| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/13/2007 | US7176087 Methods of forming electrical connections |
| 02/13/2007 | US7176082 Analog capacitor in dual damascene process |
| 02/13/2007 | US7176078 Nonvolatile semiconductor memory device having strap region and fabricating method thereof |
| 02/13/2007 | US7176064 Memory cell comprising a semiconductor junction diode crystallized adjacent to a silicide |
| 02/13/2007 | US7176063 High density 3-D integrated circuit package |
| 02/13/2007 | US7176062 Lead-frame method and assembly for interconnecting circuits within a circuit module |
| 02/13/2007 | US7176061 Semiconductor device and method for manufacturing the same |
| 02/13/2007 | US7176059 Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts |
| 02/13/2007 | US7176058 Chip scale package and method of fabricating the same |
| 02/13/2007 | US7176057 Power module comprising at least two substrates and method for producing the same |
| 02/13/2007 | US7176056 Semiconductor integrated circuit device and method of manufacturing the same |
| 02/13/2007 | US7176055 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 02/13/2007 | US7176052 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board |
| 02/13/2007 | US7175970 Forming trench above via from photoresist trench pattern in dielectric layer; treating locally base portions by a post treatment using trench pattern as mask to enhance mechanical strength; depositing seed and barrier layers; filling |
| 02/13/2007 | US7175680 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers |
| 02/13/2007 | US7174955 Heat sink |
| 02/13/2007 | US7174738 Computer cooling apparatus |
| 02/13/2007 | US7174629 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor |
| 02/13/2007 | US7174627 Method of fabricating known good dies from packaged integrated circuits |
| 02/13/2007 | US7174626 Method of manufacturing a plated electronic termination |
| 02/08/2007 | WO2007016662A2 Enhanced multi-die package |
| 02/08/2007 | WO2007016088A2 Packaged integrated circuit with enhanced thermal dissipation |
| 02/08/2007 | WO2007016039A2 Improved microelectronic bond pad |
| 02/08/2007 | WO2007015965A2 Semiconductor die attachment for high vacuum tubes |
| 02/08/2007 | WO2007015938A2 Method for patterning an underbump metallizattion layer using a dry etc process |
| 02/08/2007 | WO2007015701A2 Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
| 02/08/2007 | WO2007015507A1 Electronic circuit device and method for manufacturing same |
| 02/08/2007 | WO2007015433A1 Method for forming insulating film and insulating film |
| 02/08/2007 | WO2007015427A1 Thermosetting epoxy resin composition and semiconductor device |
| 02/08/2007 | WO2007015426A1 Light-emitting device, method for manufacturing same, molded body and sealing member |
| 02/08/2007 | WO2007014800A1 Chip module for installing in sensor chip cards for fluidic applications and method for producing a chip module of this type |
| 02/08/2007 | WO2007014695A1 Electronic component |
| 02/08/2007 | WO2007014549A1 Process for producing a multilayer ceramic composite |
| 02/08/2007 | WO2006137819A3 High density vertically stacked semiconductor device |
| 02/08/2007 | WO2006076377A3 Wiring patterns formed by selective metal plating |
| 02/08/2007 | WO2006075725A3 Manufacturing method for semiconductor chips and semiconductor wafer |
| 02/08/2007 | WO2005022965A3 Expansion constrained die stack |
| 02/08/2007 | US20070032078 Suspension for filling via holes in silicon and method for making the same |
| 02/08/2007 | US20070032075 Deposition method for wiring thin film |
| 02/08/2007 | US20070032066 Semiconductor device and method of fabricating the same |
| 02/08/2007 | US20070032064 Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load |
| 02/08/2007 | US20070032052 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 02/08/2007 | US20070032051 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 02/08/2007 | US20070032023 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 02/08/2007 | US20070031998 Method and apparatus for removing encapsulating material from a packaged microelectronic device |
| 02/08/2007 | US20070031996 Packaged integrated circuit having a heat spreader and method therefor |
| 02/08/2007 | US20070031993 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
| 02/08/2007 | US20070031743 Alignment and alignment marks |
