| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/23/2007 | US7167071 Inductive device and method for producing the same |
| 01/23/2007 | US7167043 Decoupling circuit for co-packaged semiconductor devices |
| 01/23/2007 | US7167015 Active cooling to reduce leakage power |
| 01/23/2007 | US7167014 Method for testing using a universal wafer carrier for wafer level die burn-in |
| 01/23/2007 | US7167012 Universal wafer carrier for wafer level die burn-in |
| 01/23/2007 | US7166926 Method for producing semiconductor device and semiconductor device |
| 01/23/2007 | US7166925 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same |
| 01/23/2007 | US7166924 Electronic packages with dice landed on wire bonds |
| 01/23/2007 | US7166923 Semiconductor device, electro-optical unit, and electronic apparatus |
| 01/23/2007 | US7166922 Continuous metal interconnects |
| 01/23/2007 | US7166921 Consists of, by atom %, 0.2 to 1.5% of Ge, 0.2 to 2.5% of Ni and the balance essentially of Al, and the total amount of Ge and Ni is not more than 3.0%; has lower electrical resistance and high reliability, and is applicable to high definition TVs having a big size and various FPDs |
| 01/23/2007 | US7166920 Electronic component, mounted structure, electro-optical device, and electronic device |
| 01/23/2007 | US7166919 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 01/23/2007 | US7166918 Semiconductor package assembly and method for electrically isolating modules |
| 01/23/2007 | US7166917 Semiconductor package having passive component disposed between semiconductor device and substrate |
| 01/23/2007 | US7166916 Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus |
| 01/23/2007 | US7166915 Multi-chip module system |
| 01/23/2007 | US7166914 Semiconductor package with heat sink |
| 01/23/2007 | US7166913 Heat dissipation for heat generating element of semiconductor device and related method |
| 01/23/2007 | US7166912 Isolated thermal interface |
| 01/23/2007 | US7166911 Packaged microchip with premolded-type package |
| 01/23/2007 | US7166910 Miniature silicon condenser microphone |
| 01/23/2007 | US7166909 Method and apparatus for molding module electronic devices and a module electronic device molded thereby |
| 01/23/2007 | US7166908 Optical device |
| 01/23/2007 | US7166907 Image sensor module with substrate and frame and method of making the same |
| 01/23/2007 | US7166906 Package with barrier wall and method for manufacturing the same |
| 01/23/2007 | US7166905 Stacked paddle micro leadframe package |
| 01/23/2007 | US7166898 Flip chip FET device |
| 01/23/2007 | US7166882 Semiconductor device and method for fabricating the same |
| 01/23/2007 | US7166876 MOSFET with electrostatic discharge protection structure and method of fabrication |
| 01/23/2007 | US7166807 Current sensor |
| 01/23/2007 | US7166545 Production method for semiconductor device |
| 01/23/2007 | US7166532 Method for forming a contact using a dual damascene process in semiconductor fabrication |
| 01/23/2007 | US7166516 Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN or SiCN |
| 01/23/2007 | US7166504 Semiconductor device manufacturing method |
| 01/23/2007 | US7166497 Electronic component package and method of manufacturing same |
| 01/23/2007 | US7166493 Package with integrated inductor and/or capacitor |
| 01/23/2007 | US7166492 Integrated circuit carrier apparatus method and system |
| 01/23/2007 | US7166491 Thermoplastic fluxing underfill composition and method |
| 01/23/2007 | US7166490 Semiconductor device with terminals, and method of manufacturing the same |
| 01/23/2007 | US7166204 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated. |
| 01/23/2007 | US7165978 Socket for semiconductor device |
| 01/23/2007 | US7165899 Package for housing optical semiconductor element and optical semiconductor apparatus |
| 01/23/2007 | US7165603 Tower type heat sink |
| 01/23/2007 | US7165601 Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device |
| 01/23/2007 | US7165440 Frequency characteristics measuring method and device for acceleration sensor |
| 01/23/2007 | US7165316 Methods for manufacturing resistors using a sacrificial layer |
| 01/18/2007 | WO2007009027A2 Semiconductor device and method for manufacturing a semiconductor device |
| 01/18/2007 | WO2007009024A2 Folded frame carrier for mosfet bga |
