| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/07/2007 | CN1299553C Radiator unit |
| 02/07/2007 | CN1299546C Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 02/07/2007 | CN1299545C Electronic device |
| 02/07/2007 | CN1299401C Electric connector |
| 02/07/2007 | CN1299391C Spherical grid array connection device |
| 02/07/2007 | CN1299359C Electrostatic discharge protective circuit and method of thin film transistor liquid crystal display |
| 02/07/2007 | CN1299358C Inlay metal inner connecting structure possessing double protective layer and its making method |
| 02/07/2007 | CN1299357C Semiconductor device and its making method |
| 02/07/2007 | CN1299356C Electronic device |
| 02/07/2007 | CN1299355C Mfg. tech. of packaged interface substrate wafer having wholly metallized through hole |
| 02/07/2007 | CN1299352C Method for fabricating DRAM cell capacitor |
| 02/07/2007 | CN1299343C Semiconductor device for charge-up damage evaluation and charge-up damage evaluation method |
| 02/07/2007 | CN1299341C Resin sealed semiconductor, resin sealing method and forming die |
| 02/07/2007 | CN1299326C Tin-doped indium oxide film and making process of fine pattern |
| 02/07/2007 | CN1299325C Substrate element and soft substrate |
| 02/07/2007 | CN1299298C Circuit device for semiconductor |
| 02/07/2007 | CN1298753C Perfluorinated hydrocarbon polymer-filled adhesive formulations and use thereof |
| 02/06/2007 | US7174521 System and method for product yield prediction |
| 02/06/2007 | US7173855 Current limiting antifuse programming path |
| 02/06/2007 | US7173842 Metal heater for in situ heating and crystallization of ferroelectric polymer memory film |
| 02/06/2007 | US7173828 Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure |
| 02/06/2007 | US7173803 Low impedance inter-digital capacitor and method of using |
| 02/06/2007 | US7173433 Circuit property measurement method |
| 02/06/2007 | US7173342 Method and apparatus for reducing electrical interconnection fatigue |
| 02/06/2007 | US7173341 High performance thermally enhanced package and method of fabricating the same |
| 02/06/2007 | US7173340 Daisy chaining of serial I/O interface on stacking devices |
| 02/06/2007 | US7173339 Semiconductor device having a substrate an undoped silicon oxide structure and an overlaying doped silicon oxide structure with a sidewall terminating at the undoped silicon oxide structure |
| 02/06/2007 | US7173338 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing |
| 02/06/2007 | US7173337 Semiconductor device manufactured by the damascene process having improved stress migration resistance |
| 02/06/2007 | US7173336 Hybrid integrated circuit device |
| 02/06/2007 | US7173335 Semiconductor apparatus with decoupling capacitor |
| 02/06/2007 | US7173334 Diamond composite heat spreader and associated methods |
| 02/06/2007 | US7173333 Semiconductor device |
| 02/06/2007 | US7173332 Placement tool for wafer scale caps |
| 02/06/2007 | US7173331 Hermetic sealing cap and method of manufacturing the same |
| 02/06/2007 | US7173330 Multiple chip semiconductor package |
| 02/06/2007 | US7173329 Package stiffener |
| 02/06/2007 | US7173328 Integrated circuit package and method having wire-bonded intra-die electrical connections |
| 02/06/2007 | US7173327 Clock distribution networks and conductive lines in semiconductor integrated circuits |
| 02/06/2007 | US7173326 Semiconductor integrated device |
| 02/06/2007 | US7173325 Expansion constrained die stack |
| 02/06/2007 | US7173324 Wafer level package for micro device |
| 02/06/2007 | US7173323 Semiconductor device with a protective security coating comprising multiple alternating metal layers |
| 02/06/2007 | US7173322 COF flexible printed wiring board and method of producing the wiring board |
| 02/06/2007 | US7173321 Semiconductor package having multiple row of leads |
| 02/06/2007 | US7173317 Electrical and thermal contact for use in semiconductor devices |
| 02/06/2007 | US7173316 Semiconductor device |
| 02/06/2007 | US7173311 Light-emitting semiconductor device with a built-in overvoltage protector |
| 02/06/2007 | US7173271 Phase-change memory device and method of manufacturing the same |
| 02/06/2007 | US7173193 Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board |
| 02/06/2007 | US7173188 Straight angle conductor and method of manufacturing the same |
| 02/06/2007 | US7172980 Process for fabricating an integrated electronic circuit that incorporates air gaps |
| 02/06/2007 | US7172971 Semiconductor device having a contact window including a lower with a wider to provide a lower contact resistance |
