Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/21/2007EP1763895A1 Electronic component with encapsulation
03/21/2007EP1763894A2 Stacked die bga or lga component assembly
03/21/2007EP1683196A4 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
03/21/2007EP1673800B1 Production method and device for improving the bonding between plastic and metal
03/21/2007EP1129485B1 Electronic component and use of a protective structure contained therein
03/21/2007EP1042534B1 Metal surface coating, especially for micro electronics
03/21/2007CN2882208Y Radiation device
03/21/2007CN2882206Y Radiation device
03/21/2007CN2882205Y Adhesive sheet contact thermal conduction type heat pipe radiator
03/21/2007CN2882204Y 直立式风扇散热器结构 Upright fan heatsink structure
03/21/2007CN2882201Y Radiation fan device
03/21/2007CN2881963Y LED support and device
03/21/2007CN2881960Y I/O circuit floating resistor on integrated circuit chip
03/21/2007CN2881957Y Semiconductor device, magnetic sensor and magnetic sensor unit
03/21/2007CN2881956Y Chip package
03/21/2007CN2881955Y Chip package
03/21/2007CN2881954Y Fixing fastener capable of regulating stretch
03/21/2007CN2881953Y Fixing structure and radiator using the fixing structure
03/21/2007CN2881952Y 散热片 Fins
03/21/2007CN2881951Y Radiator with radiation fin
03/21/2007CN2881950Y Ventilation heat-conducting media protection cover
03/21/2007CN2881758Y Protection structure for credible platform module chip get distructive attack
03/21/2007CN2881660Y High voltage large current energy-feeding type crystal brake tube valve used by combined test device
03/21/2007CN2881340Y LED lamp and its radiating structure
03/21/2007CN1934918A Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
03/21/2007CN1934704A Chip stacking semiconductor device
03/21/2007CN1934703A Monolithically integrated circuit for radio frequency applications
03/21/2007CN1934702A Integrated electronic module structure for vehicles
03/21/2007CN1934701A Method for controlling heat of circuit, apparatus, and system
03/21/2007CN1934700A Semiconductor device and method for manufacturing same
03/21/2007CN1934699A Semiconductor device and method of manufacturing thereof
03/21/2007CN1934698A 半导体器件 Semiconductor devices
03/21/2007CN1934690A Solder composition and method of bump formation therewith
03/21/2007CN1934689A Plasma processing method and method for fabricating electronic component module using the same
03/21/2007CN1934688A Substrate for bonding element and method of manufacturing the same
03/21/2007CN1934605A Electroluminescent display devices
03/21/2007CN1934454A Dual feedback control system for maintaining the temperature of an IC-chip near a set-point
03/21/2007CN1934190A Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices
03/21/2007CN1934157A 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device
03/21/2007CN1934156A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device
03/21/2007CN1933948A Process for producing ceramic sheet, ceramic substrate utilizing the same and use thereof
03/21/2007CN1933714A Passive radiating fan system and electronic system including the same system
03/21/2007CN1933713A Radiating module and heat tube thereof
03/21/2007CN1933712A Complex radiating device
03/21/2007CN1933711A Electronic device with radiating opening
03/21/2007CN1933710A Heat tube radiating device
03/21/2007CN1933709A Radiating device
03/21/2007CN1933695A Flexible radiating circuit substrate
03/21/2007CN1933171A Image sensor with decreased optical interference between adjacent pixels
03/21/2007CN1933166A Electro-optical device and manufacturing method thereof, electronic apparatus, and capacitor
03/21/2007CN1933164A Semiconductor device and a manufacturing method for the same
03/21/2007CN1933163A Nonvolatile semiconductor memory devices and methods of forming the same
03/21/2007CN1933153A Mim capacitor integrated into the damascene structure and method of making thereof
03/21/2007CN1933150A Semiconductor IC-embedded module
03/21/2007CN1933148A Electron package structure
03/21/2007CN1933147A Chip packaging body and stack chip packaging structure
03/21/2007CN1933146A Package for high frequency waves containing high frequency electronic circuit
03/21/2007CN1933145A Fuse of semiconductor element
03/21/2007CN1933144A Test key for checking up intraconnection and method for checking intraconnection
03/21/2007CN1933143A Electroless plating liquid and semiconductor device
03/21/2007CN1933142A Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
03/21/2007CN1933141A Contact structure having silicide layers, semiconductor device employing the same, and methods of fabricating the contact structure and semiconductor device
03/21/2007CN1933140A Internal connection line structure
03/21/2007CN1933139A Wiring board and method for manufacturing the same, and semiconductor device
03/21/2007CN1933138A Packaging for high speed integrated circuits
03/21/2007CN1933137A 半导体装置 Semiconductor device
03/21/2007CN1933136A 半导体装置 Semiconductor device
03/21/2007CN1933135A Packaging for high speed integrated circuits
03/21/2007CN1933134A Packaging for high speed integrated circuits
03/21/2007CN1933133A Electronic structural component with electric-conduction connecting structure
03/21/2007CN1933132A Chip packaging body without kernel dielectric layer and stack chip packaging structure
03/21/2007CN1933131A Radiating device
03/21/2007CN1933130A Radiating device
03/21/2007CN1933129A Complex layer structure and producing method and double-mosaic and interconnector structure and capacitor
03/21/2007CN1933128A Thin film transistor structure and substrate producing method for liquid crystal display device
03/21/2007CN1933123A Dual-metal inserting structure and producing method thereof
03/21/2007CN1933117A Producing process for chip packaging body without kernel dielectric layer
03/21/2007CN1933013A Electrostatic protecting device adapted to programmable elements
03/21/2007CN1932591A Liquid crystal display device and thin film transistor base plate thereof
03/21/2007CN1932494A Measuring system and screening method for thermal conductivity assembly heat conductivity
03/21/2007CN1932056A High temperature copper alloy for lead frame and its making process
03/21/2007CN1306855C Flexible wiring board and electronic device using said board
03/21/2007CN1306853C Power unit for driving magnetron
03/21/2007CN1306619C Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
03/21/2007CN1306618C Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic instrument
03/21/2007CN1306616C Semiconductor memory containing MOS transistor therewith floating grid and controlling grid
03/21/2007CN1306610C Wire layout structure of chip
03/21/2007CN1306609C Semiconductor power converting device
03/21/2007CN1306608C Radiating module mechanism
03/21/2007CN1306607C Semiconductor package part with radiation fin
03/21/2007CN1306606C Manufacturing method of heat radiation fin
03/21/2007CN1306605C Film carried belt for mounting electronic components thereon
03/21/2007CN1306604C Semiconductor device, its mfg. method and thin sheet interconnecting line parts
03/21/2007CN1306603C Laminated electronic component
03/21/2007CN1306602C Circuit board capable of preventing heat deformation and mfg method thereof
03/21/2007CN1306601C Semiconductor package and its manufacture
03/21/2007CN1306600C Press pack power semiconductor module
03/21/2007CN1306591C Semiconductor device
03/21/2007CN1306589C Fuse structure forming method
03/21/2007CN1306576C Semiconductor chip mounting substrate and two-dimensional display
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