| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/25/2007 | US20070020811 Method and apparatus for attaching microelectronic substrates and support members |
| 01/25/2007 | US20070020810 Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate |
| 01/25/2007 | US20070020809 Semiconductor device and method of producing high contrast identification mark |
| 01/25/2007 | US20070020806 Method and structure for forming strained si for cmos devices |
| 01/25/2007 | US20070020805 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
| 01/25/2007 | US20070020785 Systems and methods for alignment of laser beam(s) for semiconductor link processing |
| 01/25/2007 | US20070019388 Device, system and electric element |
| 01/25/2007 | US20070019352 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 01/25/2007 | US20070019102 Micro camera module and method of manufacturing the same |
| 01/25/2007 | US20070018679 Semiconductor test device using leakage current and compensation system of leakage current |
| 01/25/2007 | US20070018642 Magnetic sensor |
| 01/25/2007 | US20070018539 Piezoelectric device |
| 01/25/2007 | US20070018341 Contact etching utilizing partially recessed hard mask |
| 01/25/2007 | US20070018340 Integrated circuit pad with separate probing and bonding areas |
| 01/25/2007 | US20070018339 Relay board and semiconductor device having the relay board |
| 01/25/2007 | US20070018338 Connection element for a semiconductor component and method for producing the same |
| 01/25/2007 | US20070018337 Method and apparatus for attaching microelectronic substrates and support members |
| 01/25/2007 | US20070018336 Stress and force management techniques for a semiconductor die |
| 01/25/2007 | US20070018335 Polygonal, rounded, and circular flip chip ball grid array board |
| 01/25/2007 | US20070018334 Security method for data protection |
| 01/25/2007 | US20070018333 Semiconductor packaging device and manufacture thereof |
| 01/25/2007 | US20070018332 Semiconductor device and method of manufacturing the same |
| 01/25/2007 | US20070018331 Dummy structures extending from seal ring into active circuit area of integrated circuit chip |
| 01/25/2007 | US20070018330 Semiconductor device and method of manufacturing the same |
| 01/25/2007 | US20070018329 Interconnection having dual-level or multi-level capping layer and method of forming the same |
| 01/25/2007 | US20070018328 Piezoelectric stress liner for bulk and SOI |
| 01/25/2007 | US20070018327 Semiconductor integrated circuit device and process for manufacturing the same |
| 01/25/2007 | US20070018326 Semiconductor device |
| 01/25/2007 | US20070018325 Semiconductor device and method for fabricating the same |
| 01/25/2007 | US20070018324 Wafer-level-chip-scale package and method of fabrication |
| 01/25/2007 | US20070018323 Reduced inductance in ball grid array packages |
| 01/25/2007 | US20070018322 Wafer level package and its manufacturing method |
| 01/25/2007 | US20070018321 Multi-component integrated circuit contacts |
| 01/25/2007 | US20070018320 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device |
| 01/25/2007 | US20070018319 Ball grid array package and substrate within |
| 01/25/2007 | US20070018318 Means of integrating a microphone in a standard integrated circuit process |
| 01/25/2007 | US20070018317 Semiconductor device |
| 01/25/2007 | US20070018316 Electrode, method for producing same and semiconductor device using same |
| 01/25/2007 | US20070018315 Conductive adhesive composition |
| 01/25/2007 | US20070018314 Semiconductor chip package and fabrication method thereof |
| 01/25/2007 | US20070018313 Electronic parts packaging structure and method of manufacturing the same |
| 01/25/2007 | US20070018312 Wiring substrate and semiconductor package implementing the same |
| 01/25/2007 | US20070018311 Circuit board and light souce device having same |
| 01/25/2007 | US20070018310 Semiconductor device and manufacturing method thereof |
| 01/25/2007 | US20070018308 Electronic component and electronic configuration |
| 01/25/2007 | US20070018307 Integrated circuit chip module |
| 01/25/2007 | US20070018306 Semiconductor device and method of manufacturing the same |
| 01/25/2007 | US20070018305 Packaging for high speed integrated circuits |
| 01/25/2007 | US20070018304 Composite metal column for mounting semiconductor device |
| 01/25/2007 | US20070018303 Stack package made of chip scale packages |
| 01/25/2007 | US20070018302 Planar light source device and display device provided with the same |
| 01/25/2007 | US20070018301 Semiconductor device and method of manufacturing the same |
| 01/25/2007 | US20070018300 Apparatus and method for testing a multi-stack integrated circuit package |
| 01/25/2007 | US20070018299 Memory module with stacked semiconductor devices |
| 01/25/2007 | US20070018298 Optimized multi-apparation assembly |
| 01/25/2007 | US20070018297 High-capacity memory card and method of making the same |
| 01/25/2007 | US20070018296 Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation |
| 01/25/2007 | US20070018295 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby |
| 01/25/2007 | US20070018294 Packaging for high speed integrated circuits |