| 02/06/2007 | US7172968 Ultra thin, single phase, diffusion barrier for metal conductors |
| 02/06/2007 | US7172966 Method for fabricating metallic interconnects on electronic components |
| 02/06/2007 | US7172958 High-frequency wiring structure and method for producing the same |
| 02/06/2007 | US7172948 Method to avoid a laser marked area step height |
| 02/06/2007 | US7172945 Method of manufacturing thin film capacitor |
| 02/06/2007 | US7172944 Method of fabricating a semiconductor device having an elevated source/drain |
| 02/06/2007 | US7172932 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus |
| 02/06/2007 | US7172927 Warpage control of array packaging |
| 02/06/2007 | US7172926 Method for manufacturing an adhesive substrate with a die-cavity sidewall |
| 02/06/2007 | US7172924 Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof |
| 02/06/2007 | US7172916 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate |
| 02/06/2007 | US7172711 Interface materials and methods of production and use thereof |
| 02/06/2007 | US7172663 Applying paste to substrate including particles dispersed in carrier liquid; vapor deposition; oxidation resistance; vaporization of aerosol drops; electronics, capacitors; noncracking, quality |
| 02/06/2007 | US7172017 Heat sink |
| 02/06/2007 | US7171744 Substrate frame |
| 02/06/2007 | US7171742 Method and system for assembling a printed circuit board using a land grid array |
| 02/01/2007 | WO2007013854A1 Intelligent card and manufacturing thereof |
| 02/01/2007 | WO2007013377A1 Semiconductor element and electric device |
| 02/01/2007 | WO2007013284A1 Epoxy resin composition and semiconductor device |
| 02/01/2007 | WO2007013239A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 02/01/2007 | WO2007012992A1 A package and manufacturing method for a microelectronic component |
| 02/01/2007 | WO2007012833A1 A package for a die |
| 02/01/2007 | WO2007012558A1 Arrangement of an electrical component and a film composite laminated on the component and method for production of the arrangement |
| 02/01/2007 | WO2007012187A1 System and method for assembling packaged integrated circuits using insulated wire bond |
| 02/01/2007 | WO2006088609A3 Semiconductor package with low and high-speed signal paths |
| 02/01/2007 | WO2006066159A3 Device having a low-voltage trigger element |
| 02/01/2007 | WO2006052317A3 Liquid cold plate heat exchanger |
| 02/01/2007 | WO2006024626A3 Electric sub-assembly |
| 02/01/2007 | WO2005089510A3 Method of forming one or more base structures on an ltcc cofired module |
| 02/01/2007 | WO2005065326A3 Optically controlled electrical switching device based on wide bandgap semiconductors |
| 02/01/2007 | US20070028205 Data processing method in semiconductor device, program of the same, and manufacturing method of semiconductor device |
| 02/01/2007 | US20070027302 Method of crystallizing organic oligomer, epoxy resin composition containing organic oligomer obtained by the method and epoxy resin cured material |
| 02/01/2007 | US20070027254 An acrylic ester polymer such as polyethylhexyl acrylate chain transfered by methylstyrene/alpha-/, lauryl acrylate, a difunctional crosslinkable polyoxyethylene diacryalate polymer, tetraoctyl pyromellitate plasticizer; filler, antifoam agent; superior in thermoconductivity, flexibility and moldability |
| 02/01/2007 | US20070026678 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 02/01/2007 | US20070026673 Semiconductor device having a multilayer interconnection structure and fabrication process thereof |
| 02/01/2007 | US20070026645 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 02/01/2007 | US20070026639 Manufacturing method of semiconductor device |
| 02/01/2007 | US20070026576 Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure |
| 02/01/2007 | US20070026574 Interconnect apparatus and methods |
| 02/01/2007 | US20070026569 Semiconducting device with folded interposer |
| 02/01/2007 | US20070026556 Liquid crystal display device and method of fabricating the same |
| 02/01/2007 | US20070026546 Method of detecting misalignment of ion implantation area |
| 02/01/2007 | US20070026196 Laminated electronic component and method for producing the same |
| 02/01/2007 | US20070025082 Microchannel heat sink |
| 02/01/2007 | US20070023932 Wafer, reticle, and exposure method using the wafer and reticle |
| 02/01/2007 | US20070023931 Carrier tape for electronic components |
| 02/01/2007 | US20070023930 High speed interface design |