and method |
| 01/04/2007 | WO2007002876A1 Systems for integrated pump and reservoir |
| 01/04/2007 | WO2007002868A1 Packaging logic and memory integrated circuits |
| 01/04/2007 | WO2007002760A2 Top-surface-mount power light emitter with integral heat sink |
| 01/04/2007 | WO2007002695A2 Layout modification to eliminate line bending caused by line material shrinkage |
| 01/04/2007 | WO2007002689A2 Semiconductor device having firmly secured heat spreader |
| 01/04/2007 | WO2007002547A2 Through-wafer vias and surface metallization for coupling thereto |
| 01/04/2007 | WO2007002424A1 Silver barrier layer to minimize whisker growth in tin electrodeposits |
| 01/04/2007 | WO2007002346A1 Flip chip die assembly using thin flexible substrates |
| 01/04/2007 | WO2007002244A2 High temperature packaging for electronic components, modules and assemblies |
| 01/04/2007 | WO2007002158A2 Multi-level interconnections for an integrated circuit chip |
| 01/04/2007 | WO2007001988A2 Structure and method for forming laterally extending dielectric layer in a trench-gate fet |
| 01/04/2007 | WO2007001803A2 Cure catalyst, composition, electronic device and associated method |
| 01/04/2007 | WO2007001598A2 Lead-free semiconductor package |
| 01/04/2007 | WO2007001456A1 Heat sink with microchannel cooling for power devices |
| 01/04/2007 | WO2007001260A1 Test cells for semiconductor yield improvement |
| 01/04/2007 | WO2007001018A1 Semiconductor device and semiconductor device assembly |
| 01/04/2007 | WO2007000991A1 Heat sink for power module |
| 01/04/2007 | WO2007000963A1 Process for producing nonflat ceramic substrate |
| 01/04/2007 | WO2007000695A2 Package, subassembly and methods of manufacturing thereof |
| 01/04/2007 | WO2007000037A1 Bendable high flux led array |
| 01/04/2007 | WO2006121837A3 Nonvolatile memory cell comprising a diode and a resistance-switching material |
| 01/04/2007 | WO2006084028A3 Interdiffusion bonded stacked die device |
| 01/04/2007 | WO2006076101A3 A method to manufacture a universal footprint for a package with exposed chip |
| 01/04/2007 | WO2006055307A3 Flip-top actuator |
| 01/04/2007 | US20070004240 System and method for processor power delivery and thermal management |
| 01/04/2007 | US20070004206 Improved hdp-based ild capping layer |
| 01/04/2007 | US20070004199 Method of making a contact structure |
| 01/04/2007 | US20070004198 Shielded capacitor structure |
| 01/04/2007 | US20070004197 Methods for creating electrophoretically insulated vias in semiconductive substrates |
| 01/04/2007 | US20070004192 Metal interconnection of a semiconductor device and method of fabricating the same |
| 01/04/2007 | US20070004189 Manufacturing method of semiconductor device |
| 01/04/2007 | US20070004150 Electrostatic discharge protection semiconductor structure |
| 01/04/2007 | US20070004143 Nonvolatile Semiconductor Memory Device |
| 01/04/2007 | US20070004133 Capacitor for a semiconductor device and method of fabricating same |
| 01/04/2007 | US20070004096 Method for containing a device and a corresponding device |
| 01/04/2007 | US20070004092 Semiconductor device manufacturing method |
| 01/04/2007 | US20070004084 Chip and multi-chip semiconductor device using thereof and method for manufacturing same |
| 01/04/2007 | US20070004081 Method for manufacturing a thermal interface material |
| 01/04/2007 | US20070004080 Hermetic seals for micro-electromechanical system devices |
| 01/04/2007 | US20070004063 Technique for evaluating a fabrication of a die and wafer |
| 01/04/2007 | US20070004062 Display panel, display panel inspection method, and display panel manufacturing method |
| 01/04/2007 | US20070004059 Method of measuring alignment of measurement pattern |
| 01/04/2007 | US20070004053 Tunable alignment geometry |
| 01/04/2007 | US20070002660 Protection circuit located under fuse window |
| 01/04/2007 | US20070002549 Electronic package connected to a substrate |
| 01/04/2007 | US20070002541 Enhanced flow channel for component cooling in computer systems |
| 01/04/2007 | US20070002255 Image display and manufacturing method thereof |
