| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/15/2007 | US20070034994 Package frame and semiconductor package using the same |
| 02/15/2007 | US20070034993 Semiconductor assembly and packaging for high current and low inductance |
| 02/15/2007 | US20070034992 Insulating film-forming composition, insulating film and production method thereof |
| 02/15/2007 | US20070034989 Capacitive element, method of manufacture of the same, and semiconductor device |
| 02/15/2007 | US20070034988 Metal-Insulator-Metal (MIM) Capacitors Formed Beneath First Level Metallization and Methods of Forming Same |
| 02/15/2007 | US20070034985 Semiconductor device and method of manufacturing the same |
| 02/15/2007 | US20070034984 Chip-scale schottky device |
| 02/15/2007 | US20070034960 ESD protection structure using contact-via chains as ballast resistors |
| 02/15/2007 | US20070034959 Integrated circuit arrangements with ESD-resistant capacitor and corresponding method of production |
| 02/15/2007 | US20070034958 Electro-static discharge protecting device and method for fabricating the same |
| 02/15/2007 | US20070034957 Electrostatic foot for non-permanent attachment |
| 02/15/2007 | US20070034956 Embedded silicon-controlled rectifier (SCR) for HVPMOS ESD protection |
| 02/15/2007 | US20070034946 Semiconductor device |
| 02/15/2007 | US20070034889 Diode housing |
| 02/15/2007 | US20070034868 Semiconductor device and test system thereof |
| 02/15/2007 | US20070034403 Four-way lead flat package IC-mount printed circuit board, method of soldering four-way-lead flat package IC and air conditioner |
| 02/15/2007 | US20070034356 Cooling systems incorporating heat exchangers and thermoelectric layers |
| 02/15/2007 | US20070033796 Cross-over of conductive interconnects and a method of crossing conductive interconnects |
| 02/15/2007 | DE202006016298U1 Cooling unit comprises base with transverse grooves and upper unit with rows of peripheral ribs, base being pressed on to curved section which protrudes downwards from lower surface of upper unit |
| 02/15/2007 | DE10343279B4 Elektrisches Leitungssystem Electrical conduction system |
| 02/15/2007 | DE102006036963A1 Semiconductor device comprises ferrite structure formed between conductive pad and termination point |
| 02/15/2007 | DE102006023177A1 Planare Wärmeableitungsvorrichtung Planar heat dissipation device |
| 02/15/2007 | DE102006020853A1 Anzeige und Tape-carrier-package-Aufbau Display and tape carrier package structure |
| 02/15/2007 | DE102005060641A1 Halbleiterdrucksensor Semiconductor pressure sensor |
| 02/15/2007 | DE102005039068A1 Halbleitersubstrat und Verfahren zur Herstellung Semiconductor substrate and process for producing |
| 02/15/2007 | DE102005037948A1 Sensoranordnung mit einem Sensorbauelement und einem Träger und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a sensor device and a support and method for manufacturing a sensor arrangement |
| 02/15/2007 | DE102005037869A1 Anordnung zur hermetischen Abdichtung von Bauelementen und Verfahren zu deren Herstellung Arrangement for hermetic sealing of devices and methods for their preparation |
| 02/15/2007 | DE102005037522A1 Leistungshalbleitermodul mit wannenförmigem Grundkörper Power semiconductor module with tub-body |
| 02/15/2007 | DE102005037460A1 Arrangement with at least one IC has components with circuit carrier and conductive electrodes with separation of conductive sections on IC and carrier to ensure electromagnetic compatibility |
| 02/15/2007 | DE102005037321A1 Halbleiterbauteil mit Leiterbahnen zwischen Halbleiterchip und Schaltungsträger und Verfahren zur Herstellung desselben Of the same semiconductor device having conductive paths between the semiconductor chip and other circuit carriers and methods for making |
| 02/15/2007 | DE102005036445A1 Ignition coil for an internal combustion engine comprises a damping composition partially surrounded by an insulating composition which fills intermediate spaces in a housing |
| 02/15/2007 | DE102005036116A1 Power semi-conductor module comprises has both first semi-conductor chip, with semi-conductor element, and second semi-conductor chip, with control electronics, soldered on structured metalization |
| 02/14/2007 | EP1753278A1 Multilayer printed wiring board |
| 02/14/2007 | EP1753275A2 Using rows/columns of micro-vias in a BGA interconnect grid to create improved PCB routing channels |
| 02/14/2007 | EP1753274A2 Alternating micro-vias and through-hole vias for a BGA interconnect grid in order to create improved PCB routing channels |
| 02/14/2007 | EP1753027A1 Monolithic assembly, especially integrated circuit, with a floating electrode |
| 02/14/2007 | EP1753026A2 Semiconductor device |
| 02/14/2007 | EP1753025A2 Power semiconductor module with a bowl-shaped support base |
| 02/14/2007 | EP1753024A1 High frequency package device |
| 02/14/2007 | EP1753023A2 Method of manufacturing an electronic device in a cavity with a cover |
