| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/01/2007 | US20070023929 Laminate structure |
| 02/01/2007 | US20070023928 Technique for efficiently patterning an underbump metallization layer using a dry etch process |
| 02/01/2007 | US20070023927 Semiconductor device |
| 02/01/2007 | US20070023926 Planar bond pad design and method of making the same |
| 02/01/2007 | US20070023925 Semiconductor element with conductive bumps and fabrication method thereof |
| 02/01/2007 | US20070023924 Semiconductor device and method of manufacturing the same |
| 02/01/2007 | US20070023923 Flip chip interface including a mixed array of heat bumps and signal bumps |
| 02/01/2007 | US20070023922 Semiconductor package |
| 02/01/2007 | US20070023921 Structures and methods for an application of a flexible bridge |
| 02/01/2007 | US20070023920 Flip chip package with reduced thermal stress |
| 02/01/2007 | US20070023919 Bonding pad on ic substrate and method for making the same |
| 02/01/2007 | US20070023918 Technique for forming a copper-based contact layer without a terminal metal |
| 02/01/2007 | US20070023917 Semiconductor device having multilayer wiring lines and manufacturing method thereof |
| 02/01/2007 | US20070023916 Semiconductor structure with multiple bottom anti-reflective coating layer and method of forming photoresist pattern and pattern of semiconductor device using the same structure |
| 02/01/2007 | US20070023915 On-chip test circuit for assessing chip integrity |
| 02/01/2007 | US20070023914 Electromigration resistant metallurgy device and method |
| 02/01/2007 | US20070023913 Enhanced via structure for organic module performance |
| 02/01/2007 | US20070023912 Integrating metal with ultra low-k-dielectrics |
| 02/01/2007 | US20070023910 Dual BGA alloy structure for improved board-level reliability performance |
| 02/01/2007 | US20070023909 System including self-assembled interconnections |
| 02/01/2007 | US20070023908 Method of fabricating self-assembled electrical interconnections |
| 02/01/2007 | US20070023907 Self-assembled interconnection particles |
| 02/01/2007 | US20070023906 Semiconductor device-composing substrate and semiconductor device |
| 02/01/2007 | US20070023905 Semiconducting device with folded interposer |
| 02/01/2007 | US20070023904 Electro-optic interconnection apparatus and method |
| 02/01/2007 | US20070023903 Semiconductor device, electronic module, and method of manufacturing electronic module |
| 02/01/2007 | US20070023902 Semiconductor package with ferrite shielding structure |
| 02/01/2007 | US20070023901 Microelectronic bond pad |
| 02/01/2007 | US20070023900 Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device |
| 02/01/2007 | US20070023898 Integrated circuit chip and integrated device |
| 02/01/2007 | US20070023897 Semiconductor device, power amplifier device and PC card |
| 02/01/2007 | US20070023896 Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device |
| 02/01/2007 | US20070023895 Semiconductor device having capacitors for reducing power source noise |
| 02/01/2007 | US20070023894 Integrated circuit cooling system and method |
| 02/01/2007 | US20070023893 LED package structure and manufacturing method, and LED array module |
| 02/01/2007 | US20070023892 Method and apparatus for electrical isolation of semiconductor device |
| 02/01/2007 | US20070023891 Substrate based IC-package |
| 02/01/2007 | US20070023890 Microelectronic device |
| 02/01/2007 | US20070023889 Copper substrate with feedthroughs and interconnection circuits |
| 02/01/2007 | US20070023888 Semiconductor device and manufacturing method thereof |
| 02/01/2007 | US20070023887 Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package |
| 02/01/2007 | US20070023886 Method for producing a chip arrangement, a chip arrangement and a multichip device |
| 02/01/2007 | US20070023885 Ic card and method of manufacturing the same |
| 02/01/2007 | US20070023884 Package |
| 02/01/2007 | US20070023881 Semiconductor Wafer with a Wiring Structure, a Semiconductor Component, and Methods for Their Production |
| 02/01/2007 | US20070023880 Packaged integrated circuit with enhanced thermal dissipation |
| 02/01/2007 | US20070023879 Single unit heat sink, voltage regulator, and package solution for an integrated circuit |
| 02/01/2007 | US20070023878 IC with on-die power-gating circuit |
| 02/01/2007 | US20070023877 Chip on flex tape with dimension retention pattern |
| 02/01/2007 | US20070023876 Tab tape carrier |
| 02/01/2007 | US20070023875 Semiconductor package and manufacturing method thereof |
| 02/01/2007 | US20070023874 Metallic laminate and method of manufacturing the same |
| 02/01/2007 | US20070023873 Package structure having recession portion on the surface thereof and method of making the same |
| 02/01/2007 | US20070023872 Chip package with asymmetric molding |
| 02/01/2007 | US20070023871 Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package |
| 02/01/2007 | US20070023870 Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures |
| 02/01/2007 | US20070023869 Vapor phase deposition apparatus and vapor phase deposition method |
| 02/01/2007 | US20070023861 Fuse structure window |
| 02/01/2007 | US20070023855 Semiconductor structure with improved on resistance and breakdown voltage performance |
| 02/01/2007 | US20070023840 Dose rate event protection clamping circuit |
| 02/01/2007 | US20070023179 Heat dissipating member |
| 02/01/2007 | US20070022599 Edge intensive antifuse and method for making the same |