| 02/08/2007 | US20070031279 Solder composition for electronic devices |
| 02/08/2007 | US20070030661 Conformal electromagnetic interference shield |
| 02/08/2007 | US20070030653 Anisotropic thermal solution |
| 02/08/2007 | US20070030335 Offset dependent resistor for measuring misalignment of stitched masks |
| 02/08/2007 | US20070030022 Device for defeating reverse engineering of integrated circuits by optical means |
| 02/08/2007 | US20070029683 Method for fabricating semiconductor package with heat sink |
| 02/08/2007 | US20070029682 Epoxy resin composition and semiconductor device |
| 02/08/2007 | US20070029681 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same |
| 02/08/2007 | US20070029680 Chip packaging structure without leadframe |
| 02/08/2007 | US20070029679 Electrical component having a reduced substrate area |
| 02/08/2007 | US20070029678 Lead-free solder |
| 02/08/2007 | US20070029677 Interconnection structure |
| 02/08/2007 | US20070029676 Semiconductor device and method for manufacturing the same |
| 02/08/2007 | US20070029675 Integral charge storage basement and wideband embedded decoupling structure for integrated circuit |
| 02/08/2007 | US20070029674 Board-on-chip package and stack package using the same |
| 02/08/2007 | US20070029673 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 02/08/2007 | US20070029672 Semiconductor device |
| 02/08/2007 | US20070029671 Semiconductor device |
| 02/08/2007 | US20070029670 Semiconductor device and radiation detector employing it |
| 02/08/2007 | US20070029669 Integrated circuit with low-stress under-bump metallurgy |
| 02/08/2007 | US20070029668 Package module having a stacking platform |
| 02/08/2007 | US20070029667 Semiconductor device |
| 02/08/2007 | US20070029666 Chip-Sized Flip-Chip Semiconductor Package and Method for Making the Same |
| 02/08/2007 | US20070029665 Method for the mitigation of hot spots in integrated circuits chip |
| 02/08/2007 | US20070029664 Integrated circuit package and method of assembling the same |
| 02/08/2007 | US20070029663 Multilayered circuit substrate and semiconductor package structure using the same |
| 02/08/2007 | US20070029662 Semiconductor device having termination circuit line |
| 02/08/2007 | US20070029661 Power plane design and jumper wire bond for voltage drop minimization |
| 02/08/2007 | US20070029660 Stack package implementing conductive support |
| 02/08/2007 | US20070029659 MEMS RF switch module including a vertical via |
| 02/08/2007 | US20070029658 Electrical connection pattern in an electronic panel |
| 02/08/2007 | US20070029657 Semiconductor pressure sensor |
| 02/08/2007 | US20070029656 Semiconductor device |
| 02/08/2007 | US20070029655 Jig structure for manufacturin a stacked memory card |
| 02/08/2007 | US20070029654 Electronic parts packaging structure and method of manufacturing the same |
| 02/08/2007 | US20070029653 Application of autonomic self healing composites to integrated circuit packaging |
| 02/08/2007 | US20070029652 Semiconductor device and method of manufacturing the same |
| 02/08/2007 | US20070029651 Semiconductor device |
| 02/08/2007 | US20070029650 Semiconductor package and package stacking structure and method using the same |
| 02/08/2007 | US20070029649 Plastic lead frame with snap-together circuitry |
| 02/08/2007 | US20070029648 Enhanced multi-die package |
| 02/08/2007 | US20070029647 Radio frequency over-molded leadframe package |
| 02/08/2007 | US20070029645 High permeability layered films to reduce noise in high speed interconnects |
| 02/08/2007 | US20070029644 Electro-optical device and electronic apparatus |
| 02/08/2007 | US20070029643 Methods for nanoscale structures from optical lithography and subsequent lateral growth |
| 02/08/2007 | US20070029641 Semiconductor device |
| 02/08/2007 | US20070029639 Edge intensive antifuse and method for making the same |
| 02/08/2007 | US20070029638 Semiconductor device and methods of protecting a semiconductor device |
| 02/08/2007 | US20070029631 Package Structure and Wafer Level Package Method |
| 02/08/2007 | US20070029630 Integrated circuits with contemporaneously formed array electrodes and logic interconnects |
| 02/08/2007 | US20070029626 Semiconductor device, and method of fabricating the same |
| 02/08/2007 | US20070029615 Active matrix substrate and repairing method thereof |