| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/11/2007 | US20070006805 Method and System for Applying an Adhesive Substance on an Electronic Device |
| 01/11/2007 | DE202006011490U1 Cooler for electronic component incorporates cooling body and fan, whose main suction side lies in plane above electronic component at inclination to it |
| 01/11/2007 | DE19540348B4 Verfahren zum Identifizieren von Bauelementen A method for identifying components |
| 01/11/2007 | DE112005000504T5 Mehrschichtüberlagerungsmessungs- und Korrekturtechnik für die IC-Herstellung Mehrschichtüberlagerungsmessungs- and correction technique for the IC fabrication |
| 01/11/2007 | DE102006029682A1 Production of a semiconductor structure with deep trench isolation and buried layer contact etches a trench and a shallower and narrower hole in a single crystal semiconductor layer |
| 01/11/2007 | DE102006023123A1 Semiconductor module with components for high-frequency methods in plastic housing especially for vehicle radar and satellite navigation has multilayer alternating conductive rail structure on the surface |
| 01/11/2007 | DE102006015112A1 Halbleitervorrichtung Semiconductor device |
| 01/11/2007 | DE102006014895A1 Gunn diode Gunn diode |
| 01/11/2007 | DE102006009930A1 Lichtaussendeeinrichtung Light emitter |
| 01/11/2007 | DE102005031942A1 Coupling unit for element for cooling an IC on a circuit board has a receiving element and a movable coupling element in a pressure point for force-fitting |
| 01/11/2007 | DE102005031658A1 Bleifreies Glas Lead-free glass |
| 01/11/2007 | DE102005030247A1 Housing of power semiconductor module with outwards coupling members contains insulating substrate, whose main surface away from base plate, carries mutually insulated coupling tracks |
| 01/11/2007 | DE102005029784A1 Elektronikbaugruppe und Verfahren zur Herstellung einer Elektronikbaugruppe Electronic assembly and methods of manufacturing an electronics package |
| 01/11/2007 | DE10100844B4 Abschirmungsschaltung und integrierte Schaltung, in der die Abschirmungsschaltung verwendet wird Shielding circuit and integrated circuit in which the shield circuit is used |
| 01/10/2007 | EP1742266A2 Semiconductor integrated circuit device, circuit design apparatus, and circuit design method |
| 01/10/2007 | EP1742265A2 Coolant cooled type semiconductor device |
| 01/10/2007 | EP1742264A2 A monolithic fluid cooled power module and a method of forming the power module |
| 01/10/2007 | EP1742263A2 Once-through forced air-cooled heat sink for a projection display apparatus |
| 01/10/2007 | EP1742262A2 Extendable heat dissipation apparatus |
| 01/10/2007 | EP1742171A1 Method for manufacturing sheet provided with ic tag, apparatus for manufacturing sheet provided with ic tag, sheet provided with ic tag, method for fixing ic chip, apparatus for fixing ic chip, and ic tag |
| 01/10/2007 | EP1742141A2 Improved efficiency CPU cooling arrangement |
| 01/10/2007 | EP1741755A2 Method of coating using curable silicone compositions having improved chemical resistance and migration resistance |
| 01/10/2007 | EP1741668A2 Method for encasing a MEMS device and packaged device |
| 01/10/2007 | EP1741325A1 Mounting plate for electronic components |
| 01/10/2007 | EP1741138A1 An integrated circuit, a method and an assembly for manufacturing the integrated circuit, and a mobile phone having the integrated circuit |
| 01/10/2007 | EP1741137A1 Heat sink made from a diamond/copper composite material containing boron |
| 01/10/2007 | EP1741136A2 Method for production of electronic and optoelectronic circuits |
| 01/10/2007 | EP1741135A1 Chip module and method for production of a chip module |
| 01/10/2007 | EP1741134A2 Stacked module systems and methods |
| 01/10/2007 | EP1741131A2 Level realignment following an epitaxy step |
| 01/10/2007 | EP1741112A2 Embedded toroidal transformers in ceramic substrates |
| 01/10/2007 | EP1740641A2 SILOXANE EPOXY POLYMERS FOR LOW-κ DIELECTRIC APPLICATIONS |
| 01/10/2007 | EP1387367B1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 01/10/2007 | EP1360720A4 Process for the manufacture of printed circuit boards with plated resistors |
| 01/10/2007 | EP1127387B1 Non-circular micro-via |
| 01/10/2007 | EP1044472A4 Multi-chip module having interconnect dies |
| 01/10/2007 | CN2857415Y Improved structure of radiator air hood |
| 01/10/2007 | CN2857414Y Graphic card radiator |
| 01/10/2007 | CN2857410Y Fan hood of refrigerating fins radiator |
| 01/10/2007 | CN2857222Y Transistor structure for high frequency circuit |
| 01/10/2007 | CN2857221Y Radiator with dome |
| 01/10/2007 | CN2857220Y Fan hood of radiator |
| 01/10/2007 | CN2857219Y Radiator with improved structure |
| 01/10/2007 | CN2857218Y Radiator having thin fins |
| 01/10/2007 | CN1895011A Flat plate heat transfer device and method for manufacturing the same |
