| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/10/2007 | CN1893046A Semiconductor device |
| 01/10/2007 | CN1893045A Substrate for manufacturing semiconductor device, semiconductor device manufacturing method |
| 01/10/2007 | CN1893044A Tape lower chip packaging structure and its producing method |
| 01/10/2007 | CN1893043A Radiating substrate and light source device |
| 01/10/2007 | CN1893042A Heat exchanger for liquid cooling |
| 01/10/2007 | CN1893041A Thin loop type radiating apparatus |
| 01/10/2007 | CN1893040A Thermo-interface material producing method |
| 01/10/2007 | CN1893039A Anti-warp heat spreader for semiconductor devices |
| 01/10/2007 | CN1893038A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/10/2007 | CN1893037A Radiating system |
| 01/10/2007 | CN1893036A Package for electronic device and method for manufacturing electronic device |
| 01/10/2007 | CN1893035A Circuit device and method of manufacturing the same |
| 01/10/2007 | CN1893034A 半导体器件 Semiconductor devices |
| 01/10/2007 | CN1893020A Semiconductor device and a method of manufacturing the same |
| 01/10/2007 | CN1893017A A method for preventing metal line bridging in a semiconductor device |
| 01/10/2007 | CN1893012A Three dimensional ic device and alignment methods of ic device substrates |
| 01/10/2007 | CN1893005A Method for preventing overflow of glue of package element |
| 01/10/2007 | CN1892683A RFID tag and manufacturing method thereof |
| 01/10/2007 | CN1892531A CPU radiator for computer host machine |
| 01/10/2007 | CN1294792C Integrated circuit collector |
| 01/10/2007 | CN1294790C Method of manufacturing electronic part and electronic part obtained by the method |
| 01/10/2007 | CN1294787C Method for mounting an electronic component |
| 01/10/2007 | CN1294653C Semiconductor device and mfg method thereof |
| 01/10/2007 | CN1294652C Semiconductor device and its manufacturing method |
| 01/10/2007 | CN1294651C 半导体器件 Semiconductor devices |
| 01/10/2007 | CN1294647C A method for reducing noise of RFCMOS device |
| 01/10/2007 | CN1294635C Protsusion forming method and manufacturing method of semiconductor device |
| 01/10/2007 | CN1294634C Solid-state imaging device and method for manufacturing the same |
| 01/09/2007 | US7161810 Stacked chip electronic package having laminate carrier and method of making same |
| 01/09/2007 | US7161808 Retaining heat sinks on printed circuit boards |
| 01/09/2007 | US7161807 Heat spreader module |
| 01/09/2007 | US7161806 Heat sink and method for its production |
| 01/09/2007 | US7161805 Latch means for socket connector assembly |
| 01/09/2007 | US7161804 Housing structure of electronic device and heat radiation method therefor |
| 01/09/2007 | US7161802 Thermal management system having porous fluid transfer element |
| 01/09/2007 | US7161793 Layer capacitor element and production process as well as electronic device |
| 01/09/2007 | US7161641 Device with upper conductive element, lower conductive element, and insulating element |
| 01/09/2007 | US7161450 Microwave transmission line having dielectric film layers providing negative space charge effects |
| 01/09/2007 | US7161373 Method for testing using a universal wafer carrier for wafer level die burn-in |
| 01/09/2007 | US7161371 Module part |
| 01/09/2007 | US7161368 Semiconductor component with internal heating |
| 01/09/2007 | US7161299 Structure for a plasma display panel that reduces capacitance between electrodes |
| 01/09/2007 | US7161252 Module component |
| 01/09/2007 | US7161251 Partially populated ball grid design to accommodate landing pads close to the die |
| 01/09/2007 | US7161250 Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
| 01/09/2007 | US7161249 Multi-chip package (MCP) with spacer |
| 01/09/2007 | US7161248 Multi-layer wiring structure with dummy patterns for improving surface flatness |
| 01/09/2007 | US7161247 Polishing composition for noble metals |
| 01/09/2007 | US7161246 Interconnect alloys and methods and apparatus using same |
| 01/09/2007 | US7161245 Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus |
| 01/09/2007 | US7161244 Microwave device for dissipating or attenuating power |
| 01/09/2007 | US7161243 System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery |
| 01/09/2007 | US7161242 Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element |
| 01/09/2007 | US7161241 Multi-layer board |
| 01/09/2007 | US7161240 Insitu-cooled electrical assemblage |
| 01/09/2007 | US7161239 Ball grid array package enhanced with a thermal and electrical connector |
| 01/09/2007 | US7161238 Structural reinforcement for electronic substrate |
