| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/17/2007 | CN1897285A Thin film transistor array panel and fabrication |
| 01/17/2007 | CN1897281A Semiconductor memory apparatus having improved charge retention as a result of bit line shielding |
| 01/17/2007 | CN1897279A Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus |
| 01/17/2007 | CN1897277A 半导体装置 Semiconductor device |
| 01/17/2007 | CN1897275A 半导体集成电路装置 The semiconductor integrated circuit device |
| 01/17/2007 | CN1897271A Electrostatic-discharging protective component structure |
| 01/17/2007 | CN1897270A Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate |
| 01/17/2007 | CN1897269A Wire structure, method of forming wire, thin film transistor substrate, and method of manufacturing thin film transistor substrate |
| 01/17/2007 | CN1897268A 半导体装置 Semiconductor device |
| 01/17/2007 | CN1897267A A semiconductor device and method for manufacturing the semiconductor device |
| 01/17/2007 | CN1897266A Semiconductor wafer and semiconductor device formed thereby |
| 01/17/2007 | CN1897265A Interconnection device including one or more embedded vias and method of producing the same |
| 01/17/2007 | CN1897264A Package substrate |
| 01/17/2007 | CN1897263A Polygonal, rounded, and circular flip chip ball grid array board |
| 01/17/2007 | CN1897262A Light-emitting diodes surface-adhered foundation support and its production |
| 01/17/2007 | CN1897261A 半导体装置 Semiconductor device |
| 01/17/2007 | CN1897260A 散热器 Heat sink |
| 01/17/2007 | CN1897259A High frequency package device |
| 01/17/2007 | CN1897249A Method of manufacturing bit-line in a semiconductor device |
| 01/17/2007 | CN1897247A Method and apparatus for semiconductor element and the element |
| 01/17/2007 | CN1897245A Semiconductor device and manufacturing method |
| 01/17/2007 | CN1897241A Semiconductor device and a manufacturing method of the same |
| 01/17/2007 | CN1897240A Multi-chip device and method for producing a multi-chip device |
| 01/17/2007 | CN1897238A Chip packing structure and method |
| 01/17/2007 | CN1897237A Radiating semiconductor packer and its production |
| 01/17/2007 | CN1896697A Gas flow measuring apparatus |
| 01/17/2007 | CN1896674A Improvement of metal radiating fin radiating speed by nano-carbon tube coating |
| 01/17/2007 | CN1295950C Electronic device with heat generating parts and heat absorbing parts |
| 01/17/2007 | CN1295874C Improved emitter turn-off thyristors and their drive circuits |
| 01/17/2007 | CN1295788C Semiconductor device |
| 01/17/2007 | CN1295786C Alignment of metal wire with cap in multi-stage semiconductor structure and formation of interconnection |
| 01/17/2007 | CN1295785C Gasket area arrangement |
| 01/17/2007 | CN1295784C Layout method for miniaturized memory array area |
| 01/17/2007 | CN1295783C 电子装置 Electronic devices |
| 01/17/2007 | CN1295782C Sintered heat radiator |
| 01/17/2007 | CN1295781C Base plate for encapsulating semiconductor and semiconductor device |
| 01/17/2007 | CN1295780C Semiconductor device formed by mounting chip on support substrate and support substrate thereof |
| 01/17/2007 | CN1295777C Method for fabricating photolithographic supporting hollow bridge structure and a set of interlocking structure |
| 01/17/2007 | CN1295772C Semiconductor epitaxial wafer and method for measuring withstand voltage thereof |
| 01/17/2007 | CN1295771C Flip chip interconnection using no clean flux |
| 01/17/2007 | CN1295770C Electronic interconnect devices and methods of making the same and coaxial electrical bonding pad |
| 01/17/2007 | CN1295769C 半导体器件 Semiconductor devices |
| 01/17/2007 | CN1295767C Semiconductor package and cutting groove forming method and flash eliminating method thereof |
| 01/17/2007 | CN1295766C Electronic sealer with three-dimensional stack and assembling method thereof |
| 01/17/2007 | CN1295761C Method of mfg. semiconductor device for improving adhesion property of copper metallic butt barrier layer |
| 01/17/2007 | CN1295756C Method of forming tungsten film on barrier film |
| 01/17/2007 | CN1295748C Metal-insulator-metal capacitor in copper |
| 01/17/2007 | CN1295746C Semiconductor device and its manufacturing method and testing method of semiconductor device |
| 01/17/2007 | CN1295701C Voice code method and decode device and voice transmission method |
