| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/22/2007 | US20070040263 Green data center and virtual power plant |
| 02/22/2007 | US20070040262 Flexible substrate capable of preventing lead thereon from fracturing |
| 02/22/2007 | US20070040261 Semiconductor component comprising an interposer substrate and method for the production thereof |
| 02/22/2007 | US20070040260 Power semiconductor device comprising a semiconductor chip stack and method for producing the same |
| 02/22/2007 | US20070040259 Bumpless chip package |
| 02/22/2007 | US20070040258 Method of packaging and interconnection of integrated circuits |
| 02/22/2007 | US20070040257 Chip packages with covers |
| 02/22/2007 | US20070040256 Semiconductor device, method of authentifying and system |
| 02/22/2007 | US20070040255 Semiconductor device |
| 02/22/2007 | US20070040254 Semiconductor die package |
| 02/22/2007 | US20070040253 Chip type led |
| 02/22/2007 | US20070040252 Semiconductor power component with a vertical current path through a semiconductor power chip |
| 02/22/2007 | US20070040251 Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly |
| 02/22/2007 | US20070040250 Semiconductor device |
| 02/22/2007 | US20070040249 Semiconductor device |
| 02/22/2007 | US20070040248 Semiconductor device |
| 02/22/2007 | US20070040247 Leadframe package with dual lead configurations |
| 02/22/2007 | US20070040246 Touch pad module with electrostatic discharge protection |
| 02/22/2007 | US20070040245 Anisotropic conductive sheet, manufacturing method thereof, and product using the same |
| 02/22/2007 | US20070040244 Substrate for sensors |
| 02/22/2007 | US20070040243 Insulating target material, method of manufacturing insulating target material, conductive complex oxide film, and device |
| 02/22/2007 | US20070040242 Semiconductor Device and Method for Manufacturing the Same |
| 02/22/2007 | US20070040241 Wafer inspection device |
| 02/22/2007 | US20070040222 Method and apparatus for improved ESD performance |
| 02/22/2007 | US20070040221 Electrostatic discharge protection element |
| 02/22/2007 | US20070040220 An electrostatic discharge circuit |
| 02/22/2007 | US20070040213 Trench gate field effect devices |
| 02/22/2007 | US20070040185 Semiconductor device and capacitance regulation circuit |
| 02/22/2007 | US20070040184 Semiconductor device and capacitance regulation circuit |
| 02/22/2007 | US20070040180 Integrated circuit device |
| 02/22/2007 | US20070040173 Source/drain electrodes, transistor substrates and manufacture methods, thereof, and display devices |
| 02/22/2007 | US20070039817 Copper-containing pvd targets and methods for their manufacture |
| 02/22/2007 | DE112005000386T5 Duales Regelungssystem zum Halten der Temperatur eines IC-Chips in der Nähe eines Sollwertes Dual control system for maintaining the temperature of IC-chips near a set point |
| 02/22/2007 | DE10316429B4 TAB-Folienband für eine Halbleiterpackung TAB film tape for a semiconductor package |
| 02/22/2007 | DE10231385B4 Halbleiterchip mit Bondkontaktstellen und zugehörige Mehrchippackung Semiconductor chip bond pads and associated multi-chip package |
| 02/22/2007 | DE102006037717A1 Wiring structure e.g. for semiconductor wafer plane pack, has insulating photo-resist structure on surface of conductive structure |
| 02/22/2007 | DE102006035114A1 Semiconductor package, useful for surface mounting, comprises substrate, semiconductor chips and transparent resin layer |
| 02/22/2007 | DE102005051857A1 UBM-PAD, Lötkontakt und Verfahren zur Herstellung einer Lötverbindung UBM pad, solder contact and method for making a solder joint |
| 02/22/2007 | DE102005039478A1 Leistungshalbleiterbauteil mit Halbleiterchipstapel und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack and processes for preparing |
| 02/22/2007 | DE102005039365A1 Gate-gesteuertes Fin-Widerstandselement zur Verwendung als ESD-Schutzelement in einem elektrischen Schaltkreis und Einrichtung zum Schutz vor elektrostatischen Entladungen in einem elektrischen Schaltkreis Gate controlled fin resistance element for use as an ESD protection element in an electric circuit and device for protection against electrostatic discharges in an electrical circuit |
| 02/22/2007 | DE102005039323A1 Conduction path arrangement for semiconductor technology, has support paths formed between substrate and conduction paths for supporting conduction paths |
| 02/22/2007 | DE102005039278A1 Leistungshalbleitermodul mit Leitungselement Power semiconductor module with duct element |
| 02/22/2007 | DE102005038760A1 Metal-ceramic hybrid substrate for power-semiconductor components, has top metal layer structured into conductor paths and pads |
| 02/22/2007 | DE102005038752A1 Method for mounting semiconductor chips on substrate, |
| 02/22/2007 | DE102005038443A1 Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a substrate and having a housing and method for producing a sensor arrangement |
