| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/16/2007 | US7163846 Method for manufacturing circuit devices |
| 01/16/2007 | US7163845 Internal package heat dissipator |
| 01/16/2007 | US7163843 Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same |
| 01/16/2007 | US7163840 Flip chip package and manufacturing method thereof |
| 01/16/2007 | US7163838 Method and apparatus for forming a DMD window frame with molded glass |
| 01/16/2007 | US7163752 Shielded system with a housing having a high atomic number metal coating applied by thermal spray technique |
| 01/16/2007 | US7163638 Forming an insulating film on a substrate material, forming a contact hole in the insulating film, and coating a region where a transparent conductive film is to be formed with a liquid containing a precursor of the transparent conductive film liquid coats any unnecessary insulating film formed, annealin |
| 01/16/2007 | US7163613 Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses |
| 01/16/2007 | US7163155 ASIC-embedded switchable antenna arrays |
| 01/16/2007 | US7163104 Tray for semiconductor device and semiconductor device |
| 01/16/2007 | US7163050 Heat dissipating device |
| 01/16/2007 | US7163049 Cooling fin assembly |
| 01/16/2007 | US7162906 Method and apparatus for removing a carrier part from a carrier |
| 01/16/2007 | US7162796 Method of making an interposer with contact structures |
| 01/16/2007 | US7162794 Manufacturing method for multilayer ceramic elements |
| 01/16/2007 | CA2122459C Non-lead sealing glasses |
| 01/11/2007 | WO2007005870A1 Power interconnect structure for balanced bitline capacitance in a memory array |
| 01/11/2007 | WO2007005864A1 Complete power management system implemented in a single surface mount package |
| 01/11/2007 | WO2007005860A2 Cooling system valve |
| 01/11/2007 | WO2007005695A1 Integrated circuit die containing metal- and particle-filled through-silicon vias |
| 01/11/2007 | WO2007005492A1 Method of reducing warpage in an over-molded ic package |
| 01/11/2007 | WO2007005275A1 Molding composition and method, and molded article |
| 01/11/2007 | WO2007005228A2 Hermetic seals for micro-electromechanical system devices |
| 01/11/2007 | WO2007005042A1 Esd component ground clip |
| 01/11/2007 | WO2007004986A1 An integrated circuit package and a method for manufacturing an integrated circuit package |
| 01/11/2007 | WO2007004775A1 Light emitting diode and method of fabricating the same |
| 01/11/2007 | WO2007004666A1 Thin film transistor, wiring board and method for manufacturing such thin film transistor and wiring board |
| 01/11/2007 | WO2007004137A2 Electronic device |
| 01/11/2007 | WO2007003341A1 Method for the forgery-proof identification of individual electronic subassemblies |
| 01/11/2007 | WO2007003226A1 Sensor for a hardware protection system for sensitive electronic-data modules protecting against external manipulations |
| 01/11/2007 | WO2007003224A1 Compensation for parasitic coupling between rf or microwave transistors in the same package |
| 01/11/2007 | WO2007003141A1 Coaxial opto-electronic device having small form factor insulating structure |
| 01/11/2007 | WO2006103620A3 Carbon nanotube bond pad srtucture and manufacturing method thereof |
| 01/11/2007 | WO2006074148A3 Method and structure for reducing parasitic influences of deflection devices on spatial light modulators |
| 01/11/2007 | US20070010601 Having cation and silicate anion moieties; flowability in presence of large quantities of filler; rapid curing; storage stability; reliable, heat resistant encapsulation; solder cracking and moisture resistance devices |
| 01/11/2007 | US20070010087 Method of manufacturing a semiconductor wafer device having separated conductive patterns in peripheral area |
| 01/11/2007 | US20070010034 Deposition stop time detection apparatus and methods for fabricating copper using the same |
| 01/11/2007 | US20070008704 Package structure for a semiconductor device |
| 01/11/2007 | US20070008701 Heat-dissipating device |
| 01/11/2007 | US20070008534 Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing |
| 01/11/2007 | US20070008238 RFID device and method of making |
| 01/11/2007 | US20070007917 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 01/11/2007 | US20070007672 Package film, package of electrode member, and stand for package |
| 01/11/2007 | US20070007671 Semiconductor device and method of manufacturing the same |
| 01/11/2007 | US20070007670 Reworkable bond pad structure |
| 01/11/2007 | US20070007669 Wire-bonding method and semiconductor package using the same |