| 01/17/2007 | CN1295646C Method for connecting chip to antenna of radio frequency identification device of chip card |
| 01/17/2007 | CN1295645C Non-contact data carrier making process |
| 01/17/2007 | CN1295580C Information processing unit and cooling method thereof |
| 01/17/2007 | CN1295549C Display device and its manufacturing method |
| 01/17/2007 | CN1295508C Low temperature binding method for glass microflow control chip |
| 01/17/2007 | CN1295190C Method of producing metal-containing single-phase composition |
| 01/16/2007 | US7165232 I/O circuit placement method and semiconductor device |
| 01/16/2007 | US7164905 High frequency module |
| 01/16/2007 | US7164891 Roller construction with a sense of feel for a mobile navigation device |
| 01/16/2007 | US7164592 Semiconductor device |
| 01/16/2007 | US7164585 Thermal interface apparatus, systems, and methods |
| 01/16/2007 | US7164583 Mounting device for heat sink |
| 01/16/2007 | US7164582 Cooling system with submerged fan |
| 01/16/2007 | US7164571 Wafer stage with a magnet |
| 01/16/2007 | US7164566 Electrostatic discharge protection device and method therefore |
| 01/16/2007 | US7164399 Display device |
| 01/16/2007 | US7164314 Power amplifier module for wireless communication devices |
| 01/16/2007 | US7164210 Semiconductor package with heat sink and method for fabricating same |
| 01/16/2007 | US7164209 Methods of positioning and/or orienting nanostructures |
| 01/16/2007 | US7164208 Semiconductor device and method for manufacturing the same |
| 01/16/2007 | US7164207 Wiring structure for semiconductor device |
| 01/16/2007 | US7164206 Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer |
| 01/16/2007 | US7164205 Semiconductor carrier film, and semiconductor device and liquid crystal module using the same |
| 01/16/2007 | US7164204 Integrated circuit devices with an auxiliary pad for contact hole alignment |
| 01/16/2007 | US7164203 Methods and procedures for engineering of composite conductive by atomic layer deposition |
| 01/16/2007 | US7164202 Quad flat flip chip package and leadframe thereof |
| 01/16/2007 | US7164201 Semiconductor module with scalable construction |
| 01/16/2007 | US7164200 Techniques for reducing bowing in power transistor devices |
| 01/16/2007 | US7164199 Device packages with low stress assembly process |
| 01/16/2007 | US7164198 Multilayered substrate for semiconductor device |
| 01/16/2007 | US7164197 Containing a toughened benzocyclobutene resin and about 50% by weight of an inorganic particulate filler, resin and inorganic particulate filler being compatibilized by means of a silane coupling agent; excellent dielectrical, thermal, and mechanical properties |
| 01/16/2007 | US7164196 Semiconductor device |
| 01/16/2007 | US7164195 Semiconductor device and semiconductor device manufacturing method |
| 01/16/2007 | US7164194 BGA type semiconductor device and electronic equipment using the same |
| 01/16/2007 | US7164193 Optical semiconductor apparatus |
| 01/16/2007 | US7164192 Semiconductor die package with reduced inductance and reduced die attach flow out |
| 01/16/2007 | US7164191 Low relative permittivity SiOx film including a porous material for use with a semiconductor device |
| 01/16/2007 | US7164190 Field effect transistor |
| 01/16/2007 | US7164188 Buried conductor patterns formed by surface transformation of empty spaces in solid state materials |
| 01/16/2007 | US7164149 Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method |
| 01/16/2007 | US7164085 Multilayer wiring board including stacked via structure |
| 01/16/2007 | US7164077 Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags |
| 01/16/2007 | US7163973 Molding material epoxy resins for composites formed by molding for electronics |
| 01/16/2007 | US7163894 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same |
| 01/16/2007 | US7163893 Advanced barrier liner formation for vias |
| 01/16/2007 | US7163889 Film for copper diffusion barrier |
| 01/16/2007 | US7163884 Semiconductor device and fabrication method thereof |
| 01/16/2007 | US7163880 Gate stack and gate stack etch sequence for metal gate integration |
| 01/16/2007 | US7163870 Semiconductor integrated circuit device |
| 01/16/2007 | US7163854 Fabrication method of a semiconductor device |
| 01/16/2007 | US7163847 Method of making circuitized substrate |