| 02/01/2007 | DE4230187B4 Baueinheit mit Speicher-IC, sowie Verfahren zum Herstellen einer solchen Baueinheit Structural unit with memory IC, and to processes for producing such a structural unit |
| 02/01/2007 | DE202006016914U1 Chip cooler comprises fibres, utilizing heat reflection principle, with fibres of heat conductive material gathered in holding ring to chip to be cooled |
| 02/01/2007 | DE202006007419U1 Kühlkörpermodul Heat sink module |
| 02/01/2007 | DE112005000615T5 Halbleiterlaservorrichtung A semiconductor laser device |
| 02/01/2007 | DE112005000602T5 Halbleiterlaservorrichtung A semiconductor laser device |
| 02/01/2007 | DE10248927B4 Dünnschichtsolarzelle mit elektrischer Molybdän-Kontaktschicht und Herstellungsverfahren Thin film solar cell with electric molybdenum-contact layer and manufacturing method |
| 02/01/2007 | DE10243947B4 Elektronisches Bauteil mit wenigstens einem Halbleiterschip und Verfahren zu seiner Herstellung Electronic component with at least one semiconductor chip and process for its preparation |
| 02/01/2007 | DE102006033039A1 Interposer und Herstellungsverfahren, Halbleiterbauelement und Mehrchip-Packung Interposer and manufacturing processes, semiconductor device and multi-chip package |
| 02/01/2007 | DE102006024654A1 Integriertes Halbleiterschaltkreisbauelement und Verfahren zur Herstellung desselben A semiconductor integrated circuit device and method of manufacturing the same |
| 02/01/2007 | DE102006018182A1 System, Verfahren und Vorrichtung zum Leiten von Signalen von einer integrierten Schaltung unter Verwendung von Dickfilm- und Gedruckte-Schaltung-Verbindungen System, method and apparatus for routing signals from an integrated circuit using thick film and printed circuit connections |
| 02/01/2007 | DE102005035605A1 Monolithisch integrierte Schaltungsanordnung zur thermischen Zeitbestimmung und Verfahren zur Bestimmung eines Zeitintervalls The monolithic integrated circuit arrangement for determining thermal time and method for determining a time interval |
| 02/01/2007 | DE102005035387A1 Kühlkörper für ein in einen Einschubplatz in einer Rechenanlage einsteckbares Modul Heatsinks for a plug-in a drawer space in a computing system module |
| 02/01/2007 | DE102005035061A1 Elektrische Kontakteinrichtung Electrical contact means |
| 02/01/2007 | DE102005034714A1 Elastic fixture for heat sink, has elastic body provided with connecting sections and fixture sections |
| 02/01/2007 | DE102005034485A1 Verbindungselement für ein Halbleiterbauelement und Verfahren zu dessen Herstellung Connecting element for a semiconductor device and process for its preparation |
| 02/01/2007 | DE102005034011A1 Halbleiterbauteil für Hochfrequenzen über 10 GHz und Verfahren zur Herstellung desselben Of the same semiconductor device for high frequencies exceeding 10 GHz and methods for preparing |
| 02/01/2007 | DE102005033469A1 Halbleitersubstrat, Verfahren zu dessen Herstellung sowie Verfahren zum Herstellen eines Schaltungsmoduls Semiconductor substrate, a process for its preparation and method of manufacturing a circuit module |
| 02/01/2007 | DE102005021586B3 Semiconductor chip tested for intact flanks and edges, includes electronic test circuit integrated into semiconductor chip |
| 02/01/2007 | DE102005011652A1 Semiconductor component production, especially for power semiconductor technology, requires forming through-apertures in masking layer at regions over identified contact surfaces |
| 02/01/2007 | DE102004055616B4 Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder Method for connecting a bridge module comprising a substrate and multilayered transponder |
| 02/01/2007 | DE102004001956B4 Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen Rewiring substrate having a plurality of semiconductor component positions |
| 02/01/2007 | DE10156272B4 Multi-Chip-Speichervorrichtung und Speichermodul mit einer unabhängigen Steuerung der Speicherchips The multi-chip memory module and memory device with an independent control of the memory chips |
| 02/01/2007 | DE10148120B4 Elektronische Bauteile mit Halbleiterchips und ein Systemträger mit Bauteilpositionen sowie Verfahren zur Herstellung eines Systemträgers Electronic components with semiconductor chip and a system carrier with component positions and to processes for the preparation of a leadframe |
| 01/31/2007 | EP1748487A2 Semiconductor power device and RF signal amplifier |
| 01/31/2007 | EP1748486A2 TAB tape carrier |
| 01/31/2007 | EP1748485A2 Semiconductor device and manufacturing method of the same |
| 01/31/2007 | EP1748484A2 Cooling device for electronic components |
| 01/31/2007 | EP1748483A2 Heat dissipating device |
| 01/31/2007 | EP1748480A1 Connection structure for attaching a semiconductor chip to a metal substrate, semiconductor chip and electronic component including the connection structure and methods for producing the connection structure |
| 01/31/2007 | EP1747706A2 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 01/31/2007 | EP1747591A1 Covers for microelectronic imagers and methods for wafer-level packaging of microelectronic imagers |
| 01/31/2007 | EP1747588A2 Illuminable gaas switching component with a transparent housing, and microwave circuit therewith |
| 01/31/2007 | EP1747584A1 System for shielding integrated circuits |
| 01/31/2007 | EP1747583A2 Programming semiconductor dies for pin map compatibility |
| 01/31/2007 | EP1747169A1 Vent closing method and the use of an ultrasonic bonding machine for carrying out said method |
| 01/31/2007 | EP1747095A2 Improved thermal interface material |
| 01/31/2007 | CN2865213Y Heat radiator |
| 01/31/2007 | CN2865212Y Heat radiator |