| 01/11/2007 | US20070007668 Microelectronic assembly with underchip optical window, and method for forming same |
| 01/11/2007 | US20070007667 Electronic package having a sealing structure on predetermined area, and the method thereof |
| 01/11/2007 | US20070007666 Substrate for manufacturing semiconductor device, semiconductor device manufacturing method |
| 01/11/2007 | US20070007665 Structure and method for producing multiple size interconnections |
| 01/11/2007 | US20070007664 Semiconductor package with molded back side and method of fabricating the same |
| 01/11/2007 | US20070007663 Semiconductor package having dual interconnection form and manufacturing method thereof |
| 01/11/2007 | US20070007662 Semiconductor device |
| 01/11/2007 | US20070007661 Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna |
| 01/11/2007 | US20070007660 Mask etch processing apparatus |
| 01/11/2007 | US20070007659 Seedless wirebond pad plating |
| 01/11/2007 | US20070007658 Method of manufacturing interconnecting structure with vias |
| 01/11/2007 | US20070007657 Methods for forming conductive vias in a substrate and electronic devices and systems including an at least partially reversed oxidation injury at an interface between a conductive via and a conductive interconnect structure |
| 01/11/2007 | US20070007656 Semiconductor device and methods thereof |
| 01/11/2007 | US20070007655 Semiconductor device |
| 01/11/2007 | US20070007654 Metal line of semiconductor device and method for forming thereof |
| 01/11/2007 | US20070007653 Interconnects with improved reliability |
| 01/11/2007 | US20070007652 Stack type package |
| 01/11/2007 | US20070007651 Semiconductor device |
| 01/11/2007 | US20070007650 Driver device and display device |
| 01/11/2007 | US20070007649 Low cte substrates for use with low-k flip-chip package devices |
| 01/11/2007 | US20070007648 Semiconductor device protective structure and method for fabricating the same |
| 01/11/2007 | US20070007647 High frequency package device |
| 01/11/2007 | US20070007646 Substrate treatment apparatus, substrate holding device, and semiconductor device manufacturing method |
| 01/11/2007 | US20070007645 Stack package and semiconductor module implementing the same |
| 01/11/2007 | US20070007644 Ball grid array package enhanced with a thermal and electrical connector |
| 01/11/2007 | US20070007643 Semiconductor multi-chip package |
| 01/11/2007 | US20070007642 Semiconductor integrated circuit device |
| 01/11/2007 | US20070007641 Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure |
| 01/11/2007 | US20070007640 Surface mount package |
| 01/11/2007 | US20070007639 Semiconductor device, manufacturing method for semiconductor device, and electronic equipment |
| 01/11/2007 | US20070007638 Memory array module mounting structure |
| 01/11/2007 | US20070007637 Multi-layered substrate assembly with vialess electrical interconnect scheme |
| 01/11/2007 | US20070007636 Parallel chip embedded printed circuit board and manufacturing method thereof |
| 01/11/2007 | US20070007635 Self aligned metal gates on high-k dielectrics |
| 01/11/2007 | US20070007634 Method for manufacturing semiconductor chip package |
| 01/11/2007 | US20070007633 Lead frame, resin-encapsulated semiconductor device, and method of producing the same |
| 01/11/2007 | US20070007632 Optical package with double formed leadframe |
| 01/11/2007 | US20070007631 Advanced leadframe |
| 01/11/2007 | US20070007630 Switching element for a pixel electrode and methods for fabricating the same |
| 01/11/2007 | US20070007629 Integrated circuit power supply network |
| 01/11/2007 | US20070007628 Electron-beam treated CDO films |
| 01/11/2007 | US20070007623 Method to fabricate horizontal air columns underneath metal inductor |
| 01/11/2007 | US20070007616 Semiconductor structure |
| 01/11/2007 | US20070007599 Semiconductor device |
| 01/11/2007 | US20070007598 System and method for ESD protection |
| 01/11/2007 | US20070007597 ESD structure having different thickness gate oxides |
| 01/11/2007 | US20070007595 Semiconductor device with effective heat-radiation |
| 01/11/2007 | US20070007567 Semiconductor substrate and production process thereof |
| 01/11/2007 | US20070007551 Semiconductor integrated circuit |
| 01/11/2007 | US20070007523 Active matrix substrate |
| 01/11/2007 | US20070007521 Semiconductor device and test method of semiconductor device |
| 01/11/2007 | US20070007520 Display substrate, method of manufacturing the same and display apparatus having the same |
| 01/11/2007 | US20070007519 Failure prediction for parallel mosfets |
| 01/11/2007 | US20070007517 Cavity ball grid array apparatus having improved inductance characteristics |