Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/15/2007US20070060223 Manufacturing method for a wireless communication device and manufacturing apparatus
03/15/2007US20070059885 Semiconductor device and method of manufacturing same
03/15/2007US20070059866 Fan out type wafer level package structure and method of the same
03/15/2007US20070059864 Method for manufacturing thermal interface material with carbon nanotubes
03/15/2007US20070059862 Multiple chip semiconductor package
03/15/2007US20070059853 Method for Manufacturing Semiconductor Device
03/15/2007US20070059648 Method for forming a capacitor
03/15/2007US20070059647 Capacitor for a semiconductor device
03/15/2007US20070057624 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
03/15/2007US20070057415 Method for producing carbon nanotube-dispersed composite material
03/15/2007US20070057385 Apparatus and method for applying conductive paste onto electronic component
03/15/2007US20070057384 Semiconductor stacked die/wafer configuration and packaging and method thereof
03/15/2007US20070057383 Semiconductor chip having bond pads and multi-chip package
03/15/2007US20070057382 Electronic package with compliant electrically-conductive ball interconnect
03/15/2007US20070057381 Integrated circuit die configuration for packaging
03/15/2007US20070057380 Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package
03/15/2007US20070057379 Method of manufacturing a semiconductor device
03/15/2007US20070057378 Electronic device and manufacturing method therefor
03/15/2007US20070057377 Semiconductor memory device comprising pseudo ground pad and related method
03/15/2007US20070057376 Semiconductor device and method for fabricating the same
03/15/2007US20070057375 Multilayered wiring substrate and manufacturing method thereof
03/15/2007US20070057374 Embedded barrier for dielectric encapsulation
03/15/2007US20070057373 Semiconductor device having metallic plate with groove
03/15/2007US20070057372 External contact material for external contacts of a semiconductor device and method of making the same
03/15/2007US20070057371 Semiconductor device
03/15/2007US20070057370 Semiconductor device
03/15/2007US20070057369 Wiring board and method for manufacturing the same, and semiconductor device
03/15/2007US20070057368 Semiconductor package having plate interconnections
03/15/2007US20070057367 Semiconductor chip having bond pads and multi-chip package
03/15/2007US20070057366 Semiconductor IC-embedded module
03/15/2007US20070057365 Device for preventing low-melting-point heat-transfer medium from oxidization
03/15/2007US20070057364 Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
03/15/2007US20070057363 Multilayered wiring substrate and method of manufacturing the same
03/15/2007US20070057362 Area array routing masks for improved escape of devices on PCB
03/15/2007US20070057361 integrated circuit package and method of manufacture thereof
03/15/2007US20070057360 Semiconductor package film having reinforcing member and related display module
03/15/2007US20070057359 Energy conditioning circuit assembly and component carrier
03/15/2007US20070057358 Multi-level semiconductor module
03/15/2007US20070057357 System in package (SIP) structure
03/15/2007US20070057356 Image sensing chip package structure
03/15/2007US20070057355 Method for forming buried cavities within a semiconductor body, and semiconductor body thus made
03/15/2007US20070057354 Multi-part lead frame with dissimilar materials
03/15/2007US20070057353 Multi-part lead frame with dissimilar materials
03/15/2007US20070057352 Method and apparatus for thermally processing microelectronic workpieces
03/15/2007US20070057351 Structure of IC packaging and method forming the same
03/15/2007US20070057350 Semiconductor component and method of assembling the same
03/15/2007US20070057349 Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same
03/15/2007US20070057344 Embedded capacitor with interdigitated structure
03/15/2007US20070057342 Semiconductor fuse box and method for fabricating the same
03/15/2007US20070057327 LCD source driver for improving electrostatic discharge
03/15/2007US20070057289 Power semiconductor device and method therefor
03/15/2007US20070056716 Centrifugal condenser
03/15/2007US20070056710 Apparatus for cooling communication equipment using heat pipe
03/15/2007US20070056623 Thermionic vacuum diode device with adjustable electrodes
03/15/2007US20070056397 Base design for self-centering
03/15/2007DE202006017181U1 Fluid-Wärmetauscher für Peltier-Module Fluid heat exchanger for Peltier modules
03/15/2007DE10244077B4 Verfahren zur Herstellung von Halbleiterbauteilen mit Durchkontaktierung A process for the production of semiconductor components with through-hole plating
