Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/08/2007US20070052087 Method and apparatus for decoupling conductive portions of a microelectronic device package
03/08/2007US20070052086 Electronic parts and method of manufacturing electronic parts packaging structure
03/08/2007US20070052085 Semiconductor device
03/08/2007US20070052084 High density interconnect assembly comprising stacked electronic module
03/08/2007US20070052083 Semiconductor package and manufacturing method thereof
03/08/2007US20070052082 Multi-chip package structure
03/08/2007US20070052081 Package-on-package semiconductor assembly
03/08/2007US20070052079 Multi-chip stacking package structure
03/08/2007US20070052078 Matrix package substrate structure, chip package structure and molding process thereof
03/08/2007US20070052077 Low height vertical sensor packaging
03/08/2007US20070052076 Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
03/08/2007US20070052075 Semiconductor device and method of manufacturing the same
03/08/2007US20070052074 Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
03/08/2007US20070052073 Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device
03/08/2007US20070052072 Resin mold type semiconductor device
03/08/2007US20070052071 Semiconductor package and manufacturing method thereof
03/08/2007US20070052070 Die pad for semiconductor packages and methods of making and using same
03/08/2007US20070052068 Semiconductor device
03/08/2007US20070052058 High blocking semiconductor component comprising a drift section
03/08/2007US20070052052 Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
03/08/2007US20070052039 Semiconductor device and method for manufacturing the same
03/08/2007US20070052033 Load driving device
03/08/2007US20070052032 Electrostatic discharge device with latch-up immunity
03/08/2007US20070052031 Semiconductor device and method for manufacturing the same
03/08/2007US20070052030 Electrostatic discharge device with controllable holding current
03/08/2007US20070052029 Electrostatic discharge protection structure
03/08/2007US20070051951 Method for testing metal-insulator-metal capacitor structures under high temperature at wafer level
03/08/2007US20070051950 Method for generating test patterns utilized in manufacturing semiconductor device
03/08/2007US20070051949 Method and arrangment for testing a stacked die semiconductor device
03/08/2007US20070051948 Test structure and method for detecting and studying crystal lattice dislocation defects in integrated circuit devices
03/08/2007US20070051490 Cooling device for electrical power units of electrically operated vehicles
03/08/2007DE202006019685U1 Platine mit einem perforierten Träger zum Anordnen eines Wärmerohrs Board with a perforated support for placing a heat pipe
03/08/2007DE19823069B4 Halbleiterbauelement Semiconductor device
03/08/2007DE112005000232T5 Verfahren zur Verbindung von Keramik mit Kupfer, ohne dabei eine Wölbung im Kupfer zu erzeugen Method of joining ceramics with copper without thereby produce a curvature in the copper
03/08/2007DE112004000727T9 Bandverbindung Band connection
03/08/2007DE10318078B4 Verfahren zum Schutz einer Umverdrahtung auf Wafern/Chips A method of protecting a rewiring on wafers / chips
03/08/2007DE10248205B4 Ohmsche Kontaktanordnung und Herstellverfahren Ohmic contact assembly and manufacturing
03/08/2007DE10238024B4 Verfahren zur Integration von Luft als Dielektrikum in Halbleitervorrichtungen A process for integration of air as a dielectric in semiconductor devices
03/08/2007DE102006004031B3 Power semiconductor module for inverter etc., has connection points for low and high potentials in sequence that corresponds to that of external connection terminals on two bus rails
03/08/2007DE102005059189B3 Arrangement of semiconductor memory devices for module, has conductive tracks connecting contacts of flexible substrate and stacked semiconductor devices
03/08/2007DE102005042035A1 Kunststoffgehäusemasse zum Einbetten von Halbleiterbauelementen in einem Kunststoffgehäuse und Verwendung der Kunststoffgehäusemasse Plastic housing compound for embedding semiconductor devices in a plastic housing and use the plastic housing composition
03/08/2007DE102005041100A1 Halbleiterstruktur mit einem lateral funktionalen Aufbau Semiconductor structure having a laterally functional structure
03/08/2007DE102004041888B4 Herstellungsverfahren für eine Halbleitervorrichtung mit gestapelten Halbleiterbauelementen Manufacturing method of a semiconductor device with stacked semiconductor devices
