| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/01/2007 | US20070045819 Thermal paste containment for semiconductor modules |
| 03/01/2007 | US20070045818 Land grid array semiconductor device packages, assemblies including same, and methods of fabrication |
| 03/01/2007 | US20070045817 High permeability layered films to reduce noise in high speed interconnects |
| 03/01/2007 | US20070045816 Electronic package with improved current carrying capability and method of forming the same |
| 03/01/2007 | US20070045815 Wiring board construction including embedded ceramic capacitors(s) |
| 03/01/2007 | US20070045814 Wiring board and ceramic chip to be embedded |
| 03/01/2007 | US20070045813 Printed circuit board assembly with strain-alleviating structures |
| 03/01/2007 | US20070045812 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures |
| 03/01/2007 | US20070045811 Laminated product in structure including glass-cloth contained resin layer and method for manufacturing the same |
| 03/01/2007 | US20070045810 Multichip sensor |
| 03/01/2007 | US20070045809 Quad flat pack (QFP) package and flexible power distribution method therefor |
| 03/01/2007 | US20070045808 Test carrier for semiconductor components having conductors defined by grooves |
| 03/01/2007 | US20070045807 Microelectronic devices and methods for manufacturing microelectronic devices |
| 03/01/2007 | US20070045806 Structure of an ultra-thin wafer level stack package |
| 03/01/2007 | US20070045805 Method for manufacturing semiconductor device |
| 03/01/2007 | US20070045804 Printed circuit board for thermal dissipation and electronic device using the same |
| 03/01/2007 | US20070045803 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices |
| 03/01/2007 | US20070045802 Semiconductor chip package and application device thereof |
| 03/01/2007 | US20070045801 Circuit board |
| 03/01/2007 | US20070045800 Opto-coupler with high reverse breakdown voltage and high isolation potential |
| 03/01/2007 | US20070045798 Semiconductor package featuring metal lid member |
| 03/01/2007 | US20070045797 Microelectronic devices and microelectronic support devices, and associated assemblies and methods |
| 03/01/2007 | US20070045796 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
| 03/01/2007 | US20070045795 MEMS package and method of forming the same |
| 03/01/2007 | US20070045794 Buried photodiode for image sensor with shallow trench isolation technology |
| 03/01/2007 | US20070045793 Semiconductor device and method for fabricating the same |
| 03/01/2007 | US20070045792 Semiconductor device and semiconductor package |
| 03/01/2007 | US20070045791 Semiconductor device and manufacturing method thereof |
| 03/01/2007 | US20070045790 Tape Carrier For TAB And Method Of Manufacturing The Same |
| 03/01/2007 | US20070045789 Latency Adjustment Between Integrated Circuit Chips |
| 03/01/2007 | US20070045788 Stacking semiconductor device and production method thereof |
| 03/01/2007 | US20070045787 Semiconductor device |
| 03/01/2007 | US20070045786 Continuous plating system and method with mask registration |
| 03/01/2007 | US20070045785 Reversible-multiple footprint package and method of manufacturing |
| 03/01/2007 | US20070045784 Lead frame-based semiconductor device packages incorporating at least one land grid array package and methods of fabrication |
| 03/01/2007 | US20070045783 Semiconductor device and method of manufacturing the same |
| 03/01/2007 | US20070045782 Heat resistant ohmic electrode and method of manufacturing the same |
| 03/01/2007 | US20070045781 Hermetic interconnect structure and method of manufacture |
| 03/01/2007 | US20070045773 Integrated electronic device and method of making the same |
| 03/01/2007 | US20070045766 Conductive element and an electric connector using the same |
| 03/01/2007 | US20070045746 Semiconductor device and method of manufacturing the same |
| 03/01/2007 | US20070045745 Power semiconductor device having lines within a housing |
| 03/01/2007 | US20070045744 Semiconductor integrated circuit apparatus |
| 03/01/2007 | US20070045743 Device for electrostatic discharge protection |
| 03/01/2007 | US20070045624 Method for manufacturing a thin-film transistor |
| 03/01/2007 | US20070045003 Cable seal assembly and method |
| 03/01/2007 | US20070044952 Cooling apparatus of electric device |
| 03/01/2007 | US20070044945 Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same |
| 03/01/2007 | US20070044451 Cooling systems |
| 03/01/2007 | DE202006018254U1 Träger und Packungsaufbau einer Leuchtdiode Carrier and package structure of a light-emitting diode |
| 03/01/2007 | DE19924651B4 Verfahren zur Herstellung eines Kontakts eines Halbleiterspeicherbauelements A method for producing a contact of a semiconductor memory device |
| 03/01/2007 | DE19728183B4 Herstellungsverfahren für leitende Drähte eines Halbleitergehäuses in Chipgrösse Manufacturing method for conductive wires of a semiconductor package in chip size |
| 03/01/2007 | DE19537358B4 IC-Träger IC carrier |
| 03/01/2007 | DE10335182B4 Anordnung zur Verbesserung der Modulzuverlässigkeit Arrangement for improving the reliability module |
