| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/31/2007 | CN2865211Y Radiator specially for electronic component |
| 01/31/2007 | CN2865204Y Fixing mechanism |
| 01/31/2007 | CN2865136Y Transistor switch protection circuit |
| 01/31/2007 | CN2864995Y Semiconductor chip with screening structure |
| 01/31/2007 | CN2864994Y Structure for needle testing pad of integrated circuit chip |
| 01/31/2007 | CN2864993Y Photoelectric chip double-chip type base material packaging structure with control chip |
| 01/31/2007 | CN2864992Y Chip packaging body |
| 01/31/2007 | CN2864991Y Group settled structure of heat radiation fan |
| 01/31/2007 | CN2864990Y Fastener structure for ultra-thin fim-sheet radiator |
| 01/31/2007 | CN2864989Y Heat radiator |
| 01/31/2007 | CN2864988Y Radiator structure |
| 01/31/2007 | CN2864987Y Heat radiator |
| 01/31/2007 | CN2864986Y Cooling device for electronic element |
| 01/31/2007 | CN2864985Y Cooling device for electronic element |
| 01/31/2007 | CN2864984Y Radiator structure |
| 01/31/2007 | CN2864983Y Hot-tube radiating components for light-emitting diode vehicle light |
| 01/31/2007 | CN2864982Y Square diode glass tube |
| 01/31/2007 | CN2864908Y Memory heat abstractor |
| 01/31/2007 | CN2864341Y Semiconductor light source for lighting |
| 01/31/2007 | CN2864333Y Flat source device for LED |
| 01/31/2007 | CN1906974A Heat spreader constructions, integrated circuitry, methods of forming heat speader contruictions, and methods of forming integrated circuitry |
| 01/31/2007 | CN1906848A Package for piezoelectric oscillation element, and piezoelectric oscillator |
| 01/31/2007 | CN1906821A Semiconductor laser equipment |
| 01/31/2007 | CN1906820A Semiconductor laser equipment |
| 01/31/2007 | CN1906799A Coupler resource module |
| 01/31/2007 | CN1906766A Semiconductor device module structure |
| 01/31/2007 | CN1906761A Driver chip and display apparatus |
| 01/31/2007 | CN1906760A Radiator with radially arranged heat radiating fins, cooling device with radiator, and electronic apparatus mounted with cooling device |
| 01/31/2007 | CN1906759A Module with built-in component and method for manufacturing module |
| 01/31/2007 | CN1906758A Composite ceramic substrate |
| 01/31/2007 | CN1906757A 半导体装置 Semiconductor device |
| 01/31/2007 | CN1906753A System and method for surface reduction, passivation, corrosion prevention and activation of copper surface |
| 01/31/2007 | CN1906752A Stress free etch processing in combination with a dynamic liquid meniscus |
| 01/31/2007 | CN1906751A System and method for stress free conductor removal |
| 01/31/2007 | CN1906746A Wafer-level moat structures |
| 01/31/2007 | CN1906744A Device having a compliant electrical interconnects and compliant sealing element |
| 01/31/2007 | CN1906741A Semiconductor device and fabrication process thereof |
| 01/31/2007 | CN1906617A Method and apparatus for performing power routing on a voltage island within an integrated circuit chip |
| 01/31/2007 | CN1906462A Angular speed measuring equipment |
| 01/31/2007 | CN1906416A Gas jetting device, electronic device and gas jetting method |
| 01/31/2007 | CN1905223A LED light source packaging structure for low-temp. coburning ceramic by thermoelectric separating design |
| 01/31/2007 | CN1905218A LED packaging structure with thermoelectric device |
| 01/31/2007 | CN1905207A Flat panel display device and method of making the same |
| 01/31/2007 | CN1905200A Wiring base plate and making method, electro-optic device and method of manufacturing same, electronic device and making method |
| 01/31/2007 | CN1905199A Array substrate having enhanced aperture ratio, method of manufacturing the same and display device |
| 01/31/2007 | CN1905195A Flash memory device and method of manufacturing the same |
| 01/31/2007 | CN1905188A Static discharger capable of avoiding deadlock phenomenon |
| 01/31/2007 | CN1905185A Static discharger capable of controlling holding current |
| 01/31/2007 | CN1905184A Doped single crystal silicon silicided efuse and its forming method |
| 01/31/2007 | CN1905183A TAB tape carrier |
| 01/31/2007 | CN1905182A Circuit base board, mounting structure for semiconductor device with bumps, and electro-optic device |