| 01/04/2007 | US20070001321 Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material |
| 01/04/2007 | US20070001320 Bonding apparatus and method |
| 01/04/2007 | US20070001319 Semiconductor device with semiconductor device components embedded in a plastics composition |
| 01/04/2007 | US20070001318 Soldering a die to a substrate |
| 01/04/2007 | US20070001317 Semiconductor device |
| 01/04/2007 | US20070001316 Semiconductor device with improved signal transmission characteristics |
| 01/04/2007 | US20070001315 Substrate for device bonding, device bonded substrate, and method for producing same |
| 01/04/2007 | US20070001314 Flip-chip bonding structure using multi chip module-deposited substrate |
| 01/04/2007 | US20070001313 Method of interconnecting terminals and method for mounting semiconductor device |
| 01/04/2007 | US20070001312 Semiconductor chip and method of manufacturing the same |
| 01/04/2007 | US20070001311 Semiconductor device and method of fabricating the same |
| 01/04/2007 | US20070001310 Thermal interface material and method |
| 01/04/2007 | US20070001309 Semiconductor device having multiple-layered interconnect |
| 01/04/2007 | US20070001308 Semiconductor device |
| 01/04/2007 | US20070001307 Semiconductor device advantageous in improving water resistance and oxidation resistance |
| 01/04/2007 | US20070001306 Dual damascene interconnect in hybrid dielectric |
| 01/04/2007 | US20070001305 Method for forming a semiconductor product and semiconductor product |
| 01/04/2007 | US20070001304 Interconnect structure for integrated circuits |
| 01/04/2007 | US20070001303 Integrated circuit system using dual damascene process |
| 01/04/2007 | US20070001302 Semiconductor device and manufacturing method of the same |
| 01/04/2007 | US20070001301 Under bump metallization design to reduce dielectric layer delamination |
| 01/04/2007 | US20070001300 Semiconductor device |
| 01/04/2007 | US20070001299 Stacked semiconductor package |
| 01/04/2007 | US20070001298 Semiconductor device with built-in capacitor, and method of producing the same |
| 01/04/2007 | US20070001297 Circuit substrate |
| 01/04/2007 | US20070001296 Bump for overhang device |
| 01/04/2007 | US20070001295 Semiconductor device and fabrication method thereof |
| 01/04/2007 | US20070001294 Low profile stacked semiconductor chip package |
| 01/04/2007 | US20070001293 Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
| 01/04/2007 | US20070001292 Heat radiation member and production method for the same |
| 01/04/2007 | US20070001291 Anti-warp heat spreader for semiconductor devices |
| 01/04/2007 | US20070001290 Semiconductor packaging structure |
| 01/04/2007 | US20070001289 Semiconductor device and method of manufacturing the same |
| 01/04/2007 | US20070001288 Package for electronic device and method for manufacturing electronic device |
| 01/04/2007 | US20070001287 Hermetic cavity package |
| 01/04/2007 | US20070001286 System and method for venting pressure from an integrated circuit package sealed with a lid |
| 01/04/2007 | US20070001285 Apparatus having reduced warpage in an over-molded IC package |
| 01/04/2007 | US20070001284 Semiconductor package having lead free conductive bumps and method of manufacturing the same |
| 01/04/2007 | US20070001283 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same |
| 01/04/2007 | US20070001282 Three-dimensional semiconductor module having multi-sided ground block |
| 01/04/2007 | US20070001281 Semiconductor memory device and manufacturing method thereof |
| 01/04/2007 | US20070001280 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
| 01/04/2007 | US20070001279 Semiconductor device |
| 01/04/2007 | US20070001277 Substrate connector for integrated circuit devices |
| 01/04/2007 | US20070001276 Semiconductor device and portable apparatus and electronic apparatus comprising the same |
| 01/04/2007 | US20070001275 Semiconductor device and package, and method of manufacturer therefor |
| 01/04/2007 | US20070001274 Multi-part lead frame with dissimilar materials |
| 01/04/2007 | US20070001273 Semiconductor device |
| 01/04/2007 | US20070001272 Die package with asymmetric leadframe connection |