| 03/01/2007 | DE102006036541A1 Unterschiedliche Chipleistungsfähigkeit innerhalb eines Mehrchipgehäuses Different chip performance within a multi-chip package |
| 03/01/2007 | DE102006032490A1 Halbleitervorrichtung Semiconductor device |
| 03/01/2007 | DE102006021758A1 Thin film transistor array and electrostatic discharge (ESD) protection unit and production method has substrate with display and peripheral regions with image points and top gate thin film transistors |
| 03/01/2007 | DE102006010284A1 Semiconductor device has internal circuit that can operate in many modes with a mode adjusting circuit that responds to detection of current through an external resistance |
| 03/01/2007 | DE102005058121A1 Producing a ceramic component forms suspension of ceramic powder in hardenable organic binder that is irradiated to harden and heated to destroy organics |
| 03/01/2007 | DE102005053974B3 Electrical circuit arrangement has heat sink thermally coupled to a circuit carrier for electronic components and a second carrier within the first having an electronic component between it and the heat sink |
| 03/01/2007 | DE102005043557B4 Verfahren zur Herstellung eines Halbleiterbauteils mit Durchkontakten zwischen Oberseite und Rückseite A process for producing a semiconductor device with vias between the upper side and back |
| 03/01/2007 | DE102005041451A1 USB interface plug in electronic unit has moulded housing with electronic components including multiple layer connections through lead frame integrated in connector |
| 03/01/2007 | DE102005041283A1 Monitoring method for production of linkage structures and contacts in a semiconductor component forms contact lead-throughs in a dielectric layer to link to a test surface |
| 03/01/2007 | DE102005039947A1 Leistungshalbleitermodul mit Befestigungseinrichtung Power semiconductor module with mounting means |
| 03/01/2007 | DE102005039946A1 Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder Arrangement with power semiconductor module and terminal connector |
| 03/01/2007 | DE102005039165A1 Halbleiterleistungsbauteil mit vertikalem Strompfad durch einen Halbleiterleistungschip und Verfahren zu dessen Herstellung The semiconductor power component with vertical current path through a semiconductor power chip, and process for its preparation |
| 03/01/2007 | DE102005038895A1 Schaltung mit einem kapazitiven Element und Verfahren zum Prüfen derselben Circuit with a capacitive element and method for testing the same |
| 03/01/2007 | DE102005038409A1 Tubular capacitor casing for an electrical component has a profiled form shaped by a remodeling process, fastening devices and cooling channels |
| 03/01/2007 | DE10152202B4 Optimierte Dünnfilmdiffusionssperre aus TaCN für Kupfermetallisierung Optimized thin film diffusion barrier for copper metallization of TaCN |
| 03/01/2007 | DE10113192B4 Halbleiterbauelement Semiconductor device |
| 03/01/2007 | DE10110566B4 Bondinsel mit Stützstruktur in Halbleiterchip Bond island with support structure in semiconductor chip |
| 03/01/2007 | DE10106346B4 Elektronisches Bauteil Electronic component |
| 03/01/2007 | CA2620851A1 Thermally conductive thermoplastics for die-level packaging of microelectronics |
| 02/28/2007 | EP1758166A2 Interposer and method for producing the same and electronic device |
| 02/28/2007 | EP1758165A2 Power semiconductor module with mounting device |
| 02/28/2007 | EP1758164A1 Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives |
| 02/28/2007 | EP1758163A1 Quinolinols as fluxing and accelerating agents for underfill compositions |
| 02/28/2007 | EP1758151A2 Capacitor and manufacturing method thereof |
| 02/28/2007 | EP1758150A2 Capacitor, method of manufacturing the same and its use |
| 02/28/2007 | EP1758128A1 Reprogrammable switch using phase change material |
| 02/28/2007 | EP1758127A1 Reprogrammable switch using phase change material |
| 02/28/2007 | EP1758126A2 Nanoscale selection circuit |
| 02/28/2007 | EP1757659A2 Thermally conductive phase change materials |
| 02/28/2007 | EP1756949A2 Semiconductor device and method of forming the same |
| 02/28/2007 | EP1756866A1 Improved etch method |
| 02/28/2007 | EP1756865A2 Preparation of front contact for surface mounting |
| 02/28/2007 | EP1756862A1 Method for forming suspended transmission line structures in back end of line processing |
| 02/28/2007 | EP1756861A2 Microfabricated miniature grids |
| 02/28/2007 | EP1756859A2 Metallic air-bridges |
| 02/28/2007 | EP1756856A2 PE-ALD OF TaN DIFFUSION BARRIER REGION ON LOW-K MATERIALS |
| 02/28/2007 | EP1425765B1 Magnetic component |
| 02/28/2007 | EP1378002B1 Metal-insulator-metal capacitor in copper |
| 02/28/2007 | EP1316112B1 Improved chip crack stop design for semiconductor chips |
| 02/28/2007 | EP1226604B1 Fabrication process of a semiconductor device |
| 02/28/2007 | EP1048680B1 Modified polyimide resin and thermosetting resin composition containing the same |
| 02/28/2007 | CN2875007Y Power tube heat radiator |
| 02/28/2007 | CN2875006Y Improved heat radiator structure |
| 02/28/2007 | CN2875005Y Heat radiator base and heat radiator using said base |
| 02/28/2007 | CN2875003Y Heat radiator for electronic element |
| 02/28/2007 | CN2875002Y Assembling type heat radiator structure |