| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/28/2007 | CN1937188A Method for improving radiating performance of gallium nitride power transistor |
| 03/28/2007 | CN1937187A Upside-down mounted chip packaging method and packaging structure thereof |
| 03/28/2007 | CN1937186A Radiating fin and heat pipe jointing method and apparatus |
| 03/28/2007 | CN1937067A Reconfigurable input/output in hierarchical memory link |
| 03/28/2007 | CN1936681A 液晶显示器件 Liquid crystal display device |
| 03/28/2007 | CN1935926A High-heat-conductance electronic packaging material and its preparing method |
| 03/28/2007 | CN1307727C Semiconductor device with SOI region and bulk region and method of manufacture thereof |
| 03/28/2007 | CN1307718C Semiconductor device and mfg. method thereof |
| 03/28/2007 | CN1307717C 电子器件 Electronic devices |
| 03/28/2007 | CN1307716C Multidirectional liquid storage slot heat conducting apparatus and method |
| 03/28/2007 | CN1307715C Using the wave soldering process to attach motherboard chipset heat sinks |
| 03/28/2007 | CN1307714C Resin-sealed-type semiconductor device, and production process for producing such semiconductor device |
| 03/28/2007 | CN1307713C Electronic assembly with filled no-flow underfill and methods of manufacture |
| 03/28/2007 | CN1307712C 半导体器件 Semiconductor devices |
| 03/28/2007 | CN1307704C Method for producing electronic part, electronic part, mounting method for electronic part and electronic device |
| 03/28/2007 | CN1307703C Lead forming device of semiconductor element, lead forming system and method |
| 03/28/2007 | CN1307702C Manufacturing method of electron device |
| 03/28/2007 | CN1307701C Dual cured B-stageable underfill for wafer level |
| 03/28/2007 | CN1307700C Semiconductor device, its manufacturing method, and radio communication device |
| 03/28/2007 | CN1307698C Device having resin package and method of producing the same |
| 03/28/2007 | CN1307653C Current-carrying electronic component and method of manufacturing same |
| 03/28/2007 | CN1307327C Electroplating method |
| 03/28/2007 | CN1307258C Flame-retardant epoxy resin composition, semiconductor packaging material using said composition, and resin packaged semiconductor |
| 03/28/2007 | CN1307124C Thick film conductor compositions for use on aluminum nitride substrates |
| 03/28/2007 | CN1307048C Thermal interface materials |
| 03/28/2007 | CN1307047C High solid HBV slurry, paste, spherical powder, and method of making and using them |
| 03/27/2007 | US7197736 Adaptive power routing and shield sharing to reduce shield count |
| 03/27/2007 | US7197726 Test structures for estimating dishing and erosion effects in copper damascene technology |
| 03/27/2007 | US7196909 AC coupling circuit having a large capacitance and a good frequency response |
| 03/27/2007 | US7196908 Dual pitch contact pad footprint for flip-chip chips and modules |
| 03/27/2007 | US7196905 Heat radiating apparatus of electronic component |
| 03/27/2007 | US7196904 IC package with an implanted heat-dissipation fin |
| 03/27/2007 | US7196888 Method of fabricating semiconductor integrated circuit device having protection circuit |
| 03/27/2007 | US7196607 Embedded toroidal transformers in ceramic substrates |
| 03/27/2007 | US7196540 Impedance matching commonly and independently |
| 03/27/2007 | US7196441 AC generator for vehicles |
| 03/27/2007 | US7196429 Method of reducing film stress on overlay mark |
| 03/27/2007 | US7196428 Bond pad structure for integrated circuit chip |
| 03/27/2007 | US7196427 Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element |
| 03/27/2007 | US7196426 Multilayered substrate for semiconductor device |
| 03/27/2007 | US7196425 Copper interposer for reducing warping of integrated circuit packages and method of making IC packages |
| 03/27/2007 | US7196424 Semiconductor device |
| 03/27/2007 | US7196423 Interconnect structure with dielectric barrier and fabrication method thereof |
| 03/27/2007 | US7196422 Low-dielectric constant structure with a multilayer stack of thin films with pores |
| 03/27/2007 | US7196421 Integrated circuit having at least one metallization level |
| 03/27/2007 | US7196420 Method and structure for creating ultra low resistance damascene copper wiring |
| 03/27/2007 | US7196419 Transport speed monitoring apparatus and semiconductor processing system utilizing the same |
