Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/22/2007WO2007032406A1 Resin composition for sealing filler, flip chip mounting method using same, and flip chip mounted article
03/22/2007WO2007032261A1 Method for forming porous insulating film and semiconductor device
03/22/2007WO2007032221A1 Process for producing epoxy resin molding material for encapsulation, epoxy resin molding material for encapsulation, and electronic part or device
03/22/2007WO2007032213A1 Printed circuit board, and semiconductor package
03/22/2007WO2007032056A1 Heat sink
03/22/2007WO2007031750A2 A heat dissipation device
03/22/2007WO2007031299A1 Protection against manipulation and through-drilling for an apparatus to be connected to an electrical circuit
03/22/2007WO2007031241A1 Laminated substrate for mounting electronic parts
03/22/2007WO2007031050A1 Chip module and method for producing a chip module
03/22/2007WO2006112949A3 Structure for stacking an integrated circuit on another integrated circuit
03/22/2007WO2005013331A3 Supercritical fluid-assisted deposition of materials on semiconductor substrates
03/22/2007US20070067135 Configurable voltage regulator
03/22/2007US20070067064 Surface level control systems and material recycling systems for use with programmable material consolidation apparatus
03/22/2007US20070066367 Method and arrangement for repairing memory chips using microlithography methods
03/22/2007US20070066058 Defectivity and process control of electroless deposition in microelectronics applications
03/22/2007US20070066050 Semiconductor device and a method of manufacturing the same
03/22/2007US20070066046 Method of electrically connecting a microelectronic component
03/22/2007US20070066043 Semiconductor device and fabrication process thereof
03/22/2007US20070066040 Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
03/22/2007US20070066006 Method and Structure for Electrostatic Discharge Protection of Photomasks
03/22/2007US20070065995 Semiconductor device and method of manufacturing the same
03/22/2007US20070065989 Method for manufacturing an adhesive substrate with a die-cavity sidewall
03/22/2007US20070065987 Stacked mass storage flash memory package
03/22/2007US20070065983 Decoupling capacitor closely coupled with integrated circuit
03/22/2007US20070065981 Semiconductor system-in-package
03/22/2007US20070065653 Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
03/22/2007US20070065635 Object with a stratified composite material
03/22/2007US20070065079 Optical module with can package
03/22/2007US20070064399 Flip chip heat sink package and method
03/22/2007US20070064397 Peripheral device and electronic device
03/22/2007US20070064395 Cooling system for a semiconductor device and method of fabricating same
03/22/2007US20070063355 Multilayer circuit board and production method for same
03/22/2007US20070063354 Wire sweep resistant semiconductor package and manufacturing method thereof
03/22/2007US20070063353 Partially bonding structure for a polymer and a chip
03/22/2007US20070063352 Routing under bond pad for the replacement of an interconnect layer
03/22/2007US20070063351 Method for the Application of a Protective Coating to a Thermally Stressed Component
03/22/2007US20070063350 Semiconductor device and method for designing same
03/22/2007US20070063349 Interconnect structure and method of manufacturing the same
03/22/2007US20070063348 Method and structure of forming an interconnect including a dielectric cap having a tensile stress
03/22/2007US20070063347 Packages, anisotropic conductive films, and conductive particles utilized therein
03/22/2007US20070063346 Display device and manufacturing method of the same
03/22/2007US20070063345 Semiconductor device
03/22/2007US20070063344 Chip package structure and bumping process
03/22/2007US20070063343 Substrate for semiconductor device and semiconductor device
03/22/2007US20070063342 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
03/22/2007US20070063341 Complete power management system implemented in a single surface mount package
03/22/2007US20070063340 Complete power management system implemented in a single surface mount package
03/22/2007US20070063339 Heat dissipating assembly for heat dissipating substrate and application
03/22/2007US20070063338 Bottom lighting type backlight module
03/22/2007US20070063337 Chip cooling system
03/22/2007US20070063336 QFN/SON-compatible package
03/22/2007US20070063335 Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units
03/22/2007US20070063334 Semiconductor device
03/22/2007US20070063333 Semiconductor package with internal shunt resistor
03/22/2007US20070063332 BGA package with stacked semiconductor chips and method of manufacturing the same
03/22/2007US20070063331 Integrated circuit package system with planar interconnects
03/22/2007US20070063330 Complex laminated chip element
03/22/2007US20070063329 Structure Of Memory Card Packaging And Method Of Forming The Same
03/22/2007US20070063328 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063327 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063326 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063324 Structure and method for reducing warp of substrate
