| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/18/2007 | US20070013063 Self alignment features for an electronic assembly |
| 01/18/2007 | US20070013062 Semiconductor device |
| 01/18/2007 | US20070013061 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| 01/18/2007 | US20070013060 Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation |
| 01/18/2007 | US20070013059 Semiconductor power module with SIC power diodes and method for its production |
| 01/18/2007 | US20070013058 Packaging chip having interconnection electrodes directly connected to plural wafers and fabrication method therefor |
| 01/18/2007 | US20070013057 Multicolor LED assembly with improved color mixing |
| 01/18/2007 | US20070013056 Tape wiring substrate and chip-on-film package using the same |
| 01/18/2007 | US20070013055 Chip cooling |
| 01/18/2007 | US20070013054 Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages |
| 01/18/2007 | US20070013053 Semiconductor device and method for manufacturing a semiconductor device |
| 01/18/2007 | US20070013052 MEMS packaging method for enhanced EMI immunity using flexible substrates |
| 01/18/2007 | US20070013051 Multichip circuit module and method for the production thereof |
| 01/18/2007 | US20070013050 Structure of an over-current protection device and method for manufacturing the same |
| 01/18/2007 | US20070013049 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
| 01/18/2007 | US20070013048 Electronic parts packaging structure and method of manufacturing the same |
| 01/18/2007 | US20070013047 Enhanced PGA Interconnection |
| 01/18/2007 | US20070013046 Semiconductor substrate, method for producing it, and method for producing a circuit module |
| 01/18/2007 | US20070013045 Printed circuit board for thermal dissipation and electronic device using the same |
| 01/18/2007 | US20070013044 Packaged integrated circuits and methods of producing thereof |
| 01/18/2007 | US20070013043 Chip package without core and stacked chip package structure thereof |
| 01/18/2007 | US20070013042 Electronic module assembly with heat spreader |
| 01/18/2007 | US20070013041 Flexible wiring board and flex-rigid wiring board |
| 01/18/2007 | US20070013040 Packaging of a microchip device |
| 01/18/2007 | US20070013039 Package substrate and semiconductor package using the same |
| 01/18/2007 | US20070013038 Semiconductor package having pre-plated leads and method of manufacturing the same |
| 01/18/2007 | US20070013037 Monolithic integrated circuit with integrated interference suppression device |
| 01/18/2007 | US20070013036 MEMS package using flexible substrates, and method thereof |
| 01/18/2007 | US20070013035 Oxide interface with improved oxygen bonding |
| 01/18/2007 | US20070013034 Semiconductor device and method for manufacturing the same |
| 01/18/2007 | US20070013022 Semiconductor device and method for producing the same |
| 01/18/2007 | US20070013011 Semiconductor device having guard ring and manufacturing method thereof |
| 01/18/2007 | US20070012991 Semiconductor memory device including multi-layer gate structure |
| 01/18/2007 | US20070012981 Semiconductor memory device including multi-layer gate structure |
| 01/18/2007 | US20070012947 Direct FET device for high frequency application |
| 01/18/2007 | US20070012923 Electronic circuit |
| 01/18/2007 | US20070012917 Pixel with transfer gate with no isolation edge |
| 01/18/2007 | US20070012661 Silicon nitride passivation layers having oxidized interface |
| 01/18/2007 | US20070012655 Micro-package, multi-stack micro-package, and manufacturing method therefor |
| 01/18/2007 | US20070012477 Electronic component package including joint material having higher heat conductivity |
| 01/18/2007 | DE202006017047U1 Gehäuse für Chip mit einem Schutz gegen Überlauf des Versiegelungskunststoffes Housing for chip with protection against overflow of the sealing plastic |
| 01/18/2007 | DE202005014073U1 Chipträgerbaugruppe Chip carrier assembly |
| 01/18/2007 | DE112005000414T5 Miniaturisierte fluidgekühlte Wärmesenke mit integraler Heizeinrichtung Miniaturized fluid cooled heat sink with integral heater |
| 01/18/2007 | DE112004001975T5 Verfahren und Anordnung zur Verbindung von Teststrukturen oder Leitungsarrays zur Überwachung der Herstellung integrierter Schaltungen Method and arrangement for connection of test structures or line arrays for monitoring the manufacture of integrated circuits |
| 01/18/2007 | DE10343578B4 Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen und Verfahren zu seiner Herstellung Rewiring substrate strip with a plurality of semiconductor device positions and process for its preparation |
| 01/18/2007 | DE102006024652A1 Tape automated bonding (TAB) package for flexibly connecting e.g. glass panel, has outer lead section with end portion connected to portion of connection pattern of glass panel in such way that transition region overlays end region |