| 01/25/2007 | US20070018293 Packaging for high speed integrated circuits |
| 01/25/2007 | US20070018292 Packaging for high speed integrated circuits |
| 01/25/2007 | US20070018291 Semiconductor package without chip carrier and fabrication method thereof |
| 01/25/2007 | US20070018290 Large die package structures and fabrication method therefor |
| 01/25/2007 | US20070018289 Packaging for high speed integrated circuits |
| 01/25/2007 | US20070018288 Packaging for high speed integrated circuits |
| 01/25/2007 | US20070018287 Electronic device and carrier substrate for same |
| 01/25/2007 | US20070018286 Substrate, lithographic multiple exposure method, machine readable medium |
| 01/25/2007 | US20070018280 Antifuse structure and system for closing thereof |
| 01/25/2007 | US20070018263 Semiconductor device and manufacturing method of the same |
| 01/25/2007 | US20070018260 Devices having vertically-disposed nanofabric articles and methods of making the same |
| 01/25/2007 | US20070018158 Apparatus for separating metal coating film and method for separating metal coating film |
| 01/25/2007 | US20070017662 Normal-flow heat exchanger |
| 01/25/2007 | US20070017652 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
| 01/25/2007 | US20070017650 Method and apparatus for providing a solder area on a leadframe |
| 01/25/2007 | US20070017093 Method of making an interposer with contact structures |
| 01/25/2007 | DE4329260B4 Verfahren zur Herstellung einer Verdrahtung in einem Halbleiterbauelement A process for producing a wiring in a semiconductor device |
| 01/25/2007 | DE202006013055U1 Wärmeableitungsmodul Heat dissipation module |
| 01/25/2007 | DE19927046B4 Keramik-Metall-Substrat als Mehrfachsubstrat Ceramic-metal substrate as a multiple substrate |
| 01/25/2007 | DE19756179B4 Für einen Halbleiterchip-Baustein bestimmter Leiterrahmen mit einem vorgeformten Montageplatz aus einer Epoxid-Giessverbindung For a semiconductor chip package of certain ladder frame with a preformed assembly site of an epoxy molding compound |
| 01/25/2007 | DE19713656B4 Leistungshalbleitermodul The power semiconductor module |
| 01/25/2007 | DE112004002678T5 2-Transistoren-Schmelzsicherungselement mit einzelner Polysiliziumschicht 2 transistors fuse element with single polysilicon layer |
| 01/25/2007 | DE10259221B4 Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben The same electronic component having a stack of semiconductor chips and processes for making |
| 01/25/2007 | DE10251527B4 Verfahren zur Herstellung einer Stapelanordnung eines Speichermoduls A method of manufacturing a stack structure of a memory module |
| 01/25/2007 | DE10240914B4 Schaltungsanordnung mit einem Lasttransistor und einer Strommessanordnung und Verfahren zur Ermittlung des Laststroms eines Lasttransistors sowie Verwendung eines Halbleiterbauelements Circuit arrangement having a load transistor and a current measuring arrangement and method for determining the load current of a load transistor, and the use of a semiconductor device |
| 01/25/2007 | DE10224167B4 Verfahren zur Herstellung einer Kupferleitung mit erhöhter Widerstandsfähigkeit gegen Elektromigration in einem Halbleiterelement A process for producing a copper wire with increased resistance to electromigration in a semiconductor element |
| 01/25/2007 | DE102006029457A1 Cooling arrangement for computer system, has retaining plate provided between base plate and system circuit board in area of processor, and cooling device movably connected with retaining plate by screws and springs |
| 01/25/2007 | DE102006015448A1 Wiring structure of semiconductor component has conductive tracks between chip contact spots and surface mounted outer contact spots with solder balls |
| 01/25/2007 | DE102006010085A1 Interposerstruktur, Herstellungsverfahren, Waferlevel-Stapelstruktur und Packungsstruktur Interposer structure, manufacturing process, wafer-level stacking structure and packing structure |
| 01/25/2007 | DE102006005955B4 Inline-Speichermodul Inline Memory Module |
| 01/25/2007 | DE102005033254A1 Chip-Trägersubstrat aus Silizium mit durchgehenden Kontakten und Herstellungsverfahren dafür Chip carrier substrate of silicon with through contacts, and processes for its preparation |
| 01/25/2007 | DE102005033156A1 Substrate for integrated circuit packs has chip fitted on one side, while solder balls are located on other side for connection to terminal contacts of chip |
| 01/24/2007 | EP1746866A1 Packaging chip having inductor therein |
| 01/24/2007 | EP1746654A2 High frequency electronic component |
| 01/24/2007 | EP1746653A1 Method of fabrication of background noise standards, containing nanostructures on an insulating thin film. |
| 01/24/2007 | EP1746652A1 Circuit substrate and method of manufacturing the same |
| 01/24/2007 | EP1746651A2 IC chip mounting method |
| 01/24/2007 | EP1746650A2 Packaging for high speed integrated circuits |
| 01/24/2007 | EP1746649A2 Packaging for high speed integrated circuits |
| 01/24/2007 | EP1746648A2 Packaging for high speed integrated circuits |
| 01/24/2007 | EP1746646A1 Pressure contact type rectifier |