| 02/22/2007 | DE102005038219A1 Integrated circuit arrangement, has capacitor in conduction path layer and provided with ground electrode, dielectric, and cover electrode |
| 02/22/2007 | DE102005006730B4 Halbleiterchippackung und zugehöriges Herstellungsverfahren A semiconductor chip package and associated production method |
| 02/22/2007 | DE10124970B4 Elektronisches Bauteil mit einem Halbleiterchip auf einer Halbleiterchip-Anschlußplatte, Systemträger und Verfahren zu deren Herstellung Electronic component having a semiconductor chip on a semiconductor chip lead plate, lead frame and method for producing them |
| 02/21/2007 | EP1755367A2 Surface mounting component and mounted structure of surface mounting component |
| 02/21/2007 | EP1755162A2 Power semiconductor packaging method and structure |
| 02/21/2007 | EP1755161A2 Interconnect module with reduced power distribution impedance |
| 02/21/2007 | EP1755160A1 Copper base for electronic component, electronic component, and process for producing copper base for electronic component |
| 02/21/2007 | EP1754772A1 Heat conductive silicone grease composition and cured product thereof |
| 02/21/2007 | EP1754735A1 One pack thermosetting type epoxy resin composition and underfilling materials for semiconductor mounting |
| 02/21/2007 | EP1754401A1 Heat spreader with controlled z-axis conductivity |
| 02/21/2007 | EP1754259A2 Direct cooling of leds |
| 02/21/2007 | EP1754256A1 Chip having two groups of chip contacts |
| 02/21/2007 | EP1754235A2 Thermally conductive compositions and methods of making thereof |
| 02/21/2007 | EP1754013A1 Heat transport device |
| 02/21/2007 | EP1754011A2 Hotspot spray cooling |
| 02/21/2007 | EP1501756B1 Method of manufacturing an electronic device in a cavity with a cover |
| 02/21/2007 | EP1495105B1 Substrate and method for measuring the electrophysiological properties of cell membranes |
| 02/21/2007 | EP1384264B1 Metal-to-metal antifuse structure and fabrication method |
| 02/21/2007 | EP1305838B1 Low-temperature fabrication of thin-film energy-storage devices |
| 02/21/2007 | CN2872801Y Base of radiator |
| 02/21/2007 | CN2872796Y Electronic assembly |
| 02/21/2007 | CN2872595Y Stand of light-emitting diode |
| 02/21/2007 | CN2872594Y Chip with scab structure |
| 02/21/2007 | CN2872593Y Structure of radiator |
| 02/21/2007 | CN2872592Y Radiator |
| 02/21/2007 | CN2872591Y Cooling of projecting light-emitting diode |
| 02/21/2007 | CN1918952A Preferential ground and via exit structures for printed circuit boards |
| 02/21/2007 | CN1918715A Device for cooling an electrical component and production method thereof |
| 02/21/2007 | CN1918707A Circuit arrangement and method for protecting an integrated semiconductor circuit |
| 02/21/2007 | CN1918706A Electronic device cooling device and electronic device cooling method |
| 02/21/2007 | CN1918703A Resin compositions and methods of use thereof |
| 02/21/2007 | CN1918583A Electronic device |
| 02/21/2007 | CN1918207A Encapsulation epoxy resin material and electronic component |
| 02/21/2007 | CN1917753A Module of heat elimination, and method for connecting between sub-assembles |
| 02/21/2007 | CN1917751A Heat sink, and test fixture of using the heat sink |
| 02/21/2007 | CN1917321A Thermal protection circuit, power transmission integration circuit and power transmission method |
| 02/21/2007 | CN1917311A Heat sink of encapsulation through high frequency in use for semiconductor laser modulated by electrical absorption |
| 02/21/2007 | CN1917243A Light emitting device |
| 02/21/2007 | CN1917224A Coated wafer level camera modules and associated methods |
| 02/21/2007 | CN1917221A Display substrate, method of manufacturing the same and display device having the same |
| 02/21/2007 | CN1917217A Dense non-volatile memory array and method of fabrication |
| 02/21/2007 | CN1917211A Dynamic random access memory, and manufacturing method |
| 02/21/2007 | CN1917206A Net of power supply ground for integrated circuit, and arrangement method |
| 02/21/2007 | CN1917204A Optical module with flexible substrate |
| 02/21/2007 | CN1917203A Power semiconductor module with wiring element |
| 02/21/2007 | CN1917202A Wire structure, a method for fabricating a wire, a thin film transistor substrate, and a method for fabricating the thin film transistor substrate |
| 02/21/2007 | CN1917201A Semiconductor device and open structure of semiconductor device |
| 02/21/2007 | CN1917200A Heat elimination type packaging structure in sphere grid array |
| 02/21/2007 | CN1917199A Semiconductor component and method of manufacture |
| 02/21/2007 | CN1917198A Semiconductor device and manufacturing method of the same |
| 02/21/2007 | CN1917197A Bonded structure and bonding method |
| 02/21/2007 | CN1917196A Packaging structure of pillar grid array, and electronic device |
| 02/21/2007 | CN1917195A Flexible base palte in use for packing semiconductor, and onload packaging structure |
| 02/21/2007 | CN1917194A Heat sink |
| 02/21/2007 | CN1917193A Heat sink |