03/15/2007DE102006040623A1 Wafer-Level-Chip-Size-Package für ein CMOS-Bildsensor-Modul und dazugehöriges Herstellungsverfahren Wafer-level chip-size package for a CMOS image sensor module and associated manufacturing processes
03/15/2007DE102006038463A1 Wärmetauschereinheit und Verfahren zu ihrer Herstellung Heat exchanger unit and methods for their preparation
03/15/2007DE102006002451A1 Kühlvorrichtung Cooler
03/15/2007DE102005063094A1 Metallleitung für eine Halbleiter-Vorrichtung und Herstellung derselben Metal line for a semiconductor device and manufacturing the same
03/15/2007DE102005046063B3 Semiconductor power module with excess current protection unit has fuse unit surrounded by explosion protection material connected across conductive tracks by narrower leads than power semiconductor
03/15/2007DE102005043914A1 Halbleiterbauelement für Bondverbindung Semiconductor device for bonding
03/15/2007DE102005043910A1 Flip-chip module comprises a semiconductor chip having contact columns on a surface, a substrate with contact sites joined to the free ends of the contact columns and a rigid spacer arranged between the substrate and chip
03/15/2007DE102005043657A1 Chip module with encapsulated chip such as for chip cards encapsulated with a material having two polymer components resistant to different chemical bonds
03/15/2007DE102005043271A1 Resistance sensor measuring temperature in e.g. vertical power field effect transistor, is integrated with heater into substrate accommodating transistor, to test operational reliability
03/15/2007DE102005043270A1 Device and production method for temperature monitoring of planar FET has ohmic measuring resistance and temperature sensor separated from substrate surface by an isolation layer
03/15/2007DE102005042083A1 Substrate arrangement and production process has thickness of passive components on a substrate surface greater that that of the conductive traces
03/15/2007DE102005041174A1 Leistungshalbleiterbauteil mit Leitungen innerhalb eines Gehäuses Power semiconductor component with leads within a housing
03/15/2007DE102005040494A1 Determining the damage to a component in a production step and integrated circuit arrangement has connected unit to assess the characteristics of integrated circuit after production stages
03/15/2007DE102005039786A1 Dual-die ball grid array (DDBGA) has length equalization of wiring between upper and lower dies
03/15/2007DE102005037573A1 Thyristor mit Freiwerdeschutz in Form eines Thyristorsystems und Verfahren zur Herstellung des Thyristorsystems Thyristor with free Become protection in the form of a Thyristorsystems and method for producing the Thyristorsystems
03/15/2007CA2621505A1 3-dimensional multi-layered modular computer architecture
03/15/2007CA2621131A1 Resin composition and hybrid integrated circuit board making use of the same
03/14/2007EP1763294A1 Area array routing masks for improved escape of devices on PCB
03/14/2007EP1763079A1 Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
03/14/2007EP1763077A2 Semiconductor device
03/14/2007EP1763076A2 Semiconductor device
03/14/2007EP1763043A1 Inductive structure
03/14/2007EP1763040A1 Interface materials and methods of production and use thereof
03/14/2007EP1762725A1 Gas jetting device, electronic device and gas jetting method
03/14/2007EP1762582A1 Epoxy resin composition
03/14/2007EP1761956A2 High frequency transistor layout for low source drain capacitance
03/14/2007EP1761951A2 Lead solder indicator and method
03/14/2007EP1761946A2 Fabrication of interconnect structures
03/14/2007EP1761936A2 Electrical multi-layered component having a reliable soldering contact
03/14/2007EP1761749A1 Temperature control mechanism on a memory device
03/14/2007EP1461831B1 Device and method for package warp compensation in an integrated heat spreader
03/14/2007EP1307916B1 A method of forming a backside contact for integrated circuits
03/14/2007EP1181720B1 Methods and apparatus for fabricating a multiple modular assembly
03/14/2007EP1069608B1 Wire bonding method, semiconductor device and wire bonding device
03/14/2007EP0959648B1 Printed wiring board and manufacturing method therefor
03/14/2007CN2879607Y Conduit tightening radiator assembly
03/14/2007CN2879426Y Modular LED and packaging structure thereof
03/14/2007CN2879422Y Conducting cushion configuration of grid array package
03/14/2007CN2878750Y Wide-blade eccentric fan, radiation device and big power/pressure adjustor
03/14/2007CN1930928A Partially etched dielectric film with conductive features
03/14/2007CN1930927A A method of creating solder bar connections on electronic packages
03/14/2007CN1930892A Video processor alignment clamping spring
03/14/2007CN1930684A Component with encapsulation suitable for WLP and production method
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