| 01/31/2007 | CN1905181A Semiconductor packages for surface mounting and method of producing same |
| 01/31/2007 | CN1905180A 半导体器件 Semiconductor devices |
| 01/31/2007 | CN1905179A 半导体装置 Semiconductor device |
| 01/31/2007 | CN1905178A Circuit assembly structure and method for making the same |
| 01/31/2007 | CN1905177A Circuit assembly structure and method for making the same |
| 01/31/2007 | CN1905176A Circuit assembly structure and method for making the same |
| 01/31/2007 | CN1905175A Semiconductor device and manufacturing method of the same |
| 01/31/2007 | CN1905174A Semiconductor device and its mounting method |
| 01/31/2007 | CN1905173A Radiator fastener |
| 01/31/2007 | CN1905172A Heat-emitting element cooling apparatus and heat sink |
| 01/31/2007 | CN1905171A Radiating device |
| 01/31/2007 | CN1905170A Fan device with transfer mechanism |
| 01/31/2007 | CN1905169A Semiconductor device and its manufacturing method |
| 01/31/2007 | CN1905168A Semiconductor device and its making method and used jointing material and its making method |
| 01/31/2007 | CN1905167A 半导体器件 Semiconductor devices |
| 01/31/2007 | CN1905166A Film transistor array substrate and mfg. method thereof |
| 01/31/2007 | CN1905164A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/31/2007 | CN1905161A Memory cell arrangement with a folded bit line arrangement and relevant manufacturing method |
| 01/31/2007 | CN1905159A 阵列基板及其形成方法 Array substrate and method for forming |
| 01/31/2007 | CN1905150A Method for detecting IC on-line defect and making process monitor circuit structure |
| 01/31/2007 | CN1905148A Bonding pad, method for fabricating a bonding pad and an electronic device, and its fabricating method |
| 01/31/2007 | CN1905141A Semiconductor device and method of manufacturing the same |
| 01/31/2007 | CN1905140A Image sensor package, optical glass therefor and processing method |
| 01/31/2007 | CN1905137A Electronic device and method for manufacturing the electronic device |
| 01/31/2007 | CN1905132A Silicon carbon germanium (SiCGe) substrate for a group III nitride-based device |
| 01/31/2007 | CN1905130A Method for manufacturing semiconductor device |
| 01/31/2007 | CN1298113C Monolithic direct converting transceiver and producing method thereof |
| 01/31/2007 | CN1298054C Chip semiconductor device mixed formed with store and logic circuit and producing method thereof |
| 01/31/2007 | CN1298053C Integrated circuit |
| 01/31/2007 | CN1298052C Semiconductor device with Cu interconnection and its manufacturing method |
| 01/31/2007 | CN1298051C Semiconductor device |
| 01/31/2007 | CN1298039C Film carrying belt testing device for mounting electronic element and testing method |
| 01/31/2007 | CN1298038C Semiconductor device |
| 01/31/2007 | CN1298034C Semiconductor package and method of manufacturing the same |
| 01/30/2007 | US7171035 Alignment mark for e-beam inspection of a semiconductor wafer |
| 01/30/2007 | US7170750 Electronic apparatus |
| 01/30/2007 | US7170748 Heat sink assembly for integrated circuits having a slidable contact capability with a mounting member portion of an electronic equipment chassis |
| 01/30/2007 | US7170746 Heat-emitting element cooling apparatus |
| 01/30/2007 | US7170604 Overlay metrology method and apparatus using more than one grating per measurement direction |
| 01/30/2007 | US7170387 Fuse structure |
| 01/30/2007 | US7170216 Bimorph switch, bimorph switch manufacturing method, electronic circuitry and electronic circuitry manufacturing method |
| 01/30/2007 | US7170190 Apparatus for oscillating a head and methods for implementing the same |
| 01/30/2007 | US7170189 Semiconductor wafer and testing method therefor |
| 01/30/2007 | US7170188 Package stress management |
| 01/30/2007 | US7170187 Low stress conductive polymer bump |
| 01/30/2007 | US7170186 Laminated radiation member, power semiconductor apparatus, and method for producing the same |
| 01/30/2007 | US7170185 Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding |
| 01/30/2007 | US7170184 Treatment of a ground semiconductor die to improve adhesive bonding to a substrate |
| 01/30/2007 | US7170183 Wafer level stacked package |