| 01/10/2007 | CN1894793A Integrated circuit fuse and method of fabrication |
| 01/10/2007 | CN1894792A Helical microelectronic contact and method for fabricating same |
| 01/10/2007 | CN1894791A Heat-conducting interface material and solder prefabricated product |
| 01/10/2007 | CN1894790A Method for adhering getter material to a surface for use in electronic devices |
| 01/10/2007 | CN1894786A Auxiliary design device of semiconductor device |
| 01/10/2007 | CN1894785A Silicone adhesive agent |
| 01/10/2007 | CN1894435A Metal-based carbon fiber composite material and method for producing the same |
| 01/10/2007 | CN1894156A Method to test the hermeticity of a sealed cavity micromechanical device and the device to be so tested |
| 01/10/2007 | CN1893807A Cooling device and electronic apparatus |
| 01/10/2007 | CN1893806A Thermally conductive member and cooling system using the same |
| 01/10/2007 | CN1893804A Heat-radiating sheet and heat-radiating structure |
| 01/10/2007 | CN1893803A Heat radiation member and production method for the same |
| 01/10/2007 | CN1893802A Liquid cooling system comprising component capable of heat exchanging |
| 01/10/2007 | CN1893801A Radiating apparatus |
| 01/10/2007 | CN1893799A Loop-type radiating module group |
| 01/10/2007 | CN1893771A Parallel chip embedded printed circuit board and manufacturing method thereof |
| 01/10/2007 | CN1893768A Electronic equipment and method for mounting electronic component |
| 01/10/2007 | CN1893765A Printed wiring board, solder resist resin composition, and method for manufacturing printed wiring board |
| 01/10/2007 | CN1893348A Confidential information implementation system and lsi |
| 01/10/2007 | CN1893206A Semiconductor laser unit and optical pickup device |
| 01/10/2007 | CN1893130A Side-view light emitting diode having improved side-wall reflection structure |
| 01/10/2007 | CN1893129A Light emitting diode package, and method for manufacturing same, back light unit and liquid crystal display device |
| 01/10/2007 | CN1893126A Base with ring-body and producing method |
| 01/10/2007 | CN1893096A Thin film transistor array panel and method for manufacturing the same |
| 01/10/2007 | CN1893091A Thin film panel and method of manufacturing the same |
| 01/10/2007 | CN1893090A Display substrate, method of manufacturing the same and display apparatus having the same |
| 01/10/2007 | CN1893082A Memory cell array and method of forming the same |
| 01/10/2007 | CN1893078A Electronic substrate, manufacturing method for electronic substrate, and electronic device |
| 01/10/2007 | CN1893077A Semiconductor device |
| 01/10/2007 | CN1893076A Semiconductor device and a method of manufacturing the same |
| 01/10/2007 | CN1893075A 半导体装置 Semiconductor device |
| 01/10/2007 | CN1893073A Method for regulating temperature and circuit therefor |
| 01/10/2007 | CN1893072A Flat panel display and method for driving the same |
| 01/10/2007 | CN1893071A Manufacturing method for electronic substrate, electronic substrate, and electronic apparatus |
| 01/10/2007 | CN1893070A Semiconductor device advantageous in improving water resistance and oxidation resistance |
| 01/10/2007 | CN1893069A Semiconductor device and method of manufacturing the same |
| 01/10/2007 | CN1893068A Semiconductor device having multiple-layered interconnect |
| 01/10/2007 | CN1893064A Integrated circuit device and electronic instrument |
| 01/10/2007 | CN1893063A Stack type package |
| 01/10/2007 | CN1893062A Method for fabricating self-assembling microstructures |
| 01/10/2007 | CN1893061A Package structure of power power-supply module |
| 01/10/2007 | CN1893060A Single-segment and multi-segment triggering type voltage-adjustable static-electricity discharging protection semiconductor structure |
| 01/10/2007 | CN1893059A 半导体器件 Semiconductor devices |
| 01/10/2007 | CN1893058A Semiconductor device |
| 01/10/2007 | CN1893057A Semiconductor device and method of manufacturing the same |
| 01/10/2007 | CN1893056A Interconnect structure for integrated circuits and static random-access storage unit |
| 01/10/2007 | CN1893055A Semiconductor device using solid phase epitaxy and method for manufacturing the same |
| 01/10/2007 | CN1893054A Printed circuit board |
| 01/10/2007 | CN1893053A Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure |
| 01/10/2007 | CN1893052A 半导体装置 Semiconductor device |
| 01/10/2007 | CN1893051A Semiconductor device |
| 01/10/2007 | CN1893050A 半导体器件 Semiconductor devices |
| 01/10/2007 | CN1893049A Semiconductor device with low thermal expansion coefficient and use thereof |
| 01/10/2007 | CN1893048A Semiconductor package board having dummy area with copper pattern |
| 01/10/2007 | CN1893047A System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects |