| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/30/2007 | US7170182 Semiconductor device with reduced interconnect capacitance |
| 01/30/2007 | US7170181 Optimum padset for wire bonding RF technologies with high-Q inductors |
| 01/30/2007 | US7170180 Methods and systems for improved current sharing between parallel power semiconductors in power converters |
| 01/30/2007 | US7170179 Chip select method through double bonding |
| 01/30/2007 | US7170178 Capacitive integrated circuit structure |
| 01/30/2007 | US7170177 Semiconductor apparatus |
| 01/30/2007 | US7170176 Semiconductor device |
| 01/30/2007 | US7170175 Semiconductor device and production method thereof |
| 01/30/2007 | US7170174 Contact structure and contact liner process |
| 01/30/2007 | US7170173 Magnetically lined conductors |
| 01/30/2007 | US7170172 Semiconductor device having a roughened surface |
| 01/30/2007 | US7170171 Support ring for use with a contact pad and semiconductor device components including the same |
| 01/30/2007 | US7170170 Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package |
| 01/30/2007 | US7170169 LGA socket with EMI protection |
| 01/30/2007 | US7170168 Flip-chip semiconductor package with lead frame and method for fabricating the same |
| 01/30/2007 | US7170167 Method for manufacturing wafer level chip scale package structure |
| 01/30/2007 | US7170166 Integrated circuit ground system |
| 01/30/2007 | US7170164 Cooling system for a semiconductor device and method of fabricating same |
| 01/30/2007 | US7170163 Semiconductor device mounting structure having zigzagging part |
| 01/30/2007 | US7170162 Chip embedded package structure |
| 01/30/2007 | US7170161 In-process semiconductor packages with leadframe grid arrays |
| 01/30/2007 | US7170160 Chip structure and stacked-chip package |
| 01/30/2007 | US7170159 Low CTE substrates for use with low-k flip-chip package devices |
| 01/30/2007 | US7170158 Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture |
| 01/30/2007 | US7170157 Semiconductor package having multiple embedded chips |
| 01/30/2007 | US7170156 Laminar multi-layer piezoelectric roll component |
| 01/30/2007 | US7170155 MEMS RF switch module including a vertical via |
| 01/30/2007 | US7170154 Glass for window of semiconductor package, glass window for semiconductor package, process for production of glass window, and semiconductor package |
| 01/30/2007 | US7170153 Semiconductor device and its manufacturing method |
| 01/30/2007 | US7170152 Wafer level semiconductor package with build-up layer and method for fabricating the same |
| 01/30/2007 | US7170151 Accurate alignment of an LED assembly |
| 01/30/2007 | US7170150 Lead frame for semiconductor package |
| 01/30/2007 | US7170149 Semiconductor device and package, and method of manufacture therefor |
| 01/30/2007 | US7170148 Semi-fusible link system for a multi-layer integrated circuit and method of making same |
| 01/30/2007 | US7170147 Dissipative isolation frames for active microelectronic devices, and methods of making such dissipative isolation frames |
| 01/30/2007 | US7170146 TFT structure and method for manufacturing the same |
| 01/30/2007 | US7170145 Method of manufacturing semiconductor device, flexible substrate, and semiconductor device |
| 01/30/2007 | US7170136 High voltage ESD-protection structure |
| 01/30/2007 | US7170135 Arrangement and method for ESD protection |
| 01/30/2007 | US7170115 Semiconductor integrated circuit device and method of producing the same |
| 01/30/2007 | US7170114 Semiconductor device |
| 01/30/2007 | US7170109 Heterojunction semiconductor device with element isolation structure |
| 01/30/2007 | US7170107 IC chip having a protective structure |
| 01/30/2007 | US7170098 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
| 01/30/2007 | US7170091 Probe look ahead: testing parts not currently under a probehead |
| 01/30/2007 | US7170012 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 01/30/2007 | US7170000 Apparatus having a cooling device |
| 01/30/2007 | US7169833 shell-core polymer containing (meth)acrylate ; aromatic amine curing agent; glass transition temperature; controlling particle size; sealant for flip chips |
| 01/30/2007 | US7169717 Method of producing a calibration wafer |
| 01/30/2007 | US7169710 Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same |
| 01/30/2007 | US7169699 Semiconductor device having a guard ring |
| 01/30/2007 | US7169698 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
