| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/27/2007 | US7183638 Embedded heat spreader |
| 02/27/2007 | US7183636 Adapter for a chip card having a reduced format in comparison with the standard SIM mini-card format |
| 02/27/2007 | US7183635 Semiconductor device having a low-resistance bus interconnect, method of manufacturing same, and display apparatus employing same |
| 02/27/2007 | US7183634 Printed circuit board tact switch |
| 02/27/2007 | US7183633 Optical cross-connect system |
| 02/27/2007 | US7183632 Surface-mountable light-emitting diode structural element |
| 02/27/2007 | US7183631 Package structure module of bump posited type lead frame |
| 02/27/2007 | US7183630 Lead frame with plated end leads |
| 02/27/2007 | US7183629 Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line |
| 02/27/2007 | US7183625 Embedded MIM capacitor and zigzag inductor scheme |
| 02/27/2007 | US7183624 Semiconductor device |
| 02/27/2007 | US7183623 Trimmed integrated circuits with fuse circuits |
| 02/27/2007 | US7183619 Surface acoustic wave apparatus |
| 02/27/2007 | US7183616 High speed switching MOSFETS using multi-parallel die packages with/without special leadframes |
| 02/27/2007 | US7183601 Semiconductor device and method for manufacturing thereof |
| 02/27/2007 | US7183594 Configurable gate array cell with extended poly gate terminal |
| 02/27/2007 | US7183589 Semiconductor device with a resin-sealed optical semiconductor element |
| 02/27/2007 | US7183580 Electro-optical device, manufacturing method of the same, and electronic apparatus |
| 02/27/2007 | US7183570 IC with comparator receiving expected and mask data from pads |
| 02/27/2007 | US7183496 Soldered heat sink anchor and method of use |
| 02/27/2007 | US7183485 Microelectronic component assemblies having lead frames adapted to reduce package bow |
| 02/27/2007 | US7183212 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device |
| 02/27/2007 | US7183209 Semiconductor device and manufacturing method thereof |
| 02/27/2007 | US7183206 Fabrication of semiconductor devices |
| 02/27/2007 | US7183202 Method of forming metal wiring in a semiconductor device |
| 02/27/2007 | US7183200 Method for fabricating a semiconductor device |
| 02/27/2007 | US7183194 Method of forming socket contacts |
| 02/27/2007 | US7183193 Integrated device technology using a buried power buss for major device and circuit advantages |
| 02/27/2007 | US7183190 Semiconductor device and fabrication method therefor |
| 02/27/2007 | US7183189 Semiconductor device, circuit board, and electronic instrument |
| 02/27/2007 | US7183141 Reversible field-programmable electric interconnects |
| 02/27/2007 | US7183139 Flip-chip system and method of making same |
| 02/27/2007 | US7183138 Method and apparatus for decoupling conductive portions of a microelectronic device package |
| 02/27/2007 | US7183135 Method for manufacturing high-frequency module device |
| 02/27/2007 | US7183134 Ultrathin leadframe BGA circuit package |
| 02/27/2007 | US7183133 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
| 02/27/2007 | US7183132 Semiconductor device in a recess of a semiconductor plate |
| 02/27/2007 | US7182977 Mixture of solvent and metal particles |
| 02/27/2007 | US7182938 and/or titania particles having polysiloxane star or graft copolymer coatings, used as sunscreen agents |
| 02/27/2007 | US7182241 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
| 02/27/2007 | US7182240 Solder coated lid |
| 02/22/2007 | WO2007022399A2 Semiconductor assembly and packaging for high current and low inductance |
| 02/22/2007 | WO2007021736A2 Semiconductor device having improved mechanical and thermal reliability |
| 02/22/2007 | WO2007021390A2 Esd protection structure using contact-via chains as ballast resistors |
| 02/22/2007 | WO2007020961A1 Surface mounted semiconductor device and method for manufacturing same |
| 02/22/2007 | WO2007020878A1 Method and apparatus for producing porous silica |
| 02/22/2007 | WO2007020805A1 Manufacturing method of semiconductor device |
| 02/22/2007 | WO2007020752A1 Vacuum device |
| 02/22/2007 | WO2007020697A1 Flat display device |
| 02/22/2007 | WO2007020688A1 Semiconductor device and method for manufacturing same |
| 02/22/2007 | WO2007020684A1 Semiconductor integrated circuit device and method for manufacture thereof |
| 02/22/2007 | WO2007019733A1 Led illumination device with high power and high heat dissipation rate |
