| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/08/2007 | US20070029582 Semiconductor image sensor and method for fabricating the same |
| 02/08/2007 | US20070029571 Nitride semiconductor light-emitting device |
| 02/08/2007 | US20070029562 Semiconductor device and method of manufacturing a semiconductor device |
| 02/08/2007 | US20070029549 Providing current control over wafer borne semiconductor devices using overlayer patterns |
| 02/08/2007 | US20070029544 Interconnected high speed electron tunneling devices |
| 02/08/2007 | US20070029540 Semiconductor device |
| 02/08/2007 | US20070029106 Multilayer printed wiring board |
| 02/08/2007 | US20070028445 Fluxless bumping process |
| 02/08/2007 | DE202006016543U1 Detachable bare chip module is formed in frame on printed circuit substrate and electrically connected to it by conductive spring matrix in construction frames |
| 02/08/2007 | DE19953178B4 Millimeterband-Halbleiterschaltkreis Millimeter-band semiconductor circuit |
| 02/08/2007 | DE19712834B4 Schutzschaltung und Schaltung für eine Halbleiter-Auf-Isolator-Vorrichtung Protection circuit and circuit for a semiconductor-on-insulator device |
| 02/08/2007 | DE19517975B4 CMOS-Schaltungsplättchen mit Polysilizium-Feldringstruktur CMOS circuit die with polysilicon field ring structure |
| 02/08/2007 | DE112004002761T5 Eine nicht verbleite Halbleiterbaugruppe und ein Verfahren, um diese zusammenzusetzen To these compose a Unleaded semiconductor package and method |
| 02/08/2007 | DE10333552B4 Integrierte Leistungsverstärkerschaltung Power amplifier integrated circuit |
| 02/08/2007 | DE10228344B4 Verfahren zur Herstellung von Mikrostrukturen sowie Anordnung von Mikrostrukturen A process for the fabrication of microstructures, and arrangement of microstructures |
| 02/08/2007 | DE10210841B4 Modul und Verfahren zur Herstellung von elektrischen Schaltungen und Modulen Module and process for manufacture of electrical circuitry and modules |
| 02/08/2007 | DE102006033724A1 Schaltplatte mit Kühlarchitektur Circuit board with cooling architecture |
| 02/08/2007 | DE102006030133A1 Sensor with electrical module has conductive wire grid connected to chip of sensor IC and plastic base with conductive wires and plug connection |
| 02/08/2007 | DE102006009540A1 Substrat für ein substratbasiertes elektronisches Bauelement und elektronisches Bauelement mit verbesserter Zuverlässigkeit Substrate for a substrate-based electronic device and electronic device with improved reliability |
| 02/08/2007 | DE102005047105B3 Determining dopant content of doped amorphous semiconductor layer on carrier comprises use of spectral ellipsometry and reference Tauc curve |
| 02/08/2007 | DE102005044331A1 Halbleiterbaustein auf der Basis einer Lead-on-Chip-Architektur, dessen Herstellung und ein Leiterrahmen zur Implementierung in einem Halbleiterbaustein A semiconductor device based on a lead-on-chip architecture, its manufacture and a lead frame for implementation in a semiconductor device |
| 02/08/2007 | DE102005036102A1 Elektrisches Bauelement Electrical component |
| 02/08/2007 | DE102005035393A1 Bauelement mit einem oder mehreren Chips sowie Verfahren zur Herstellung eines solchen Device having one or more chips as well as methods for producing such |
| 02/08/2007 | DE102005034873A1 Anordnung eines elektrischen Bauelements und eines auf dem Bauelement auflaminierten Folienverbunds und Verfahren zur Herstellung der Anordnung Arrangement of an electrical component and a laminated composite film on the component and method of manufacturing the arrangement |
| 02/08/2007 | DE102005034122A1 Siliconharzverguss von Leuchtdioden Siliconharzverguss of light emitting diodes |
| 02/08/2007 | DE102005032076B3 Verfahren zum Herstellen eines Schaltungsmoduls A method of manufacturing a circuit module |
| 02/08/2007 | DE102005003000B4 Halbleiterprodukt mit einem Halbleitersubstrat und einer Teststruktur und Verfahren A semiconductor product comprising a semiconductor substrate and a test structure and method |
| 02/08/2007 | DE102004052868B4 Integrierte Schaltkreis-Anordnung und Schaltkreis-Array Integrated circuit arrangement and circuit array |
| 02/08/2007 | DE102004030541B4 Integrierte Schaltung Integrated circuit |
| 02/08/2007 | DE102004019345B4 Ausgangsstufenanordnung Output stage system |
| 02/08/2007 | DE10141877B4 Halbleiterbauteil und Konvertereinrichtung Semiconductor device and converter means |
| 02/08/2007 | DE10132024B4 Halbleiter-Bauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 02/07/2007 | EP1750490A1 Cooling of an electronic power device |
| 02/07/2007 | EP1750306A1 Electronic package having underfill standoff and method |
| 02/07/2007 | EP1750305A2 Integrated circuit with low-stress under-bump metallurgy |
| 02/07/2007 | EP1750304A2 Semiconductor device |
| 02/07/2007 | EP1750303A2 Method for the mitigation of hot spots in integrated circuits chip |
| 02/07/2007 | EP1750302A2 Arrangement electrical elements |
