Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/14/2007CN1930683A Conductive material compositions, apparatus, systems, and methods
03/14/2007CN1930682A Various structure/height bumps for wafer level-chip scale package
03/14/2007CN1930681A Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
03/14/2007CN1930680A Collective substrate, semiconductor element mounting member, semiconductor device, imaging device, light emitting diode constituting member, and light emitting diode
03/14/2007CN1930679A Electronic device with stress relief element
03/14/2007CN1930672A Under bump metallization layer to enable use of high tin content solder bumps
03/14/2007CN1930646A Housing for high performance components
03/14/2007CN1930263A Resin composition and semiconductor devices made by using the same
03/14/2007CN1930226A Modifier for resin and resin composition using the same and formed article
03/14/2007CN1930084A Phosphorus-containing coated magnesium oxide powder, method for producing same and resin composition containing such powder
03/14/2007CN1929950A Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
03/14/2007CN1929729A Metal foam radiator for electronic heater members
03/14/2007CN1929727A Remote passive circulating phase-change heat-diffusing method and system
03/14/2007CN1929159A Semiconductor illumination device
03/14/2007CN1929138A MOS transistor cell and semiconductor device
03/14/2007CN1929137A High density hybrid MOSFET device
03/14/2007CN1929135A Semiconductor device
03/14/2007CN1929133A Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
03/14/2007CN1929132A Electronic apparatus
03/14/2007CN1929131A Electronic apparatus
03/14/2007CN1929130A Multi-chip stacking package structure
03/14/2007CN1929129A Stack type chip packaging structure, chip packaging body and manufacturing method
03/14/2007CN1929127A 静电放电保护电路 Electrostatic discharge protection circuit
03/14/2007CN1929126A Depletion type terminal protection structure
03/14/2007CN1929125A Fuse and method for disconnecting the fuse
03/14/2007CN1929124A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/14/2007CN1929123A Multilayered wiring substrate and method of manufacturing the same
03/14/2007CN1929122A 半导体封装及其制造方法 Semiconductor package and its manufacturing method
03/14/2007CN1929121A Mounting arrangement for semiconductor parts and method for manufacturing mounting substrate
03/14/2007CN1929120A Stack type chip packaging structure, chip packaging body and manufacturing method
03/14/2007CN1929119A Heat spreader module and method of manufacturing same
03/14/2007CN1929118A Heat dispersing device and its manufacturing method
03/14/2007CN1929117A Integrated circuit package with glass layer and oscillator
03/14/2007CN1929116A Integrated circuit including silicon wafer with annealed glass paste
03/14/2007CN1929111A Method and associated equipment of forming a wire using the carbon nano-tube
03/14/2007CN1929105A Three-dimensional interconnection interpolator applied in system packaging and its producing method
03/14/2007CN1929097A Anisotropic conductive flame and flat panel display using the same, and method for manufacturing the same
03/14/2007CN1929093A Projection producing process and its structure
03/14/2007CN1929092A Projection producing process and its structure
03/14/2007CN1929090A Method of producing a nitride semiconductor device and nitride semiconductor device
03/14/2007CN1927989A Compliant and crosslinkable thermal interface materials
03/14/2007CN1305181C Connecting component
03/14/2007CN1305174C Connector for integrated circuit and assembly used in IC
03/14/2007CN1305134C Semiconductor device with fuse and making method thereof
03/14/2007CN1305133C Semiconductor device and method of manufacturing the same
03/14/2007CN1305132C Lead frame and its electroplating method
03/14/2007CN1305131C High performance heat sink configurations for use in high density packaging applications
03/14/2007CN1305118C Structural reinforcement porous and low k dielectric films by ILD posts
03/14/2007CN1305109C Metal element, semiconductor device, electronic device and electronic equipment and its manufacturing method
03/14/2007CN1304807C Cooling device, electronic device and method of manufacturing cooling device
03/14/2007CN1304480C Polyphenylene sulfide electronic packaging material and its preparing method
03/14/2007CN1304196C Laminar composition and method for preparing the same
03/14/2007CN1304127C Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods
03/13/2007US7191415 Clearance inspection apparatus and clearance inspection method
03/13/2007US7190988 Analyte monitoring device and methods of use
03/13/2007US7190982 Radio frequency device
03/13/2007US7190824 Overlay vernier pattern for measuring multi-layer overlay alignment accuracy and method for measuring the same
03/13/2007US7190823 Overlay vernier pattern for measuring multi-layer overlay alignment accuracy and method for measuring the same
03/13/2007US7190593 Semiconductor integrated circuit device
03/13/2007US7190592 Integrated library core for embedded passive components and method for forming electronic device thereon
03/13/2007US7190591 Heat sink assembly
03/13/2007US7190588 Heat-dissipating fin assembly for heat sink
03/13/2007US7190586 Heat sink retention assembly and related methods
03/13/2007US7190585 Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance
03/13/2007US7190584 Retaining device for heat sink
03/13/2007US7190582 Cooling device, electronic equipment device, and method of manufacturing cooling device
03/13/2007US7190576 Internally disposed cooling device for electronic apparatus
03/13/2007US7190563 Electrostatic discharge protection in a semiconductor device
03/13/2007US7190250 Encapsulation with oxide bond to borosilicate mixture
03/13/2007US7190243 Waveguide coupler
03/13/2007US7190083 High frequency integrated circuit using capacitive bonding
03/13/2007US7190082 Low stress flip-chip package for low-K silicon technology
03/13/2007US7190081 Mold gates and tape substrates including the mold gates
03/13/2007US7190080 Semiconductor chip assembly with embedded metal pillar
03/13/2007US7190079 Selective capping of copper wiring
03/13/2007US7190078 Interlocking via for package via integrity
03/13/2007US7190077 Semiconductor structure integrated under a pad
03/13/2007US7190076 Electrode for p-type Group III nitride compound semiconductor layer and method for producing the same
03/13/2007US7190075 Method of forming smooth polycrystalline silicon electrodes for molecular electronic devices
03/13/2007US7190074 Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
03/13/2007US7190073 Circuit film with bump, film package using the same, and related fabrication methods
03/13/2007US7190072 RFID-chip having RFID-tag or magnifying electrode
03/13/2007US7190071 Semiconductor package and method for fabricating the same
03/13/2007US7190070 Modular power semiconductor module
03/13/2007US7190069 Method and system of tape automated bonding
03/13/2007US7190068 Bottom heat spreader
03/13/2007US7190067 Semiconductor package with exposed heat sink and the heat sink thereof
03/13/2007US7190066 Heat spreader and package structure utilizing the same
03/13/2007US7190065 Circuit substrate, semiconductor module and method of manufacturing circuit substrate
03/13/2007US7190064 Semiconductor device and method of manufacturing the same
03/13/2007US7190063 Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus
03/13/2007US7190062 Embedded leadframe semiconductor package
03/13/2007US7190061 stack package made of chip scale packages
03/13/2007US7190060 Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same
03/13/2007US7190058 Spacer die structure and method for attaching
03/13/2007US7190057 Packaging component and semiconductor package
03/13/2007US7190056 Thermally enhanced component interposer: finger and net structures
03/13/2007US7190055 Lead frame and semiconductor device
03/13/2007US7190054 Semiconductor module having inner pressure release portion
03/13/2007US7190053 Field device incorporating circuit card assembly as environmental and EMI/RFI shield
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