| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/14/2007 | CN1913140A 半导体器件 Semiconductor devices |
| 02/14/2007 | CN1913139A Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device |
| 02/14/2007 | CN1913138A Semiconductor device |
| 02/14/2007 | CN1913137A Cooling mould set |
| 02/14/2007 | CN1913136A Hot-pipe cooling device |
| 02/14/2007 | CN1913135A PLCC package with integrated lens and method for making the package |
| 02/14/2007 | CN1913134A Chip package body of asymmetrical moudl |
| 02/14/2007 | CN1913133A Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control |
| 02/14/2007 | CN1913128A Methods of forming dual-damascene metal wiring patterns for integrated circuit devices and wiring patterns formed thereby |
| 02/14/2007 | CN1913127A Method for manufacturing semiconductor device and semiconductor device |
| 02/14/2007 | CN1913126A Semiconductor device having a structure to improve contact processing margin, and method of fabricating the same |
| 02/14/2007 | CN1913125A Via bottom contact and method of manufacturing same |
| 02/14/2007 | CN1913124A Integration control and reliability enhancement of interconnect air cavities |
| 02/14/2007 | CN1913117A Method for improving electron circuit layout efficiency, electronic connector and electronic panel |
| 02/14/2007 | CN1913103A Methods of forming metal-insulator-metal (mim) capacitors with passivation layers on dielectric layers and devices so formed |
| 02/14/2007 | CN1913044A Thick film conductor composition, and its use in ltcc circuit and device |
| 02/14/2007 | CN1301047C Welding disk pattern structure and substrate for carrging electrical components |
| 02/14/2007 | CN1301044C 电路装置 Circuit device |
| 02/14/2007 | CN1301043C Circuit device and its mfg. method |
| 02/14/2007 | CN1300939C High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly |
| 02/14/2007 | CN1300859C Light emitting element |
| 02/14/2007 | CN1300851C Semiconductor memory device with signal distributive circuits formed above memory unit |
| 02/14/2007 | CN1300850C Semiconductor device and method for fabricating the same |
| 02/14/2007 | CN1300847C Micro- or nano-electronic component comprising a power source and means for protecting the power source |
| 02/14/2007 | CN1300846C Semiconductor device and method of fabricating same |
| 02/14/2007 | CN1300845C Adhesive thin sheet for producing semiconductor device, semiconductor device and its producing method |
| 02/14/2007 | CN1300844C Ball gate array packaging and printed circuit board using same |
| 02/14/2007 | CN1300843C Package assembly for electronic device and method of making same |
| 02/14/2007 | CN1300840C Chip and wafer integration process using vertical connections |
| 02/14/2007 | CN1300832C Producing method for electronic device and chip carrier |
| 02/14/2007 | CN1300659C Radiator for power element on main board of computer |
| 02/14/2007 | CN1299837C Pad coating system and its interlocking method |
| 02/14/2007 | CN1299573C Electronic component material containing insect repellent, electronic mail using the material and manufacture thereof |
| 02/13/2007 | US7178126 Method of protecting a semiconductor integrated circuit from plasma damage |
| 02/13/2007 | US7178044 Architecture for controlling dissipated power in a system-on-chip and related system |
| 02/13/2007 | US7177548 Optical module |
| 02/13/2007 | US7177373 Continuous self-calibration of internal analog signals |
| 02/13/2007 | US7177155 Semiconductor package with heat sink |
| 02/13/2007 | US7177123 Semiconductor integrated circuit |
| 02/13/2007 | US7176756 Inductor element containing circuit board and power amplifier module |
| 02/13/2007 | US7176583 Damascene patterning of barrier layer metal for C4 solder bumps |
| 02/13/2007 | US7176582 Semiconductor device and method of manufacturing same |
| 02/13/2007 | US7176581 Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus |
| 02/13/2007 | US7176580 Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip |
| 02/13/2007 | US7176579 Semiconductor module |
| 02/13/2007 | US7176578 Method for processing a thin film substrate |
| 02/13/2007 | US7176577 Semiconductor device |
| 02/13/2007 | US7176576 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
| 02/13/2007 | US7176575 Input/output routing on an electronic device |
| 02/13/2007 | US7176574 Semiconductor device having a multiple thickness interconnect |
| 02/13/2007 | US7176573 Semiconductor device with a multi-level interconnect structure and method for making the same |