| 01/18/2007 | DE102005058880A1 Verfahren zur Herstellung eines Substrates für eine Baugruppe einer Licht emittierenden Halbleitervorrichtung A method of manufacturing a substrate for an assembly of a light-emitting semiconductor device |
| 01/18/2007 | DE102005032668A1 Radiator unit for electronic component, e.g. central processing unit of computer, comprises cooling fins each having different thickness from first end to second end |
| 01/18/2007 | DE102005031836A1 Halbleiterleistungsmodul mit SiC-Leistungsdioden und Verfahren zur Herstellung desselben The semiconductor power module of the same with SiC power diode and methods for preparing |
| 01/18/2007 | DE102005023119A1 Maskenprogrammierbares Logikmakro Mask Programmable logic macro |
| 01/18/2007 | DE10103186B4 Verfahren zur Herstellung eines elektronischen Bauteils mit einem Halbleiter-Chip A method of manufacturing an electronic component comprising a semiconductor chip |
| 01/18/2007 | CA2613987A1 Sealing agent for photoelectric converter and photoelectric converter using same |
| 01/17/2007 | EP1744609A2 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 01/17/2007 | EP1744606A2 Printed circuit board and method for producing the printed circuit board |
| 01/17/2007 | EP1744453A1 Surface acoustic wave device |
| 01/17/2007 | EP1744373A1 Holding and connection device for optoelectronic components like LEDs of the PLCC2 or PLCC4 type |
| 01/17/2007 | EP1744368A2 Photodetection system and module |
| 01/17/2007 | EP1744363A1 Monolithic integrated circuit with integrated noise reduction |
| 01/17/2007 | EP1744362A2 Semiconductor device and electronic apparatus |
| 01/17/2007 | EP1744361A2 Semiconductor device |
| 01/17/2007 | EP1744360A2 Heatsink with adapted backplate |
| 01/17/2007 | EP1744358A1 Semiconductor device and manufacturing method |
| 01/17/2007 | EP1744353A1 Chip carrier substrate made if silicon with through-contacts and method for its manufacture |
| 01/17/2007 | EP1743949A1 Production of high-purity zirconium or hafnium metal and powder for target and film applications |
| 01/17/2007 | EP1743380A1 Split-channel antifuse array architecture |
| 01/17/2007 | EP1743371A2 Integrated circuit chip with electrostatic discharge protection device |
| 01/17/2007 | EP1743370A2 Three dimensional six surface conformal die coating |
| 01/17/2007 | EP1743369A2 Micropede stacked die component assembly |
| 01/17/2007 | EP1743366A2 Wiring structure for integrated circuit with reduced intralevel capacitance |
| 01/17/2007 | EP1742895A2 Preparation of cement films by strip casting |
| 01/17/2007 | EP1451873A4 Wearable biomonitor with flexible thinned integrated circuit |
| 01/17/2007 | EP1289728B1 Encapsulation using microcellular foamed materials |
| 01/17/2007 | EP1142849B1 Silicon nitride composite substrate |
| 01/17/2007 | EP1138091B1 Conductive structure based on poly-3,4-alkenedioxythiophene (pedot) and polystyrenesulfonic acid (pss) |
| 01/17/2007 | CN2860013Y Fixing apparatus for heat conducting plate |
| 01/17/2007 | CN2860012Y Fixing frame for radiating fan |
| 01/17/2007 | CN2859806Y Cross fluid flow pin-rib array minisize heat exchanger |
| 01/17/2007 | CN2859805Y Heat dissipation shelf for data access unit |
| 01/17/2007 | CN2859804Y Heat sink for large power semiconductor device |
| 01/17/2007 | CN2859161Y Water-cooled connector for gate circuit transistor valve assembly |
| 01/17/2007 | CN1898806A Semiconductor module |
| 01/17/2007 | CN1898797A Wafer with optical control modules in ic fields |
| 01/17/2007 | CN1898796A Wafer with optical control modules in dicing paths |
| 01/17/2007 | CN1898795A An integrated circuit package substrate having a thin film capacitor structure |
| 01/17/2007 | CN1898794A Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 01/17/2007 | CN1898793A Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit |
| 01/17/2007 | CN1898786A Semiconductor device and method of manufacturing thereof |
| 01/17/2007 | CN1898774A Small volume process chamber with hot inner surfaces |
| 01/17/2007 | CN1898770A Method of producing an element comprising an electrical conductor encircled by magnetic material |
| 01/17/2007 | CN1898522A 热交换器 Heat exchanger |
| 01/17/2007 | CN1898509A Method and apparatus for two-phase start-up operation |
| 01/17/2007 | CN1898291A Curable resin composition, overcoats, and process for formation thereof |
| 01/17/2007 | CN1898150A Method for containing a device and a corresponding device |
| 01/17/2007 | CN1897804A Auxiliary radiator |
| 01/17/2007 | CN1897803A Chimney structure of radiating fin |
| 01/17/2007 | CN1897789A Semiconductor device |
| 01/17/2007 | CN1897645A Micro camera module and method of manufacturing the same |
| 01/17/2007 | CN1897300A Display device and manufacturing method of the display device |
| 01/17/2007 | CN1897297A Display appartus and manufacturing method thereof for reducing wiring number |
| 01/17/2007 | CN1897296A Organic electroluminescent device and its manufacture method |