03/22/2007US20070063323 LED positioning structure
03/22/2007US20070063322 Integrated circuit protruding pad package system
03/22/2007US20070063321 Light emitting diode package and light emitting diode system having at least two heat sinks
03/22/2007US20070063320 Integrated circuit package system with adhesive restraint
03/22/2007US20070063317 Overlay key, method of forming the overlay key, semiconductor device including the overlay key and method of manufacturing the semiconductor device
03/22/2007US20070063315 Semiconductor integrated circuit device and process for manufacturing the same
03/22/2007US20070063313 Electronic circuit arrangement
03/22/2007US20070063311 Rewiring Substrate Strip Having a Plurality of Semiconductor Component Positions
03/22/2007US20070063309 Integrated circuitry and method for manufacturing the same
03/22/2007US20070063307 Semiconductor device including power MOS field-effect transistor and driver circuit driving thereof
03/22/2007US20070063291 Semiconductor device with dummy electrode
03/22/2007US20070063285 Power supply apparatus
03/22/2007US20070063245 Metal plating using seed film
03/22/2007US20070063229 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063225 Semiconductor device, and method for manufacturing semiconductor device
03/22/2007US20070063223 Semiconductor device having pattern-dummy and method for manufacturing the same using pattern-dummy
03/22/2007US20070063056 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
03/22/2007US20070062673 Flow distributing unit and cooling unit
03/22/2007US20070062453 Substrate processing method, computer readable recording medium and substrate processing apparatus
03/22/2007US20070062033 Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
03/22/2007DE10315303B4 Halbleiter-Bauelement-Spannungsversorgung für System mit mindestens zwei, insbesondere gestapelten, Halbleiter-Bauelementen The semiconductor device for power supply system having at least two, in particular stacked, semiconductor devices
03/22/2007DE10255130B4 Schaltungsanordnung zum Schutz integrierter Schaltungen vor elektrostatischen Entladungen mit parallelem Strompfad Circuitry to protect integrated circuits against static discharge with parallel current path
03/22/2007DE102006037738A1 Elektro-statische Entladungsschutzeinrichtung und Verfahren zu deren Herstellung Electro-static discharge protection device, and methods for their preparation
03/22/2007DE102006035031A1 Verfahren zum Bearbeiten eines Halbleiterwafers A method of processing a semiconductor wafer
03/22/2007DE102006003304A1 Power semiconductor component and production process has metal leads and contacts on active layer on a chip with contact layer of chromium an or titanium and main layer of copper and or nickel
03/22/2007DE102006001429A1 Semiconductor component functional unit and production process has rows and columns of chips on a connection plate and a multi-layer wiring structure insulated by a hybrid organic-inorganic polymer dielectric
03/22/2007DE102005045060A1 Multi-layer integrated circuit includes substrate with stacked circuit planes and integrates high quality passive components in its three-dimensional structure
03/22/2007DE102005045057A1 Integrated circuit especially for coaxial leads has three conductive traces spaced above substrate that are up to ten times longer than their width
03/22/2007DE102005042790A1 Integrated circuit and protection method as for chip cards has circuit section and test unit to test and evaluate the circuit function on receipt of a start signal or internally
03/22/2007DE102005041886B3 Production of semiconductor element, e.g. for use in mobile telephones, includes forming projections of differing elasticity modulus by selective illumination of photopolymerizable compositions
03/22/2007DE102005040781A1 Sensor and production process especially for pressure measurement as in a tire has housing with micro-mechanical sensor, evaluation element and a carrier in the housing
03/22/2007DE102005039940A1 Bondverbindung für Leistungshalbleiterbauelemente Bond for power semiconductor devices
03/22/2007DE102004031251B4 Vorrichtung zur Flüssigkeitskühlung von Mikroprozessoren in Computersystemen A liquid cooling microprocessors in computer systems
03/22/2007DE102004021261B4 Halbleiterbauelement mit einem Hybrid-Metallisierungsschichtstapel für eine verbesserte mechanische Festigkeit während und nach dem Einbringen in ein Gehäuse A semiconductor device with a hybrid metallization layer for improved mechanical strength during, and after insertion in a housing
03/22/2007CA2622771A1 Protection against manipulation and through-drilling for an apparatus to be connected to an electrical circuit
03/21/2007EP1764834A1 Electromagnetic shielding of packages with a laminate substrate
03/21/2007EP1764833A1 Lead pin for mounting semiconductor and printed wiring board
03/21/2007EP1764832A1 Bonding connection for semiconductor power devices
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