| 01/30/2007 | US7169694 Method for forming a bond pad interface |
| 01/30/2007 | US7169692 Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits |
| 01/30/2007 | US7169691 Method of fabricating wafer-level packaging with sidewall passivation and related apparatus |
| 01/30/2007 | US7169665 Capacitance process by using passivation film scheme |
| 01/30/2007 | US7169664 Method of reducing wafer contamination by removing under-metal layers at the wafer edge |
| 01/30/2007 | US7169650 Semi-solid metal injection methods for electronic assembly thermal interface |
| 01/30/2007 | US7169648 Process for producing a semiconductor device |
| 01/30/2007 | US7169647 Connection between a semiconductor chip and an external conductor structure and method for producing it |
| 01/30/2007 | US7169645 Methods of fabrication of package assemblies for optically interactive electronic devices |
| 01/30/2007 | US7169627 Method for inspecting a connecting surface of a flip chip |
| 01/30/2007 | US7169540 Method of treatment of porous dielectric films to reduce damage during cleaning |
| 01/30/2007 | US7169474 Epoxy resin composition and semiconductor device |
| 01/30/2007 | US7169465 Low expansion metal-ceramic composite bodies, and methods for making same |
| 01/30/2007 | US7169363 Hermetic sealed container; absorbent |
| 01/30/2007 | US7169332 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same |
| 01/30/2007 | US7169327 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 01/30/2007 | US7169209 Variations in melting points of metals; controlled heating, cooling, solidification; electroconductive adhesive, soldering paste |
| 01/30/2007 | US7169006 Thermionic vacuum diode device with adjustable electrodes |
| 01/30/2007 | US7168623 Self-adhesive electronic circuit |
| 01/30/2007 | US7168484 Thermal interface apparatus, systems, and methods |
| 01/30/2007 | US7168479 Heat transfer apparatus |
| 01/30/2007 | US7168160 Method for mounting and heating a plurality of microelectronic components |
| 01/30/2007 | CA2390627C Ic chip packaging for reducing bond wire length |
| 01/30/2007 | CA2292077C Temperature compensated amplifier and operating method |
| 01/25/2007 | WO2007011767A1 Integrated circuit packaging |
| 01/25/2007 | WO2007011511A2 Die package with asymmetric leadframe connection |
| 01/25/2007 | WO2007011438A2 Method and structure for reduction of soft error rates in integrated circuits |
| 01/25/2007 | WO2007010902A1 Thermoplastic resin composition for semiconductor, adhesive film, lead frame or semiconductor device compirisng the same, and method for manufacture of semiconductor device using the same |
| 01/25/2007 | WO2007010681A1 Thin film capacitor and method for manufacturing thin film capacitor |
| 01/25/2007 | WO2007010660A1 Wiring board |
| 01/25/2007 | WO2007010615A1 Heat conducting sheet, method for manufacturing such heat conducting sheet, and power module using heat conducting sheet |
| 01/25/2007 | WO2007010595A1 Semiconductor device and method for manufacturing same |
| 01/25/2007 | WO2007010315A2 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component |
| 01/25/2007 | WO2007010005A1 Arrangement of an electric component and a two-phase cooling device and method for manufacturing the arrangement |
| 01/25/2007 | WO2007009868A1 Arrangement of an electrical component and of a two-phase cooling device and method for operating the arrangement |
| 01/25/2007 | WO2006068741A3 Flexible electronic circuit articles and methods of making thereof |
| 01/25/2007 | WO2005081947A3 Miniature fluid-cooled heat sink with integral heater |
| 01/25/2007 | WO2005004195A3 Method and apparatus for packaging integrated circuit devices |
| 01/25/2007 | US20070021089 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
| 01/25/2007 | US20070020926 Electrical connections in substrates |
| 01/25/2007 | US20070020916 Methods for forming flexible column die interconnects and resulting structures |
| 01/25/2007 | US20070020914 Circuit substrate and method of manufacturing the same |
| 01/25/2007 | US20070020913 Method of forming solder bump with reduced surface defects |
| 01/25/2007 | US20070020912 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
| 01/25/2007 | US20070020907 Method of forming a connecting conductor and wirings of a semiconductor chip |
| 01/25/2007 | US20070020863 LDMOS Transistor |
| 01/25/2007 | US20070020814 Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography |
| 01/25/2007 | US20070020813 Device and method for package warp compensation in an integrated heat spreader |