| 02/13/2007 | US7176572 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 02/13/2007 | US7176571 Nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure |
| 02/13/2007 | US7176570 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 02/13/2007 | US7176569 Semiconductor device and method of manufacturing the same |
| 02/13/2007 | US7176568 Semiconductor device and its manufacturing method, electronic module, and electronic unit |
| 02/13/2007 | US7176567 Semiconductor device protective structure and method for fabricating the same |
| 02/13/2007 | US7176566 Semiconductor package assembly and method for electrically isolating modules |
| 02/13/2007 | US7176565 Capacitors having separate terminals on three or more sides |
| 02/13/2007 | US7176564 Heat spreader, heat sink, heat exchanger and PDP chassis base |
| 02/13/2007 | US7176563 Electronically grounded heat spreader |
| 02/13/2007 | US7176562 Semiconductor wafer, semiconductor device, method for manufacturing the semiconductor device, circuit board, and electronic apparatus |
| 02/13/2007 | US7176561 Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment |
| 02/13/2007 | US7176560 Semiconductor device having a chip—chip structure |
| 02/13/2007 | US7176559 Integrated circuit package with a balanced-part structure |
| 02/13/2007 | US7176558 Single chip and stack-type chip semiconductor package and method of manufacturing the same |
| 02/13/2007 | US7176557 Semiconductor device |
| 02/13/2007 | US7176556 Semiconductor system-in-package |
| 02/13/2007 | US7176555 Flip chip package with reduced thermal stress |
| 02/13/2007 | US7176554 Methods for producing a semiconductor entity |
| 02/13/2007 | US7176551 Fuse structure for a semiconductor device |
| 02/13/2007 | US7176550 Method and device for forming a winding on a non-planar substrate |
| 02/13/2007 | US7176545 Apparatus and methods for maskless pattern generation |
| 02/13/2007 | US7176533 Semiconductor devices having contact plugs including polysilicon doped with an impurity having a lesser diffusion coefficient than phosphorus |
| 02/13/2007 | US7176529 Semiconductor device and method of manufacturing the same |
| 02/13/2007 | US7176523 Power mosfet having conductor plug structured contacts |
| 02/13/2007 | US7176520 Semiconductor device and a method of manufacturing the same |
| 02/13/2007 | US7176508 Temperature sensor for high power very large scale integration circuits |
| 02/13/2007 | US7176506 High frequency chip packages with connecting elements |
| 02/13/2007 | US7176493 Active matrix display device and manufacturing method thereof |
| 02/13/2007 | US7176488 Thin film transistor with protective cap over flexible substrate, electronic device using the same, and manufacturing method thereof |
| 02/13/2007 | US7176487 Semiconductor integrated circuit |
| 02/13/2007 | US7176486 Structure of test element group wiring and semiconductor substrate |
| 02/13/2007 | US7176485 Damascene resistor and method for measuring the width of same |
| 02/13/2007 | US7176473 Shielding leadframe for semiconductors for optical coupling and electronic apparatus including same |
| 02/13/2007 | US7176452 Microfabricated beam modulation device |
| 02/13/2007 | US7176436 Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header |
| 02/13/2007 | US7176422 Chip bonding heater with differential heat transfer |
| 02/13/2007 | US7176147 Combination insulator and organic semiconductor formed from self-assembling block co-polymers |
| 02/13/2007 | US7176143 Method for evaluating solution for a coating film for semiconductors |
| 02/13/2007 | US7176135 EBR shape of spin-on low-k material providing good film stacking |
| 02/13/2007 | US7176131 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same |
| 02/13/2007 | US7176129 Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications |
| 02/13/2007 | US7176128 Method for fabrication of a contact structure |
| 02/13/2007 | US7176127 Method of manufacturing semiconductor device having through hole with adhesion layer thereon |
| 02/13/2007 | US7176124 Method for fabricating electronic device |
| 02/13/2007 | US7176121 Semiconductor device and manufacturing method thereof |
| 02/13/2007 | US7176117 Method for mounting passive components on wafer |
| 02/13/2007 | US7176106 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging |
| 02/13/2007 | US7176096 Transistor gate and local interconnect |