Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/21/2007CN1306230C Electroosmotic microchannel cooling system
03/21/2007CN1305985C Slurry for CMP, and method of manufacturing semiconductor device
03/21/2007CN1305807C Aluminum nitride sintered body and method of preparing the same
03/21/2007CN1305752C Micro mechanical structure device of case packing and its mfg method
03/21/2007CN1305751C Micromachine and method of fabricating the same
03/21/2007CN1305611C Method for mfg. heat sink
03/20/2007US7194719 Basic cell, edge cell, wiring shape, wiring method, and shield wiring structure
03/20/2007US7193860 Leadframe-based module DC bus design to reduce module inductance
03/20/2007US7193852 Control unit and method for producing the same
03/20/2007US7193849 Heat dissipating device
03/20/2007US7193832 Magnetically coupled device and electronic equipment employing same
03/20/2007US7193727 Apparatus and method for mounting or wiring semiconductor chips
03/20/2007US7193715 Measurement of overlay using diffraction gratings when overlay exceeds the grating period
03/20/2007US7193331 Semiconductor device and manufacturing process thereof
03/20/2007US7193330 Semiconductor device with improved design freedom of external terminal
03/20/2007US7193329 Semiconductor device
03/20/2007US7193328 Semiconductor device
03/20/2007US7193327 Barrier structure for semiconductor devices
03/20/2007US7193326 Mold type semiconductor device
03/20/2007US7193325 Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects
03/20/2007US7193324 Circuit structure of package substrate
03/20/2007US7193323 Copper tungsten phosphide formed by electrodeposition of layers
03/20/2007US7193322 Sacrificial shallow trench isolation oxide liner for strained-silicon channel CMOS devices
03/20/2007US7193321 IC package, inspection method of IC package mounting body, repairing method of IC package mounting body, and inspection pin for IC package mounting body
03/20/2007US7193320 Semiconductor device having a heat spreader exposed from a seal resin
03/20/2007US7193319 Semiconductor device
03/20/2007US7193318 Multiple power density chip structure
03/20/2007US7193317 Semiconductor module and power conversion device
03/20/2007US7193316 Integrated circuit coolant microchannel with movable portion
03/20/2007US7193315 Test vehicle grid array package
03/20/2007US7193314 Semiconductor devices and substrates used in thereof
03/20/2007US7193312 Castellation wafer level packaging of integrated circuit chips
03/20/2007US7193311 Multi-chip circuit module and method for producing the same
03/20/2007US7193310 Stacking system and method
03/20/2007US7193309 Semiconductor package with stacked chips and method for fabricating the same
03/20/2007US7193308 Intermediate chip module, semiconductor device, circuit board, and electronic device
03/20/2007US7193307 Multi-layer FET array and method of fabricating
03/20/2007US7193306 Semiconductor structure having stacked semiconductor devices
03/20/2007US7193305 Memory card ESC substrate insert
03/20/2007US7193303 Supporting frame for surface-mount diode package
03/20/2007US7193302 Leadless semiconductor package
03/20/2007US7193301 Semiconductor device and manufacturing method thereof
03/20/2007US7193300 Plastic leadframe and compliant fastener
03/20/2007US7193299 Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components
03/20/2007US7193298 Lead frame
03/20/2007US7193297 Semiconductor device, method for manufacturing the same, circuit substrate and electronic device
03/20/2007US7193296 Semiconductor substrate
03/20/2007US7193282 Contact sensor package
03/20/2007US7193274 ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad
03/20/2007US7193272 Semiconductor device and method of manufacturing the same
03/20/2007US7193263 Electronic component having an integrated passive electronic component and associated production method
03/20/2007US7193255 Semiconductor device with floating conducting region placed between device elements
03/20/2007US7193239 Three dimensional structure integrated circuit
03/20/2007US7193161 SiP module with a single sided lid
03/20/2007US7193157 Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip
03/20/2007US7193009 Electronic device using low dielectric loss tangent insulators for high frequency signals
03/20/2007US7192997 Encapsulant composition and electronic package utilizing same
03/20/2007US7192894 High performance CMOS transistors using PMD liner stress
03/20/2007US7192871 Semiconductor device with a line and method of fabrication thereof
03/20/2007US7192870 Semiconductor device and fabrication process therefor
03/20/2007US7192861 Wire bonding for thin semiconductor package
03/20/2007US7192858 Method of forming plug
03/20/2007US7192857 Method of forming a semiconductor structure with non-uniform metal widths
03/20/2007US7192847 Ultra-thin wafer level stack packaging method
03/20/2007US7192846 Methods and systems for processing a device, methods and systems for modeling same and the device
03/20/2007US7192845 Method of reducing alignment measurement errors between device layers
03/20/2007US7192839 Semiconductor structure having alignment marks with shallow trench isolation
03/20/2007US7192831 Nonvolatile semiconductor memory and manufacturing method thereof
03/20/2007US7192823 Manufacturing method for transistor of electrostatic discharge protection device
03/20/2007US7192810 Semiconductor packaging
03/20/2007US7192809 Low cost method to produce high volume lead frames
03/20/2007US7192808 Semiconductor device having a lead frame smaller than a semiconductor chip and manufacturing method therefor
03/20/2007US7192807 Wafer level package and fabrication method
03/20/2007US7192806 Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
03/20/2007US7192805 Semiconductor device and method of manufacturing the same
03/20/2007US7192804 Semiconductor device and method for fabricating the same
03/20/2007US7192801 Printed circuit board and fabrication method thereof
03/20/2007US7192796 Methods and apparatus for packaging integrated circuit devices
03/20/2007US7192791 Semiconductor wafer having an edge based identification feature
03/20/2007US7192789 Method for monitoring an ion implanter
03/20/2007US7192645 Uniform pore distribution thus retain high rigidity thus are suitable for manufacturing of integrated circuits
03/20/2007US7192210 Deck stain applicator
03/20/2007US7191516 Method for shielding integrated circuit devices
03/20/2007US7191507 Method of producing a wireless communication device
03/15/2007WO2007030694A2 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers
03/15/2007WO2007030458A2 Enhancement of light emission efficiency by tunable surface plasmons
03/15/2007WO2007030345A2 Die pad for semiconductor packages
03/15/2007WO2007029657A1 Resin composition and hybrid integrated circuit board making use of the same
03/15/2007WO2007029598A1 Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them
03/15/2007WO2007029452A1 Method of forming conductive pattern and wiring board
03/15/2007WO2007029445A1 Capacitor-equipped semiconductor device
03/15/2007WO2007028672A1 Cooling body for an electronic housing
03/15/2007WO2007028277A1 A heat sinking module construction for heating component
03/15/2007WO2007011511A3 Die package with asymmetric leadframe connection
03/15/2007WO2007011377A3 Combined rf tag and saw sensor
03/15/2007WO2007001803A3 Cure catalyst, composition, electronic device and associated method
03/15/2007WO2007001598A3 Lead-free semiconductor package
03/15/2007WO2006097094A3 Energy accumulator for supporting the supply voltage of an integrated circuit
03/15/2007WO2006089296A3 Low cost, high volume lead frame production
03/15/2007WO2006025852A3 Cooling of high power density devices using electrically conducting fluids
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