03/08/2007DE10111634B4 Elektrische Kompensationsschaltung zur Signallaufzeitbeeinflussung von integrierten elektronischen Bausteinen Electrical compensation circuit for signal propagation time influence of integrated electronic modules
03/08/2007DE10027914B4 Bauelement mit einem Transistor Component having a transistor
03/08/2007CA2614471A1 Heat pipe and method for manufacturing same
03/07/2007EP1761118A1 Wiring board and capacitor
03/07/2007EP1761117A1 Wiring board with embedded ceramic capacitors
03/07/2007EP1761116A2 Circuit board having electronic parts mounted thereon by using under-fill material and method for producing the same
03/07/2007EP1760783A2 Semiconductor device and automotive ac generator
03/07/2007EP1760782A2 Semiconductor device and method of manufacturing the same
03/07/2007EP1760781A1 Semiconductor chip generating a controllable frequency
03/07/2007EP1760780A2 Integrated circuit including silicon wafer with annealed glass paste
03/07/2007EP1760779A1 Electronic part and method of manufacturing the same
03/07/2007EP1760778A2 Multilayer circuit board
03/07/2007EP1760775A1 Semiconductor device with through electrode and method of manufacturing the same
03/07/2007EP1760746A2 MEMS device having standoff bumps and folded component
03/07/2007EP1760731A2 Integrated electronic device and method of making the same
03/07/2007EP1760478A1 Low height vertical sensor pckaging
03/07/2007EP1760036A1 MEMS device having contact and standoff bumps and related methods
03/07/2007EP1759422A2 Methods and devices for fabricating and assembling printable semiconductor elements
03/07/2007EP1759412A1 Electrical subassembly comprising a protective sheathing
03/07/2007EP1759165A1 Calibrating device on a silicon substrate
03/07/2007EP1759160A1 Heat exchange device and method
03/07/2007EP1697990B1 Assembly of a component mounted on a transfer surface
03/07/2007EP1665371B1 Method for producing a multifunctional dielectric layer on a substrate
03/07/2007EP1642337B1 Offset dependent resistor for measuring misalignment of stitched masks
03/07/2007EP1068642B1 An inductance device
03/07/2007CN2877208Y Radiator
03/07/2007CN2877206Y Chimney structure for radiating fin
03/07/2007CN2877035Y Overhead suspension type heat radiation member
03/07/2007CN1926932A Module heat dissipating structure and control device using the same
03/07/2007CN1926928A Circuit device and method for manufacturing same
03/07/2007CN1926690A Isolated high-voltage LDMOS transistor having a split well structure
03/07/2007CN1926685A Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
03/07/2007CN1926684A Capacitor built-in semiconductor device and method for manufacturing same
03/07/2007CN1926683A Semiconductor package with crossing conductor assembly and method of manufacture
03/07/2007CN1926682A Overmolded semiconductor package with an integrated EMI and RFI shield
03/07/2007CN1926681A Compliant passivated edge seal for low-K interconnect structures
03/07/2007CN1926680A Integrated circuit chip utilizing carbon nanotube composite interconnection vias
03/07/2007CN1926677A Multi-layer overlay measurement and correction technique for ic manufacturing
03/07/2007CN1926674A Semiconductor device with strain relieving bump design
03/07/2007CN1926667A Semiconductor base plate and its manufacturing method
03/07/2007CN1926434A Vibration piezoelectric acceleration sensor
03/07/2007CN1925735A Heat pipe radiator
03/07/2007CN1925734A Heat pipe radiator
03/07/2007CN1925733A Heat pipe radiator
03/07/2007CN1925722A Wiring board construction including embedded ceramic capacitors(s)
03/07/2007CN1925721A Wiring board and ceramic capacitor
03/07/2007CN1925718A Radiator fixing device
03/07/2007CN1925179A Semiconductor light-emitting device
03/07/2007CN1925167A Semiconductor component and method for forming the same
03/07/2007CN1925161A Semiconductor product and method for making a semiconductor product
03/07/2007CN1925155A 集成电路装置 The integrated circuit device
03/07/2007CN1925152A Carrying structure for electron element
03/07/2007CN1925151A Semiconductor structure and its manufacturing method
03/07/2007CN1925150A Metal line for a semiconductor device and fabrication method thereof
03/07/2007CN1925149A Tape carrier for TAB and method of manufacturing the same
03/07/2007CN1925148A Multilayer wiring substrate and method for manufacturing same
03/07/2007CN1925147A Semiconductor device, method of manufacturing the same, circuit board, and method of manufacturing the same
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