| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/21/2007 | CN1917192A Switchable seat for radiator |
| 02/21/2007 | CN1917191A Heat sink |
| 02/21/2007 | CN1917190A Heat sink for heat pipe |
| 02/21/2007 | CN1917189A Modular heat sink assembly |
| 02/21/2007 | CN1917188A Heat elimination type structure for packing complex crystal |
| 02/21/2007 | CN1917158A Power semiconductor packaging method and structure |
| 02/21/2007 | CN1917157A Structure for packing chip with crystal cavity downward, and manufacturing method |
| 02/21/2007 | CN1917156A Encapsulated chip scale package having flip-chip on lead frame structure and method |
| 02/21/2007 | CN1917149A Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus |
| 02/21/2007 | CN1917142A Semiconductor device manufacturing apparatus |
| 02/21/2007 | CN1916484A LED illuminator having high power and high radiation efficiency |
| 02/21/2007 | CN1916483A High power, high efficiency systematic packed LED lamp |
| 02/21/2007 | CN1301634C 信号传输结构 Signal transmission structure |
| 02/21/2007 | CN1301577C Water getter devices for laser amplifiers and process for manufacture thereof |
| 02/21/2007 | CN1301555C Tin indium oxide wiring method for electrostatic discharging of integrated circuit bearable high-voltage |
| 02/21/2007 | CN1301554C 半导体器件 Semiconductor devices |
| 02/21/2007 | CN1301553C Liquid cooling radiator |
| 02/21/2007 | CN1301544C Method of manufacturing semiconductor device |
| 02/21/2007 | CN1301543C Semiconductor wafer, semiconductor device and its producing method, circuit base baord and electronic machine |
| 02/21/2007 | CN1301542C Semiconductor wafer, semiconductor device and its producing method, circuit base board and electronic machine |
| 02/21/2007 | CN1301541C Manufacture method of semiconductor device |
| 02/21/2007 | CN1301540C Flip chip assembly process and substrate used therewith and printed screen free from being stained with solder |
| 02/20/2007 | US7180929 Wafer-level test structure for edge-emitting semiconductor lasers |
| 02/20/2007 | US7180810 Method of breaking down a fuse in a semiconductor device |
| 02/20/2007 | US7180749 Circuit board and its manufacturing method |
| 02/20/2007 | US7180747 Heat dissipation device for a computer mother board |
| 02/20/2007 | US7180745 Flip chip heat sink package and method |
| 02/20/2007 | US7180744 Heat sink mounting device |
| 02/20/2007 | US7180743 Fastener for heat sink |
| 02/20/2007 | US7180742 Apparatus and method for cooling semiconductor devices |
| 02/20/2007 | US7180741 Spray cool system with a dry access chamber |
| 02/20/2007 | US7180640 Monolithic micro scanning device |
| 02/20/2007 | US7180593 Overlay mark for aligning different layers on a semiconductor wafer |
| 02/20/2007 | US7180546 Devices including a thermally conductive member which guides heat produced by an image capturing unit to a display chassis |
| 02/20/2007 | US7180394 Millimeter wave (MMW) radio frequency transceiver module and method of forming same |
| 02/20/2007 | US7180393 Device with hybrid microwave circuits shielded by elastic contact members |
| 02/20/2007 | US7180319 Selecting groups of dies for wafer testing |
| 02/20/2007 | US7180228 Surface acoustic wave device, package for the device, and method of fabricating the device |
| 02/20/2007 | US7180199 Semiconductor device and semiconductor wafer |
| 02/20/2007 | US7180198 Method of fabricating polycrystalline silicon and switching device using polycrystalline silicon |
| 02/20/2007 | US7180197 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 02/20/2007 | US7180196 Semiconductor device mounting method, semiconductor device mounting structure, electro-optical device, electro-optical device manufacturing method and electronic device |
| 02/20/2007 | US7180195 Method and apparatus for improved power routing |
| 02/20/2007 | US7180194 Semiconductor device with multi-staged cut side surfaces |
| 02/20/2007 | US7180193 Via recess in underlying conductive line |
| 02/20/2007 | US7180192 Semiconductor device |
| 02/20/2007 | US7180191 Semiconductor device and method of manufacturing a semiconductor device |
| 02/20/2007 | US7180190 Electrode line structure having fine line width and method of forming the same |
| 02/20/2007 | US7180189 Abberation mark and method for estimating overlay error and optical abberations |
