| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/07/2007 | CN1925146A Driving chip packaging structure engaged by multilayer lug and driving chip |
| 03/07/2007 | CN1925145A Circuit functional switch on packaging base board and its method |
| 03/07/2007 | CN1925144A Heat dispersing module and its manufacturing method |
| 03/07/2007 | CN1925143A Heat pipe radiator |
| 03/07/2007 | CN1925142A Method and structure for improving hot vortex of integrated circuit |
| 03/07/2007 | CN1925141A Chip package structure |
| 03/07/2007 | CN1925122A Structure and method for packaging image sensor |
| 03/07/2007 | CN1925120A Method for manufacturing downward bug hole type chip encapsulation structure and structure therefor |
| 03/07/2007 | CN1924691A Capsulation structure for optical sensitive module |
| 03/07/2007 | CN1923939A Semiconductor device, adhesive, and adhesive film |
| 03/07/2007 | CN1303693C Semiconductor memory device |
| 03/07/2007 | CN1303690C 半导体器件 Semiconductor devices |
| 03/07/2007 | CN1303689C 半导体器件 Semiconductor devices |
| 03/07/2007 | CN1303688C Electronic installation, manufacturing method thereof and electronic equipment |
| 03/07/2007 | CN1303687C Equipment for protecting high-frequency radio-frequency integrated circuit against electrostatic discharge injury |
| 03/07/2007 | CN1303686C High-current triggered electrostatic discharge protector |
| 03/07/2007 | CN1303685C Ball grid array (BGA) semiconductor package |
| 03/07/2007 | CN1303684C Semiconductor device, manufacturing method thereof and electronic equipment |
| 03/07/2007 | CN1303683C 半导体装置 Semiconductor device |
| 03/07/2007 | CN1303682C Radiation fin array cooler |
| 03/07/2007 | CN1303681C High-performance cooler |
| 03/07/2007 | CN1303680C Electron device heat radiator and circuit board and plasma display unit surface plate installed with said device |
| 03/07/2007 | CN1303679C Connector and method of manufacturing the same |
| 03/07/2007 | CN1303678C Chip carrier holed semiconductor package element and mfg. method thereof |
| 03/07/2007 | CN1303677C Circuit substrate, mounting structure of semiconductor element with lug and electrio-optical device |
| 03/07/2007 | CN1303676C Semiconductor device for shortening length of wire bonding |
| 03/07/2007 | CN1303675C Sequare shape pin-free planar semiconductor package structure and mfg. method |
| 03/07/2007 | CN1303674C Method for preparing gas-tight terminal |
| 03/07/2007 | CN1303669C Power supply path structure for integrated circuit design |
| 03/07/2007 | CN1303665C Dual-trench isolated crosspoint memory array and method for fabricating same |
| 03/07/2007 | CN1303660C Semiconductor packaging method for attaching semiconductor duct core to substrate by using adhesive wafers |
| 03/07/2007 | CN1303659C Semiconductor device and stacked semiconductor device and its manufacturing method |
| 03/07/2007 | CN1303653C Polished semiconductor chip and its manufacturing method |
| 03/07/2007 | CN1303494C Hot shift out device and its manufacturing method |
| 03/07/2007 | CN1303393C Core of heat exchanger in shaped plate pterate type |
| 03/07/2007 | CN1302938C Method of manufacturing an electronic component and electronic component obtained by means of said method |
| 03/07/2007 | CN1302925C Distinguished parts for calibration, and method for making other devices therewith |
| 03/06/2007 | US7188321 Generation of metal holes by via mutation |
| 03/06/2007 | US7187961 Semiconductor device for sensor system |
| 03/06/2007 | US7187559 Circuit board device and its manufacturing method |
| 03/06/2007 | US7187558 Leadframe-based module DC bus design to reduce module inductance |
| 03/06/2007 | US7187553 Apparatus for cooling semiconductor devices attached to a printed circuit board |
| 03/06/2007 | US7187551 Module for solid state relay for engine cooling fan control |
| 03/06/2007 | US7187545 Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support |
| 03/06/2007 | US7187536 Structure and method of making a capacitor having low equivalent series resistance |
| 03/06/2007 | US7187429 Alignment method, exposure apparatus and device fabrication method |
| 03/06/2007 | US7187249 Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package |
| 03/06/2007 | US7187122 Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same |
| 03/06/2007 | US7187086 Integrated circuit arrangement |
| 03/06/2007 | US7187085 Accurately producing line contacts for copper filling; forming narrow first and wider second structure in dielectric then lining and metallizing |
| 03/06/2007 | US7187084 Damascene method employing composite etch stop layer |