| 01/09/2007 | US7161237 Flip chip packaging using recessed interposer terminals |
| 01/09/2007 | US7161236 Bow control in an electronic package |
| 01/09/2007 | US7161235 Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore |
| 01/09/2007 | US7161234 Semiconductor component and production method suitable therefor |
| 01/09/2007 | US7161233 Integrated micro electromechanical system encapsulation component and fabrication process of the component |
| 01/09/2007 | US7161232 Apparatus and method for miniature semiconductor packages |
| 01/09/2007 | US7161231 Semiconductor device which prevents peeling of low-permittivity film by using multilevel interconnection |
| 01/09/2007 | US7161226 Multi-layered complementary wire structure and manufacturing method thereof |
| 01/09/2007 | US7161223 Integrated circuit with a PN junction diode |
| 01/09/2007 | US7161222 Semiconductor device and semiconductor device fabrication method |
| 01/09/2007 | US7161195 Semiconductor device and fabrication process thereof |
| 01/09/2007 | US7161192 Silicon controlled rectifier |
| 01/09/2007 | US7161189 LED package including a frame |
| 01/09/2007 | US7161175 Inter-dice signal transfer methods for integrated circuits |
| 01/09/2007 | US7161094 Modifying the electro-mechanical behavior of devices |
| 01/09/2007 | US7161092 Apparatus and method for protecting an electronic circuit |
| 01/09/2007 | US7160823 comprises borosilicate-based glass containing silicon/aluminum/alkali earth metal oxide; controlled shrinkage while maintaining electrical properties |
| 01/09/2007 | US7160821 Method of depositing low k films |
| 01/09/2007 | US7160805 Inter-layer interconnection structure for large electrical connections |
| 01/09/2007 | US7160801 Integrated circuit using a dual poly process |
| 01/09/2007 | US7160800 Decreasing metal-silicide oxidation during wafer queue time |
| 01/09/2007 | US7160799 Define via in dual damascene process |
| 01/09/2007 | US7160797 Method of bumping die pads for wafer testing |
| 01/09/2007 | US7160796 Method for manufacturing wiring board and semiconductor device |
| 01/09/2007 | US7160795 Method and structures for reduced parasitic capacitance in integrated circuit metallizations |
| 01/09/2007 | US7160786 Silicon on insulator device and layout method of the same |
| 01/09/2007 | US7160770 Method of manufacturing an electronic component including an inter-line insulating layer and a conductor pattern |
| 01/09/2007 | US7160760 Semiconductor device and a method of manufacturing the same |
| 01/09/2007 | US7160759 Semiconductor device and method of manufacturing the same |
| 01/09/2007 | US7160758 Electronic packaging apparatus and method |
| 01/09/2007 | US7160672 Forming a thin ceramic protective coating applied at relatively low temperature by selective coating of ceramic on an electrical or magnetic biocompatible implant; metallization; photolithographic polyamide coating; scribing and dissolving away polymerized polyamide and a ceramic mask; batch processing |
| 01/09/2007 | US7160629 A bright tin or bright lead-free tin-alloy having no whiskers after 4 months storage at 52 degrees C. and 98% relative humidity; preferred alloying elements are nickel, copper, bismuth, zinc, silver or indium; prepared from a solution of acidic electrolytes and carboxylated polyalkyleneimines |
| 01/09/2007 | US7160620 Reduced thickness, small thermal interface resistance, good flexibility, and heat conduction |
| 01/09/2007 | US7160619 such as a plasma display panel (PDP) or a light emitting diode (LED); comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell facing the back surface of the device |
| 01/09/2007 | US7160529 For use in thermally conductive films in integrated circuit packaging, adhesives, and thermoelectric cooling devices; low-k dielectric layers in integrated circuit multilevel interconnects; passivation films for integrated circuit devices, and field emission cathodes |
| 01/09/2007 | US7160476 Method of manufacturing an electronic device |
| 01/09/2007 | US7160428 Plating tank for wire patterns on film carrier; prevent bubble adhesion |
| 01/09/2007 | US7159414 Hotspot coldplate spray cooling system |
| 01/09/2007 | US7159313 Solderless electronics packaging and methods of manufacture |
| 01/09/2007 | US7159311 Method of making an interposer with contact structures |
| 01/09/2007 | US7159310 Electronic part mounting substrate and method for producing same |
| 01/09/2007 | CA2385468C Integrated circuit plating using highly-complexed copper plating baths |
| 01/04/2007 | WO2007002957A2 Systems for integrated cold plate and heat spreader |