| 02/14/2007 | EP1753021A1 Semiconductor device and method for manufacturing same |
| 02/14/2007 | EP1753020A1 Semiconductor device and method for fabricating the same |
| 02/14/2007 | EP1752734A2 Semiconductor device |
| 02/14/2007 | EP1751800A1 Method for suppressing latch-ups occurring in a circuit, and systems for carrying out said method |
| 02/14/2007 | EP1751799A1 Metal interconnects for image sensors |
| 02/14/2007 | EP1751798A1 Tamper respondent covering |
| 02/14/2007 | EP1751797A1 Switching element and method for protecting a circuit comprising a load |
| 02/14/2007 | EP1751796A1 Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
| 02/14/2007 | EP1751795A1 Method for construction of rigid photovoltaic modules |
| 02/14/2007 | EP1751793A2 Packaged integrated circuit devices |
| 02/14/2007 | EP1456881B1 Method for determining the esd/latch-up resistance of an integrated circuit |
| 02/14/2007 | EP1445995B1 Method of mounting an electronic component on a circuit board and system for carrying out the method |
| 02/14/2007 | EP1434268B1 Electronic substrate, power module and motor driver |
| 02/14/2007 | EP1324851A4 Polymer collar for solder bumps |
| 02/14/2007 | EP1100096B1 Electronic device and manufacture thereof |
| 02/14/2007 | EP1008186B1 Power transistor cell |
| 02/14/2007 | CN2870410Y Radiating structure |
| 02/14/2007 | CN2870409Y Wind-guide cover |
| 02/14/2007 | CN2870173Y CPU radiator fastening assembly |
| 02/14/2007 | CN2870172Y Housing structure with built-in radiating protection |
| 02/14/2007 | CN2869948Y Self protective voltage switch-over circuit |
| 02/14/2007 | CN1914968A Method and system for cooling high power density devices |
| 02/14/2007 | CN1914966A 多层印刷配线板 Multilayer printed wiring board |
| 02/14/2007 | CN1914963A Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 02/14/2007 | CN1914962A Method for increasing a routing density for a circuit board and such a circuit board |
| 02/14/2007 | CN1914734A Semiconductor device and process for fabricating the same |
| 02/14/2007 | CN1914730A Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 02/14/2007 | CN1914729A 半导体器件 Semiconductor devices |
| 02/14/2007 | CN1914728A 半导体器件 Semiconductor devices |
| 02/14/2007 | CN1914727A Electronic component and method for manufacturing the same |
| 02/14/2007 | CN1914726A System and method pertaining to semiconductor dies |
| 02/14/2007 | CN1914725A Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 02/14/2007 | CN1914724A Insert molding electronic devices |
| 02/14/2007 | CN1914723A Method of packaging an optical sensor |
| 02/14/2007 | CN1914720A Semiconductor package with contact support layer and method to produce the package |
| 02/14/2007 | CN1914719A Flipchip QFN package and method therefor |
| 02/14/2007 | CN1914514A Method and apparatus for testing integrated circuits for susceptibility to latch-up |
| 02/14/2007 | CN1913762A Heat uniform temp cavity and its manufacturing method |
| 02/14/2007 | CN1913761A Radiation device |
| 02/14/2007 | CN1913759A Integral liquid-cooled radiator |
| 02/14/2007 | CN1913747A Using rows/columns of micro-vias in a BGA interconnect grid to create improved PCB routing channels |
| 02/14/2007 | CN1913317A Brushless excitation steam turbine rotation rectifier |
| 02/14/2007 | CN1913276A Silicon-controlled rectifier for electrostatic discharge protection circuits and structure thereof |
| 02/14/2007 | CN1913187A Light emitting diode package having recess in heat conducting part |
| 02/14/2007 | CN1913174A Semiconductor device and high voltage p-type metal oxide semiconductor (HVPMOS) device |
| 02/14/2007 | CN1913171A Light emitting device and manufacturing method |
| 02/14/2007 | CN1913168A Compound semiconductor anti-static method and flip-chip semiconductor assembly with anti-static ability |
| 02/14/2007 | CN1913161A Connection structure and method for manufacturing same |
| 02/14/2007 | CN1913157A Electro-static discharge protecting device and method for fabricating the same |
| 02/14/2007 | CN1913152A Multi-chip structure |
| 02/14/2007 | CN1913150A Method for fabricating electronic circuit module and integrated circuit device |
| 02/14/2007 | CN1913149A Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device |
| 02/14/2007 | CN1913148A ESD protection device and semiconductor chip |
| 02/14/2007 | CN1913147A Electrostatic discharge ring structure |
| 02/14/2007 | CN1913146A Thin film conductor and method of fabrication |
| 02/14/2007 | CN1913145A Driving film, driving package, manufacturing method thereof and display comprising the same |
| 02/14/2007 | CN1913144A Printed circuit board and electronic apparatus including printed circuit board |
| 02/14/2007 | CN1913143A Semiconductor device |
| 02/14/2007 | CN1913142A Circuit board and circuit apparatus using the same |
| 02/14/2007 | CN1913141A Semiconductor device and method of manufacturing the same |