| 03/06/2007 | US7187083 Alloy mixture for bonding components of electronic devices, comprising an intrinsic oxygen getter, additive component for enhancing thermoconductivity, low coefficient of thermal expansion; improve wettability; wets metallic or non-metallic surfaces without extrinsic fluxing; multilayer |
| 03/06/2007 | US7187082 Semiconductor devices having a pocket line and methods of fabricating the same |
| 03/06/2007 | US7187080 Semiconductor device with a conductive layer including a copper layer with a dopant |
| 03/06/2007 | US7187079 Stacked memory cell having diffusion barriers |
| 03/06/2007 | US7187077 Integrated circuit having a lid and method of employing a lid on an integrated circuit |
| 03/06/2007 | US7187076 Interposer with integral heat sink |
| 03/06/2007 | US7187074 Semiconductor and electronic device with spring terminal |
| 03/06/2007 | US7187073 Resin-molded package with cavity structure |
| 03/06/2007 | US7187072 Fabrication process of semiconductor package and semiconductor package |
| 03/06/2007 | US7187071 Composite electronic component |
| 03/06/2007 | US7187070 Stacked package module |
| 03/06/2007 | US7187069 Semiconductor device |
| 03/06/2007 | US7187068 Methods and apparatuses for providing stacked-die devices |
| 03/06/2007 | US7187067 Sensor chip packaging structure |
| 03/06/2007 | US7187066 Radiant energy heating for die attach |
| 03/06/2007 | US7187065 Semiconductor device and semiconductor device unit |
| 03/06/2007 | US7187064 Electrical-interference-isolated transistor structure |
| 03/06/2007 | US7187063 Manufacturing method for magnetic sensor and lead frame therefor |
| 03/06/2007 | US7187061 Use of a down-bond as a controlled inductor in integrated circuit applications |
| 03/06/2007 | US7187060 Semiconductor device with shield |
| 03/06/2007 | US7187058 Semiconductor component having a pn junction and a passivation layer applied on a surface |
| 03/06/2007 | US7187056 Radiation hardened bipolar junction transistor |
| 03/06/2007 | US7187051 Solid image-pickup device and method for manufacturing the solid image pickup device |
| 03/06/2007 | US7187047 Method and structure for reducing resistance of a semiconductor device feature |
| 03/06/2007 | US7187039 Semiconductor integrated circuit device |
| 03/06/2007 | US7187038 Semiconductor device with MOS transistors with an etch-stop layer having an improved residual stress level and method for fabricating such a semiconductor device |
| 03/06/2007 | US7187037 ESD protection devices with SCR structures for semiconductor integrated circuits |
| 03/06/2007 | US7187034 Distributed power MOSFET |
| 03/06/2007 | US7187027 Stacked capacitor-type semiconductor storage device and manufacturing method thereof |
| 03/06/2007 | US7187026 Semiconductor device and method of manufacturing the same |
| 03/06/2007 | US7187015 High-density metal capacitor using dual-damascene copper interconnect |
| 03/06/2007 | US7187002 Wafer collective reliability evaluation device and wafer collective reliability evaluation method |
| 03/06/2007 | US7187000 High performance tunneling-biased MOSFET and a process for its manufacture |
| 03/06/2007 | US7186945 Sprayable adhesive material for laser marking semiconductor wafers and dies |
| 03/06/2007 | US7186928 Electronic device including chip parts and a method for manufacturing the same |
| 03/06/2007 | US7186921 Circuit device and manufacturing method thereof |
| 03/06/2007 | US7186669 For use in chemical sensor for detecting gases |
| 03/06/2007 | US7186664 Methods and structures for metal interconnections in integrated circuits |
| 03/06/2007 | US7186646 Semiconductor devices and methods of forming a barrier metal in semiconductor devices |
| 03/06/2007 | US7186645 Selective plating of package terminals |
| 03/06/2007 | US7186644 Methods for preventing copper oxidation in a dual damascene process |
| 03/06/2007 | US7186640 Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics |
| 03/06/2007 | US7186639 Metal interconnection lines of semiconductor devices and methods of forming the same |
| 03/06/2007 | US7186636 Nickel bonding cap over copper metalized bondpads |
| 03/06/2007 | US7186625 High density MIMCAP with a unit repeatable structure |
| 03/06/2007 | US7186613 Low dielectric materials and methods for making same |
| 03/06/2007 | US7186594 High voltage ESD-protection structure |
| 03/06/2007 | US7186593 Methods of fabricating integrated circuit devices having fuse structures including buffer layers |
| 03/06/2007 | US7186590 Thermally enhanced lid for multichip modules |