| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/24/2007 | EP1746644A2 Methods of forming local interconnects and conductive lines, and resulting structure |
| 01/24/2007 | EP1746636A1 IC chip mounting method |
| 01/24/2007 | EP1746122A1 Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation |
| 01/24/2007 | EP1745509A1 A screened electrical device and a process for manufacturing the same |
| 01/24/2007 | EP1745508A1 Semiconductor integrated circuit including metal mesh structure |
| 01/24/2007 | EP1745507A1 Twin fin arrayed cooling devices |
| 01/24/2007 | EP1745506A2 Semiconductor die attachment for high vaccum tubes |
| 01/24/2007 | EP1745418A1 Radio-frequency system in package including antenna |
| 01/24/2007 | EP1745330A2 Cooling for light emitting diode |
| 01/24/2007 | EP1745256A2 Multiple evaporator heat pipe assisted heat sink |
| 01/24/2007 | EP1744874A1 Resin-impregnated flexible graphite articles |
| 01/24/2007 | EP1461816B1 Mems device having contact and standoff bumps and related methods |
| 01/24/2007 | EP1460749B1 Multi-phase alternating-current rotational electric machine |
| 01/24/2007 | EP1403228B1 Ceramic component and production method therefor |
| 01/24/2007 | EP1393605B1 Circuit board with at least one electronic component |
| 01/24/2007 | EP1356512B1 Direct heatpipe attachment to die using center point loading |
| 01/24/2007 | EP1183725B1 Semiconductor device and method of manufacturing same |
| 01/24/2007 | EP1061570B1 Semiconductor device with bumped contacts and manufacturing method thereof |
| 01/24/2007 | EP1040521B1 Method of operating a silicon oxide insulator (soi) semiconductor having selectively linked body |
| 01/24/2007 | CN2862611Y Heat conducting medium protecting cover structure for heat dissipating device |
| 01/24/2007 | CN2862609Y Radiator unit |
| 01/24/2007 | CN2862326Y Heat radiator |
| 01/24/2007 | CN2862325Y Packaging heat dissipating structure for micro-meter size chip |
| 01/24/2007 | CN1902756A Array capacitors with voids to enable a full-grid socket |
| 01/24/2007 | CN1902755A Electrical connection of components |
| 01/24/2007 | CN1902754A A cooling system with a bubble pump |
| 01/24/2007 | CN1902753A Cooling system for an electronic component |
| 01/24/2007 | CN1902752A Variable density graphite foam heat sink |
| 01/24/2007 | CN1902751A Detachable on package voltage regulation module |
| 01/24/2007 | CN1901790A Heat radiator |
| 01/24/2007 | CN1901366A Method for matching differential through hole impedance and differential conductor impedance |
| 01/24/2007 | CN1901240A Method for making LED heat radiator |
| 01/24/2007 | CN1901237A Super radiation light emitting tube heat insulation package body and its package method |
| 01/24/2007 | CN1901235A Surface mount type photo-interrupter and method for manufacturing the same |
| 01/24/2007 | CN1901221A Organic light emitting display |
| 01/24/2007 | CN1901216A 图像传感器 Image Sensor |
| 01/24/2007 | CN1901214A Method and apparatus for reducing optical crosstalk in CMOS image sensors |
| 01/24/2007 | CN1901212A Optical device, optical device apparatus, camera module, and optical device manufacturing method |
| 01/24/2007 | CN1901211A Semiconductor device and method of manufacturing the same |
| 01/24/2007 | CN1901208A Array substrate for display device |
| 01/24/2007 | CN1901204A Thin film transistor substrate, display device, and method of fabricating the same |
| 01/24/2007 | CN1901200A Nonvolatile memory devices and methods of fabricating the same |
| 01/24/2007 | CN1901193A 半导体装置 Semiconductor device |
| 01/24/2007 | CN1901192A Esd protection device in high voltage and manufacturing method for the same |
| 01/24/2007 | CN1901190A Side view led with improved arrangement of protection device |
| 01/24/2007 | CN1901189A Plane flip-chip LED integrated chip and producing method |
| 01/24/2007 | CN1901187A Semiconductor device |
| 01/24/2007 | CN1901186A Device and method for emitting output light using multiple light sources with photoluminescent material |
| 01/24/2007 | CN1901185A Transient voltage protection apparatus, material and manufacturing methods |