| 02/07/2007 | EP1750301A2 On-die heating circuit and control loop for rapid heating of the die |
| 02/07/2007 | EP1750300A2 Electrical element |
| 02/07/2007 | EP1750298A2 RF power transistor with impedance matched output electrode |
| 02/07/2007 | EP1750176A2 Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material |
| 02/07/2007 | EP1749315A1 Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium |
| 02/07/2007 | EP1749314A2 Film-type composition containing a sorbent |
| 02/07/2007 | EP1525623B1 Semiconductor structure for imaging detectors |
| 02/07/2007 | EP1379825B1 Orientation-independent thermosyphon heat spreader |
| 02/07/2007 | EP1040736B1 Synthetic jet actuators for cooling heated bodies and environments |
| 02/07/2007 | EP1029347B1 Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device |
| 02/07/2007 | EP0961809B1 Low temperature method and compositions for producing electrical conductors |
| 02/07/2007 | CN2867809Y Radiating devie |
| 02/07/2007 | CN2867807Y Radiating module |
| 02/07/2007 | CN2867805Y Modified structure for screw locking type radiator |
| 02/07/2007 | CN2867803Y Liquid-cooled radiating device |
| 02/07/2007 | CN2867802Y Module radiator |
| 02/07/2007 | CN2867792Y Radiator clamping mechanism |
| 02/07/2007 | CN2867595Y Multi-chip package structure internal connection wire |
| 02/07/2007 | CN2867594Y Chip appliance |
| 02/07/2007 | CN2867593Y Radiator linking structure |
| 02/07/2007 | CN2867592Y Circuit board heating electronic package radiating module |
| 02/07/2007 | CN2867591Y Modified CPU radiator structure |
| 02/07/2007 | CN2867590Y Radiating device |
| 02/07/2007 | CN2867589Y Secondary package device of avalanche diode for infrared detection |
| 02/07/2007 | CN1910971A Packaging and manufacturing of an integrated circuit |
| 02/07/2007 | CN1910752A Efficient use of wafer area with device under the pad approach |
| 02/07/2007 | CN1910751A Method and system for cooling at least one electronic device |
| 02/07/2007 | CN1910750A Semiconductor package and semiconductor device |
| 02/07/2007 | CN1910749A Multilayer ceramic substrate with single via anchored pad and method of forming |
| 02/07/2007 | CN1910737A Silicon carbide on diamond substrates and related devices and methods |
| 02/07/2007 | CN1910596A Semiconductor device |
| 02/07/2007 | CN1910595A Method of for manufacturing electronic device |
| 02/07/2007 | CN1909773A Method and structure for improving heat-diffusing efficiency of heat abstractor |
| 02/07/2007 | CN1909772A Heat radiation model set |
| 02/07/2007 | CN1909771A Heat radiator |
| 02/07/2007 | CN1909367A Ceramic packaging piece for crystal oscillator and its preparation method |
| 02/07/2007 | CN1909363A 半导体功率器件和rf信号放大器 The semiconductor power device and the rf signal amplifier |
| 02/07/2007 | CN1909311A Nitride semiconductor light-emitting device |
| 02/07/2007 | CN1909238A Light emitting device having protection element and method of manufacturing the light emitting device |
| 02/07/2007 | CN1909237A Semiconductor image sensor and method for fabricating the same |
| 02/07/2007 | CN1909236A 薄膜晶体管基板 Thin film transistor substrate |
| 02/07/2007 | CN1909235A Method for manufacturing thin-film transistor |
| 02/07/2007 | CN1909234A Flash memory device having resistivity measurement pattern and method of forming the same |
| 02/07/2007 | CN1909230A Inter-chip ESD protection structure for high speed and high frequency devices and its forming method |
| 02/07/2007 | CN1909228A Test circuit built-in semiconductor chip |
| 02/07/2007 | CN1909227A Programmable semiconductor device and methods of making and using same |
| 02/07/2007 | CN1909226A Package substrate |
| 02/07/2007 | CN1909225A 半导体装置及半导体芯片 The semiconductor device and semiconductor chip |
| 02/07/2007 | CN1909224A Semiconductor device, electronic module, and method of manufacturing electronic module |
| 02/07/2007 | CN1909223A Semiconductor package with ferrite shielding structure |
| 02/07/2007 | CN1909222A Semiconductor device |
| 02/07/2007 | CN1909221A Semiconductor device and method of manufacturing the same |
| 02/07/2007 | CN1909220A Chip type electric device and liquid crystal display module including the same |
| 02/07/2007 | CN1909219A Multipurpose LED support |
| 02/07/2007 | CN1909218A Integrated liquid cooling heat abstractor |
| 02/07/2007 | CN1909217A Wafer packaging for asymmetric casting mold |
| 02/07/2007 | CN1909216A Semiconductor package featuring metal lid member |
| 02/07/2007 | CN1909215A 半导体器件 Semiconductor devices |
| 02/07/2007 | CN1909209A Method for manufacturing semiconductor device |
| 02/07/2007 | CN1909208A Method of manufacturing a semiconductor structure and a corresponding semiconductor structure |
| 02/07/2007 | CN1908065A 环氧树脂组合物以及半导体装置 Epoxy resin composition and a semiconductor device |
| 02/07/2007 | CN1299554C IC for embedded low drop off voltage reglator and method for decreasing circuit board size demand |