| 01/18/2007 | WO2007008369A1 Tin electrodeposits having properties or characteristics that minimize tin whisker growth |
| 01/18/2007 | WO2007008308A1 Mmic having back-side multi-layer signal routing |
| 01/18/2007 | WO2007008171A2 Integrated circuit device and method of manufacturing thereof |
| 01/18/2007 | WO2007007843A1 Epoxy resin composition for encapsulation and electronic part device |
| 01/18/2007 | WO2007007830A1 Mounted board, mounted body, and electronic device using same |
| 01/18/2007 | WO2007007714A1 Diode element device for solar cell |
| 01/18/2007 | WO2007007602A1 Heat dissipation device and power module |
| 01/18/2007 | WO2007007595A1 Semiconductor device |
| 01/18/2007 | WO2007007458A1 Composite substrate and method for manufacture thereof |
| 01/18/2007 | WO2007007451A1 Multilayer wiring board and fabrication method thereof |
| 01/18/2007 | WO2007007447A1 Multilayer wiring structure and method for forming same |
| 01/18/2007 | WO2007007445A1 Semiconductor device and method for manufacturing same |
| 01/18/2007 | WO2007007398A1 Flat display device |
| 01/18/2007 | WO2007007239A2 Semiconductor device |
| 01/18/2007 | WO2007007233A2 Package, method of manufacturing the same and use thereof |
| 01/18/2007 | WO2007006483A1 Method for the production of a functional assembly, and functional assembly |
| 01/18/2007 | WO2006092754A3 A method of manufacturing a semiconductor packages and packages made |
| 01/18/2007 | WO2006009772A3 Multi-frequency noise suppression capacitor set |
| 01/18/2007 | WO2005122250A3 High power mcm package with improved planarity and heat dissipation |
| 01/18/2007 | US20070015352 Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads |
| 01/18/2007 | US20070015351 Process or making a semiconductor device having a roughened surface |
| 01/18/2007 | US20070015340 Method and structure for interfacing electronic devices |
| 01/18/2007 | US20070015316 Folded frame carrier for MOSFET BGA |
| 01/18/2007 | US20070015314 Adhesive/Spacer Island Structure for Multiple Die Package |
| 01/18/2007 | US20070015312 Method for forming bump protective collars on a bumped wafer |
| 01/18/2007 | US20070015297 Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing |
| 01/18/2007 | US20070014090 Method and Apparatus for Cooling Heat-Generating Structure |
| 01/18/2007 | US20070013859 Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same |
| 01/18/2007 | US20070013433 Temperature compensation for internal inductor resistance |
| 01/18/2007 | US20070013394 Dual feedback control system for maintaining the temperature of an ic-chip near a set-point |
| 01/18/2007 | US20070013084 Bumped die and wire bonded board-on-chip package |
| 01/18/2007 | US20070013083 Semiconductor device and a manufacturing method of the same |
| 01/18/2007 | US20070013082 Semiconductor device and method for manufacturing semiconductor device |
| 01/18/2007 | US20070013081 Electronic module with stacked ic chip structure |
| 01/18/2007 | US20070013080 Voltage regulators and systems containing same |
| 01/18/2007 | US20070013079 Die pad arrangement and bumpless chip package applying the same |
| 01/18/2007 | US20070013078 Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate |
| 01/18/2007 | US20070013077 Environmentally friendly |
| 01/18/2007 | US20070013076 Semiconductor device and method of manufacturing thereof |
| 01/18/2007 | US20070013075 Modular containment structure |
| 01/18/2007 | US20070013074 Integrated circuit device and electronic instrument |
| 01/18/2007 | US20070013073 Method and structure for reduction of soft error rates in integrated circuits |
| 01/18/2007 | US20070013072 Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof |
| 01/18/2007 | US20070013071 Probing pads in kerf area for wafer testing |
| 01/18/2007 | US20070013070 Semiconductor devices and methods of manufacture thereof |
| 01/18/2007 | US20070013069 Wiring structure and method for manufacturing the same |
| 01/18/2007 | US20070013068 Integrated circuit package and method with an electrical component embedded in a substrate via |
| 01/18/2007 | US20070013067 Electronic component mounting method and apparatus |
| 01/18/2007 | US20070013066 Semiconductor package and fabrication method thereof |
| 01/18/2007 | US20070013065 Semiconductor device |
| 01/18/2007 | US20070013064 Semiconductor device and electronic apparatus |