| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/28/2007 | CN2875000Y Flow uniforming net for communication equipment |
| 02/28/2007 | CN2874999Y Heat radiator structure |
| 02/28/2007 | CN2874998Y Fixing device of fan |
| 02/28/2007 | CN2874772Y Integrated light emitting unit |
| 02/28/2007 | CN2874771Y 散热器 Heat sink |
| 02/28/2007 | CN2874770Y Liquid cooling type radiator |
| 02/28/2007 | CN2874769Y Air guide structure of radiator |
| 02/28/2007 | CN1922730A System comprising an electrical component and an electrical connecting lead for said component, and method for the production of said system |
| 02/28/2007 | CN1922729A Heat sink |
| 02/28/2007 | CN1922728A 半导体装置 Semiconductor device |
| 02/28/2007 | CN1922727A Manufacturing method of semiconductor device, integrated circuit card, ic tag, rfid, transponder, bill, negotiable securities, passport, electronic apparatus, bag, and clothing |
| 02/28/2007 | CN1922726A Methods of fabricating interconnects for semiconductor components |
| 02/28/2007 | CN1922401A Piezoelectric pump driving circuit, and cooling system using the same |
| 02/28/2007 | CN1921744A Large power pipe superconductive radiator |
| 02/28/2007 | CN1921743A Integrated liquid cooling heat abstractor |
| 02/28/2007 | CN1921162A Surface mounting type led |
| 02/28/2007 | CN1921130A Solid image pickup unit and camera module |
| 02/28/2007 | CN1921122A Semiconductor device and method for manufacturing the same |
| 02/28/2007 | CN1921121A Asymmetric floating grid NAND flash memory |
| 02/28/2007 | CN1921118A Static discharging device for low voltage triggering and maintaining area |
| 02/28/2007 | CN1921115A Semiconductor device with multiple wiring layers and moisture-protective ring |
| 02/28/2007 | CN1921114A Semiconductor device and method for fabricating the same |
| 02/28/2007 | CN1921113A Static discharging protection circuit for collimation shifter considering power starting sequence |
| 02/28/2007 | CN1921110A Assembly with a power semiconductor module and a connector |
| 02/28/2007 | CN1921108A Semiconductor package and manufacturing method thereof |
| 02/28/2007 | CN1921107A Image sensor module, method of manufacturing the same, and camera module using the same |
| 02/28/2007 | CN1921104A Double-core light-emitting diode for traffic light |
| 02/28/2007 | CN1921103A Laser mark on integrated circuit element |
| 02/28/2007 | CN1921102A Copper interconnect structures and fabrication method thereof, semiconductor device |
| 02/28/2007 | CN1921101A 半导体器件 Semiconductor devices |
| 02/28/2007 | CN1921100A Winding for thin film coating crystal package and its constitution and manufacturing method |
| 02/28/2007 | CN1921099A Integrated circuit packaging structure with pin on the chip and its chip supporting member |
| 02/28/2007 | CN1921098A Packaged semiconductor grain |
| 02/28/2007 | CN1921097A Board having electronic parts mounted by using under-fill material and method for producing the same |
| 02/28/2007 | CN1921096A Semiconductor chip assembly with metal containment wall and solder terminal |
| 02/28/2007 | CN1921095A Semiconductor chip, display panel using the same, and methods of manufacturing semiconductor chip and display panel using the same |
| 02/28/2007 | CN1921094A Radiating fin, radiator built-up by same and its manufacturing method |
| 02/28/2007 | CN1921093A Heat abstractor and heat radiation method |
| 02/28/2007 | CN1921092A Semiconductor device, lead frame and electronic equipment using the semiconductor device |
| 02/28/2007 | CN1921091A Chip carrying winding |
| 02/28/2007 | CN1921085A Circuitry component and method for forming the same |
| 02/28/2007 | CN1921080A Component mounting method and component-mounted body |
| 02/28/2007 | CN1921071A Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device |
| 02/28/2007 | CN1921068A Particle sticking prevention apparatus and plasma processing apparatus |
| 02/28/2007 | CN1921066A Wafer laser marker method and its wafer |
| 02/28/2007 | CN1919849A Method for producing a purified borazine compound, method for filling a container with a borazine compound and container for preserving a borazine compound |
| 02/28/2007 | CN1919520A Laser system and method for processing a memory link with in integrated circuit |
| 02/28/2007 | CN1302695C Module with electric separation |
| 02/28/2007 | CN1302560C 电子电路 Electronic circuit |
| 02/28/2007 | CN1302547C Electrostatic discharge protective circuit structure and manufacturing method thereof |
