| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/20/2007 | US7179729 Heat treatment apparatus and method of manufacturing a semiconductor device |
| 02/20/2007 | US7179728 Optical component and manufacturing method thereof, microlens substrate and manufacturing method thereof, display device, and imaging device |
| 02/20/2007 | US7179718 Structure and method of manufacturing the same |
| 02/20/2007 | US7179695 Method of forming wiring |
| 02/20/2007 | US7179688 Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method |
| 02/20/2007 | US7179687 Semiconductor device and its manufacturing method, and semiconductor device manufacturing system |
| 02/20/2007 | US7179686 Manufacturing method of semiconductor device |
| 02/20/2007 | US7179685 Fabrication method for stacked multi-chip package |
| 02/20/2007 | US7179684 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 02/20/2007 | US7179683 Substrate grooves to reduce underfill fillet bridging |
| 02/20/2007 | US7179681 Techniques for packaging multiple device components |
| 02/20/2007 | US7179680 Method for producing an optoelectronic component |
| 02/20/2007 | US7179666 Method for manufacturing an electronic circuit device and electronic circuit device |
| 02/20/2007 | US7179662 Semiconductor fuse covering |
| 02/20/2007 | US7179567 Phase shift mask blank, phase shift mask, and method of manufacture |
| 02/20/2007 | US7179537 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same |
| 02/20/2007 | US7179520 Circuit substrate, electro-optic device and electronic equipment |
| 02/20/2007 | US7179503 Placing the metal film precursor on an organic film to produce a transfer sheet, contacting the surface with a substrate, and heating the sheet to decompose the film and the precursor and join the metal ultrafine particles |
| 02/20/2007 | US7179399 Material for forming protective film |
| 02/20/2007 | US7178586 Flattened tube cold plate for liquid cooling electrical components |
| 02/20/2007 | US7178345 Stacked-plate gas-expansion cooler assembly, fabrication method, and use |
| 02/20/2007 | US7178234 Method of manufacturing multi-layer printed circuit board |
| 02/20/2007 | US7178233 Process for producing a collapsed filled via hole |
| 02/17/2007 | CA2555394A1 Power semiconductor packaging method and structure |
| 02/15/2007 | WO2007019199A1 Methods of forming through-wafer interconnects and structures resulting therefrom |
| 02/15/2007 | WO2007019125A1 Thermally conductive grease |
| 02/15/2007 | WO2007018856A1 Ic with on-die power-gating circuit |
| 02/15/2007 | WO2007018761A2 Security method for data protection |
| 02/15/2007 | WO2007018643A1 Radio frequency over-molded leadframe package |
| 02/15/2007 | WO2007018473A1 Leadframe and semiconductor package |
| 02/15/2007 | WO2007018268A1 Material for insulating film, method of film formation therefrom and insulating film |
| 02/15/2007 | WO2007018237A1 Semiconductor device and method for manufacturing same |
| 02/15/2007 | WO2007018052A1 Planar electronic display device and process for producing the same |
| 02/15/2007 | WO2007018050A1 Silicon nitride substrate, silicon nitride circuit substrate using the same, and its use |
| 02/15/2007 | WO2007017980A1 Method for manufacturing electronic component and electronic component |
| 02/15/2007 | WO2007017945A1 Heat sink and method of producing the same |
| 02/15/2007 | WO2007017672A1 Method of integrating an element |
| 02/15/2007 | WO2007017400A1 Dry etchback of interconnect contacts |
| 02/15/2007 | WO2007016909A1 Electrical component |
| 02/15/2007 | WO2007016886A1 Metal-ceramic substrate |
| 02/15/2007 | WO2006120627A3 An electronic device, a housing part, an assembly and a method for manufacturing an electronic device |
| 02/15/2007 | WO2006114726A3 A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device |
| 02/15/2007 | US20070037453 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation |
| 02/15/2007 | US20070037382 Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof |
| 02/15/2007 | US20070037375 Semiconductor memory devices having contact pads with silicide caps thereon |
| 02/15/2007 | US20070037320 Multichip packages with exposed dice |
| 02/15/2007 | US20070037319 Semiconductor package with contact support layer and method to produce the package |
| 02/15/2007 | US20070037317 Method and device for attaching a chip in a housing |
| 02/15/2007 | US20070037315 Silicone Metalization |
| 02/15/2007 | US20070036981 Molding compositions containing quaternary organophosphonium salts |