| 02/20/2007 | US7180188 Contact structure of semiconductor devices and method of fabricating the same |
| 02/20/2007 | US7180187 Interlayer connector for preventing delamination of semiconductor device |
| 02/20/2007 | US7180186 Ball grid array package |
| 02/20/2007 | US7180185 Semiconductor device with connections for bump electrodes |
| 02/20/2007 | US7180184 Conductive bump for semiconductor device and method for making the same |
| 02/20/2007 | US7180183 Semiconductor device with reinforced under-support structure and method of fabricating the same |
| 02/20/2007 | US7180182 Semiconductor component |
| 02/20/2007 | US7180181 Mesh shaped dam mounted on a substrate |
| 02/20/2007 | US7180180 Stacked device underfill and a method of fabrication |
| 02/20/2007 | US7180179 Thermal interposer for thermal management of semiconductor devices |
| 02/20/2007 | US7180178 Semiconductor heat-dissipating substrate, and manufacturing method and package therefor |
| 02/20/2007 | US7180177 Power supply component assembly on a printed circuit and method for obtaining same |
| 02/20/2007 | US7180176 Radiation plate and power semiconductor module IC package |
| 02/20/2007 | US7180175 Thermally-enhanced ball grid array package structure and method |
| 02/20/2007 | US7180174 Nanotube modified solder thermal intermediate structure, systems, and methods |
| 02/20/2007 | US7180173 Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) |
| 02/20/2007 | US7180172 Circuits, multi-layer circuits, and methods of manufacture thereof |
| 02/20/2007 | US7180171 Single IC packaging solution for multi chip modules |
| 02/20/2007 | US7180170 Lead-free integrated circuit package structure |
| 02/20/2007 | US7180169 Circuit component built-in module and method for manufacturing the same |
| 02/20/2007 | US7180168 Stacked semiconductor chips |
| 02/20/2007 | US7180167 Low profile stacking system and method |
| 02/20/2007 | US7180166 Stacked multi-chip package |
| 02/20/2007 | US7180165 Stackable electronic assembly |
| 02/20/2007 | US7180164 Semiconductor device |
| 02/20/2007 | US7180163 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| 02/20/2007 | US7180162 Arrangement for reducing stress in substrate-based chip packages |
| 02/20/2007 | US7180161 Lead frame for improving molding reliability and semiconductor package with the lead frame |
| 02/20/2007 | US7180154 Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same |
| 02/20/2007 | US7180153 Capture of residual refractory metal within semiconductor device |
| 02/20/2007 | US7180152 Process for resurf diffusion for high voltage MOSFET |
| 02/20/2007 | US7180149 Semiconductor package with through-hole |
| 02/20/2007 | US7180143 Semiconductor device having a gate insulating layer being mainly made of silicon oxynitride (SiON) having a compression strain state as its strain state |
| 02/20/2007 | US7180139 Pixel structure |
| 02/20/2007 | US7180137 Semiconductor device |
| 02/20/2007 | US7180119 Capacitor and method for fabricating the same, and semiconductor device and method for fabricating the same |
| 02/20/2007 | US7180117 Flat-type capacitor for integrated circuit and method of manufacturing the same |
| 02/20/2007 | US7180114 Semiconductor device |
| 02/20/2007 | US7180102 Method and apparatus for using cobalt silicided polycrystalline silicon for a one time programmable non-volatile semiconductor memory |
| 02/20/2007 | US7180090 Method of forming thin-film transistor devices with electro-static discharge protection |
| 02/20/2007 | US7180071 Integrated circuit having radiation sensor arrangement |
| 02/20/2007 | US7180012 Module part |
| 02/20/2007 | US7180006 Tape substrate and method for fabricating the same |
| 02/20/2007 | US7180005 Printed wiring board |
| 02/20/2007 | US7179747 Use of supercritical fluid for low effective dielectric constant metallization |
| 02/20/2007 | US7179743 Titanium underlayer for lines in semiconductor devices |
| 02/20/2007 | US7179742 Interconnect circuitry, multichip module, and methods for making them |
| 02/20/2007 | US7179738 Semiconductor assembly having substrate with electroplated contact pads |
| 02/20/2007 | US7179737 Semiconductor device and a method of manufacturing the same |
| 02/20/2007 | US7179735 Method of manufacturing semiconductor device |
| 02/20/2007 | US7179734 Method for forming dual damascene pattern |