| 02/28/2007 | CN1302546C Method to improve performance of microelectronic circuits |
| 02/28/2007 | CN1302545C Printed circuit boards with plated resistors and its manufacturing method |
| 02/28/2007 | CN1302544C Mini refrigeration system for computer chip heat radiating |
| 02/28/2007 | CN1302543C Colling mechanism for electronic equipment |
| 02/28/2007 | CN1302542C Module part |
| 02/28/2007 | CN1302541C Chip packaging base plate having flexible circuit board and method for manufacturing the same |
| 02/28/2007 | CN1302534C Semiconductor device with multilayer wiring layers and its mfg. method |
| 02/28/2007 | CN1302533C Ultra-low effective dielectric constant interconnection structure and mfg. method thereof |
| 02/28/2007 | CN1302531C Belt for carrying automatic welding |
| 02/28/2007 | CN1302530C Method for packaging electronic component |
| 02/28/2007 | CN1302357C Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature |
| 02/28/2007 | CN1302356C Cooling apparatus |
| 02/28/2007 | CN1302145C Silver containing copper alloy |
| 02/28/2007 | CN1302070C Flame-retarded epoxy composition for packing semiconductor and semiconductor device |
| 02/28/2007 | CN1301896C Minisize circulating flow passage device made by lead frame |
| 02/27/2007 | US7185296 Method of extraction of wire capacitances in LSI device having diagonal wires and extraction program for same |
| 02/27/2007 | US7184594 Pattern matching method and device, position determining method and device, position aligning method and device, exposing method and device, and device and its production method |
| 02/27/2007 | US7184293 Crosspoint-type ferroelectric memory |
| 02/27/2007 | US7184276 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 02/27/2007 | US7184265 Cooling system for a portable computer |
| 02/27/2007 | US7184264 Connectable memory devices to provide expandable memory |
| 02/27/2007 | US7183790 System and method for testing devices utilizing capacitively coupled signaling |
| 02/27/2007 | US7183788 Wireless radio frequency technique design and method for testing of integrated circuits and wafers |
| 02/27/2007 | US7183786 Modifying a semiconductor device to provide electrical parameter monitoring |
| 02/27/2007 | US7183780 Electrical open/short contact alignment structure for active region vs. gate region |
| 02/27/2007 | US7183775 Systems and methods for determining whether a heat sink is installed |
| 02/27/2007 | US7183671 Semiconductor device and method for producing the same |
| 02/27/2007 | US7183661 Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof |
| 02/27/2007 | US7183660 Tape circuit substrate and semicondutor chip package using the same |
| 02/27/2007 | US7183659 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 02/27/2007 | US7183658 Low cost microelectronic circuit package |
| 02/27/2007 | US7183657 Semiconductor device having resin anti-bleed feature |
| 02/27/2007 | US7183656 Bilayer aluminum last metal for interconnects and wirebond pads |
| 02/27/2007 | US7183655 Packaged semiconductor device |
| 02/27/2007 | US7183654 Providing a via with an increased via contact area |
| 02/27/2007 | US7183653 Via including multiple electrical paths |
| 02/27/2007 | US7183652 Electronic component and electronic configuration |
| 02/27/2007 | US7183651 Power plane decoupling |
| 02/27/2007 | US7183650 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| 02/27/2007 | US7183649 Methods and procedures for engineering of composite conductive films by atomic layer deposition |
| 02/27/2007 | US7183648 Method and apparatus for low temperature copper to copper bonding |
| 02/27/2007 | US7183647 Wiring substrate and electronic parts packaging structure |
| 02/27/2007 | US7183646 Semiconductor chip carrier affording a high-density external interface |
| 02/27/2007 | US7183645 Semiconductor device with external terminal joined to concave portion of wiring layer |
| 02/27/2007 | US7183644 Integrated circuit package with improved power signal connection |
| 02/27/2007 | US7183643 Stacked packages and systems incorporating the same |
| 02/27/2007 | US7183642 Electronic package with thermally-enhanced lid |
| 02/27/2007 | US7183641 Integrated heat spreader with intermetallic layer and method for making |
| 02/27/2007 | US7183640 Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
| 02/27/2007 | US7183639 Semiconductor device and method of manufacturing the same |