| 01/24/2007 | CN1901184A 半导体器件 Semiconductor devices |
| 01/24/2007 | CN1901183A Substrate, smart card modules and methods for fabricating the same |
| 01/24/2007 | CN1901182A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/24/2007 | CN1901181A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/24/2007 | CN1901180A Package substrate |
| 01/24/2007 | CN1901179A Tape wiring substrate and chip-on-film package using the same |
| 01/24/2007 | CN1901178A Relay board and semiconductor device having the relay board |
| 01/24/2007 | CN1901177A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/24/2007 | CN1901176A Air-tightness chamber heat radiation structure and its producing method |
| 01/24/2007 | CN1901175A Method for producing heat radiator |
| 01/24/2007 | CN1901174A Heat pipe radiator |
| 01/24/2007 | CN1901173A Chip package structure |
| 01/24/2007 | CN1901172A Semiconductor wafer and process for producing a semiconductor wafer |
| 01/24/2007 | CN1901171A 半导体器件 Semiconductor devices |
| 01/24/2007 | CN1901170A Semiconductor device |
| 01/24/2007 | CN1901167A Semiconductor device and method of manufacturing thereof |
| 01/24/2007 | CN1901163A Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 01/24/2007 | CN1901162A Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 01/24/2007 | CN1901161A Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 01/24/2007 | CN1901149A Semiconductor device and method of manufacturing the same |
| 01/24/2007 | CN1901146A Semiconductor device and manufacturing method of the same |
| 01/24/2007 | CN1900725A Lithographic contact elements |
| 01/24/2007 | CN1297046C Semiconductor light-emitting device and its manufacturing method |
| 01/24/2007 | CN1297010C Semiconductor device with analog capacitor and its production method |
| 01/24/2007 | CN1297002C 静电放电保护电路 Electrostatic discharge protection circuit |
| 01/24/2007 | CN1297001C Structure and method for reducing thermal-mechanical stress in superposed through hole |
| 01/24/2007 | CN1297000C Interconnection structure containing stress regulating covering and its manufacturing method |
| 01/24/2007 | CN1296999C Semiconductor integrated circuit with shortened pad pitch |
| 01/24/2007 | CN1296998C Semiconductor device, semiconductor package, and method for testing semiconductor device |
| 01/24/2007 | CN1296997C Cu-pad/bonded/cu-wire with self-passivating cu-alloys |
| 01/24/2007 | CN1296996C Refrigeration system of adsorptive refrigerator |
| 01/24/2007 | CN1296995C Environmentally isolated enclosure for electronic components |
| 01/24/2007 | CN1296994C A thermal interfacial material and method for manufacturing same |
| 01/24/2007 | CN1296993C Semiconductor device and liquid crystal module using the same, and method for producing liquid crystal module |
| 01/24/2007 | CN1296988C Method and wafer for maintaining ultra clean bonding pads on a wafer |
| 01/24/2007 | CN1296981C Method for producing semiconductor device |
| 01/24/2007 | CN1296980C Method of forming a bond pad with groove |
| 01/24/2007 | CN1296765C Method for producing thin film transistor liquid crystal display panel |
| 01/24/2007 | CN1296715C Semiconductor device |
| 01/24/2007 | CN1296671C Heat-transfer apparatus and electronic apparatus |
| 01/24/2007 | CN1296521C Composition and method for tinplating |
| 01/24/2007 | CN1296450C Binder and electric apparatus |
| 01/24/2007 | CN1296399C Photopolymerizable composition and use thereof |
| 01/24/2007 | CN1296301C Lead-free electroplated silver slurry for outer electrode of multilayer chip element and its preparation melthod |
| 01/23/2007 | US7167778 Electronic device cooling apparatus and method for cooling electronic device with temperature prediction |
| 01/23/2007 | US7167374 Circuit substrate and electronic equipment |
| 01/23/2007 | US7167370 Fastener for mounting heat-radiator to electronic device |
| 01/23/2007 | US7167367 Heat sink clip |
| 01/23/2007 | US7167364 Cooler with blower between two heatsinks |
| 01/23/2007 | US7167350 Design implementation to suppress latchup in voltage tolerant circuits |
| 01/23/2007 | US7167073 Semiconductor device |