| 02/22/2007 | WO2007019732A1 Surface mount component having magnetic layer thereon and method of forming same |
| 02/22/2007 | WO2006138457A3 Isolating chip-to-chip contact |
| 02/22/2007 | WO2006132957A3 Integrated electronic circuitry and heat sink |
| 02/22/2007 | WO2006125062A3 System for supplying carbon dioxide |
| 02/22/2007 | WO2006100690B1 Selectively grooved cold plate for electronics cooling |
| 02/22/2007 | WO2006058009A3 Using zeolites to improve the mechanical strenght of low-k interlayer dielectrics |
| 02/22/2007 | US20070044061 Semiconductor device, layout method and apparatus and program |
| 02/22/2007 | US20070042895 Heat sink made from diamond-copper composite material containing boron, and method of producing a heat sink |
| 02/22/2007 | US20070042596 Method of forming an interconnect structure for a semiconductor device |
| 02/22/2007 | US20070042595 Packaging of electronic chips with air-bridge structures |
| 02/22/2007 | US20070042594 Semiconductor device and method of manufacturing the same |
| 02/22/2007 | US20070042593 Bonding pad structure and method of forming the same |
| 02/22/2007 | US20070042565 Fluidic MEMS device |
| 02/22/2007 | US20070042562 Integrated circuit device |
| 02/22/2007 | US20070042561 Semiconductor device and productioin method thereof |
| 02/22/2007 | US20070042531 Method for producing semiconductor device and semiconductor device |
| 02/22/2007 | US20070042530 Electronic package for image sensor, and the packaging method thereof |
| 02/22/2007 | US20070042215 Aluminum/ceramic bonding substrate and method for producing same |
| 02/22/2007 | US20070042211 Ternary alloy column grid array |
| 02/22/2007 | US20070042188 Such as a plasma display panel (PDP) or a light emitting diode (LED); comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell facing the back surface of the device |
| 02/22/2007 | US20070041680 Process for assembling passive and active components and corresponding integrated circuit |
| 02/22/2007 | US20070041248 Semiconductor storage device and method of manufacturing the same |
| 02/22/2007 | US20070041163 Method for producing an electronic component or module and a corresponding component or module |
| 02/22/2007 | US20070041159 Electronic cooling apparatus |
| 02/22/2007 | US20070040735 High frequency package, transmitting and receiving module and wireless equipment |
| 02/22/2007 | US20070040286 Structure for circuit assembly |
| 02/22/2007 | US20070040285 Heat dissipating grease |
| 02/22/2007 | US20070040284 Two layer substrate ball grid array design |
| 02/22/2007 | US20070040283 Encapsulated chip scale package having flip-chip on lead frame structure and method |
| 02/22/2007 | US20070040282 Printed circuit board and method thereof and a solder ball land and method thereof |
| 02/22/2007 | US20070040281 Semiconductor device and method of producing the same |
| 02/22/2007 | US20070040280 Multi-chip package for reducing parasitic load of pin |
| 02/22/2007 | US20070040279 Switching device for altering built-in function of IC chip |
| 02/22/2007 | US20070040278 Multifunctional material having carbon-doped titanium oxide layer |
| 02/22/2007 | US20070040277 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing |
| 02/22/2007 | US20070040276 Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application |
| 02/22/2007 | US20070040275 Semiconductor device including diffusion barrier and method for manufacturing the same |
| 02/22/2007 | US20070040274 Interconnect of group iii- v semiconductor device and fabrication method for making the same |
| 02/22/2007 | US20070040273 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
| 02/22/2007 | US20070040272 Method of packaging and interconnection of integrated circuits |
| 02/22/2007 | US20070040271 Integrated circuit package |
| 02/22/2007 | US20070040270 Electronic device and carrier substrate |
| 02/22/2007 | US20070040269 Thermally enhanced cavity down ball grid array package |
| 02/22/2007 | US20070040268 Device package and methods for the fabrication and testing thereof |
| 02/22/2007 | US20070040267 Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features |
| 02/22/2007 | US20070040266 Heat-conducting packaging of electronic circuit units |
| 02/22/2007 | US20070040265 Substrate support having brazed plates and resistance heater |
| 02/22/2007 | US20070040264 Underfilled semiconductor die assemblies and methods of forming the same |