| 02/15/2007 | US20070036971 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 02/15/2007 | US20070036952 Method And Device For Enhancing Solderability |
| 02/15/2007 | US20070036944 Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly |
| 02/15/2007 | US20070035927 Heat dissipating device with enhanced boiling/condensation structure |
| 02/15/2007 | US20070035816 Method of manufacturing a semiconductor device having a porous dielectric layer and air gaps |
| 02/15/2007 | US20070035040 Alignment error measuring mark and method for manufacturing semiconductor device using the same |
| 02/15/2007 | US20070035039 Overlay marker for use in fabricating a semiconductor device and related method of measuring overlay accuracy |
| 02/15/2007 | US20070035038 Novel bonding pad structure to minimize IMD cracking |
| 02/15/2007 | US20070035037 Semiconductor chip and multi-chip package |
| 02/15/2007 | US20070035036 Semiconductor device, laminated semiconductor device, and wiring substrate |
| 02/15/2007 | US20070035035 Bonded structure and bonding method |
| 02/15/2007 | US20070035034 System and Method for Improved Auto-Boating |
| 02/15/2007 | US20070035033 Stackable tier structure comprising high density feedthrough |
| 02/15/2007 | US20070035032 Semiconductor device having aerial wiring and manufacturing method thereof |
| 02/15/2007 | US20070035030 Techniques for providing decoupling capacitance |
| 02/15/2007 | US20070035029 Production of a self-aligned CuSiN barrier |
| 02/15/2007 | US20070035028 Semiconductor memory devices and methods of fabricating the same |
| 02/15/2007 | US20070035027 Method for forming conductors in semiconductor devices |
| 02/15/2007 | US20070035026 Via in semiconductor device |
| 02/15/2007 | US20070035025 Damascene processing using dielectric barrier films |
| 02/15/2007 | US20070035024 Semiconductor device having an improved wiring or electrode structure |
| 02/15/2007 | US20070035023 Semiconductor device having improved mechanical and thermal reliability |
| 02/15/2007 | US20070035022 Semiconductor device and method of manufacturing the same |
| 02/15/2007 | US20070035021 Printed circuit board and electronic apparatus including printed circuit board |
| 02/15/2007 | US20070035020 Semiconductor Apparatus and Semiconductor Module |
| 02/15/2007 | US20070035019 Semiconductor component and method of manufacture |
| 02/15/2007 | US20070035018 Mount for a programmable electronic processing device |
| 02/15/2007 | US20070035017 Semiconductor device |
| 02/15/2007 | US20070035016 Semiconductor device |
| 02/15/2007 | US20070035015 Stack structure with semiconductor chip embedded in carrier |
| 02/15/2007 | US20070035014 Method and circuit for reducing series inductance of a decoupling capacitor in a ball grid array (BGA) |
| 02/15/2007 | US20070035013 Module with built-in circuit elements |
| 02/15/2007 | US20070035012 Integrated solder and heat spreader fabrication |
| 02/15/2007 | US20070035011 Integrated Circuit Apparatus with Heat Speader |
| 02/15/2007 | US20070035010 Circuit substrate |
| 02/15/2007 | US20070035009 Printed circuit board, semiconductor package and multi-stack semiconductor package using the same |
| 02/15/2007 | US20070035008 Thin IC package for improving heat dissipation from chip backside |
| 02/15/2007 | US20070035007 Differential chip performance within a multi-chip package |
| 02/15/2007 | US20070035006 Stackable single package and stacked multi-chip assembly |
| 02/15/2007 | US20070035005 Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid |
| 02/15/2007 | US20070035004 Semiconductor module |
| 02/15/2007 | US20070035003 Three-dimensional stack manufacture for integrated circuit devices and method of manufacture |
| 02/15/2007 | US20070035002 Semiconductor device and a manufacturing method of the same |
| 02/15/2007 | US20070035001 Chip scale package for a micro component |
| 02/15/2007 | US20070035000 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device |
| 02/15/2007 | US20070034999 Chip module and chip card |
| 02/15/2007 | US20070034998 Method for fabricating wafer level semiconductor package with build-up layer |
| 02/15/2007 | US20070034997 Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same |
| 02/15/2007 | US20070034996 System and Method for Forming One or More Integrated Circuit Packages Using a Flexible Leadframe Structure |
| 02/15/2007 | US20070034995 Optical Semiconductor Device and Method of Manufacturing the Same |