| 03/27/2007 | US7196418 Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device |
| 03/27/2007 | US7196417 Method of manufacturing a low expansion material and semiconductor device using the low expansion material |
| 03/27/2007 | US7196416 Electronic device and method of manufacturing same |
| 03/27/2007 | US7196415 Low voltage drop and high thermal performance ball grid array package |
| 03/27/2007 | US7196414 Semiconductor package with heat sink |
| 03/27/2007 | US7196413 Heat dissipation assembly and method for producing the same |
| 03/27/2007 | US7196412 Multi-chip press-connected type semiconductor device |
| 03/27/2007 | US7196411 Heat dissipation for chip-on-chip IC packages |
| 03/27/2007 | US7196410 Wafer packaging and singulation method |
| 03/27/2007 | US7196409 Semiconductor device, semiconductor body and method of manufacturing thereof |
| 03/27/2007 | US7196408 Fan out type wafer level package structure and method of the same |
| 03/27/2007 | US7196407 Semiconductor device having a multi-chip stacked structure and reduced thickness |
| 03/27/2007 | US7196406 ESD protection apparatus for an electrical device |
| 03/27/2007 | US7196405 Silicon package with integral heater |
| 03/27/2007 | US7196404 Motion detector and method of producing the same |
| 03/27/2007 | US7196403 Semiconductor package with heat spreader |
| 03/27/2007 | US7196402 Interconnections |
| 03/27/2007 | US7196401 Chip-packaging with bonding options having a plurality of package substrates |
| 03/27/2007 | US7196394 Method and apparatus for a deposited fill layer |
| 03/27/2007 | US7196387 Memory cell with an asymmetrical area |
| 03/27/2007 | US7196378 Electrostatic-protection dummy transistor structure |
| 03/27/2007 | US7196377 MOS type semiconductor device having electrostatic discharge protection arrangement |
| 03/27/2007 | US7196365 Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same |
| 03/27/2007 | US7196364 Molecular device, molecule array, rectifier device, rectifying method, sensor device, switching device, circuit device, logical circuit device, operational device and information processing device |
| 03/27/2007 | US7196363 Multilayer metal structure of supply rings with large parasitic capacitance |
| 03/27/2007 | US7196350 Method and apparatus for characterizing features formed on a substrate |
| 03/27/2007 | US7196346 Semiconductor memory device and method for fabricating the same |
| 03/27/2007 | US7196322 Image sensor package |
| 03/27/2007 | US7196275 EMI shield that adheres to and conforms with printed circuit board surfaces |
| 03/27/2007 | US7196001 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 03/27/2007 | US7196000 Method for manufacturing a wafer level chip scale package |
| 03/27/2007 | US7195988 Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor wafer |
| 03/27/2007 | US7195957 Packaged microelectronic components |
| 03/27/2007 | US7195956 Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units |
| 03/27/2007 | US7195954 Low capacitance coupling wire bonded semiconductor device |
| 03/27/2007 | US7195953 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein |
| 03/27/2007 | US7195951 Carbon-carbon and/or metal-carbon fiber composite heat spreaders |
| 03/27/2007 | US7195940 Methods for packaging image sensitive electronic devices |
| 03/27/2007 | US7195937 Method for measuring withstand voltage of semiconductor epitaxial wafer and semiconductor epitaxial wafer |
| 03/27/2007 | US7195935 Selective packaging of tested semiconductor devices |
| 03/27/2007 | US7195933 Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern |
| 03/27/2007 | US7195931 Split manufacturing method for advanced semiconductor circuits |
| 03/27/2007 | US7195145 Electrical circuit apparatus and method for assembling same |
| 03/27/2007 | US7194801 Thin-film battery having ultra-thin electrolyte and associated method |
| 03/27/2007 | US7194799 Process for fabricating a high density multi-layer microcoil |
| 03/27/2007 | CA2464082C A ferroelectric or electret memory circuit |
| 03/27/2007 | CA2464055C Interposer assembly for soldered electrical connections |
| 03/27/2007 | CA2381403C Method for manufacturing aluminum nitride sintered body in which via hole is made |
| 03/22/2007 | WO2007033243A2 Semiconductor package having plate interconnections |
| 03/22/2007 | WO2007032563A1 Wiring structure and semiconductor device and production methods thereof |
| 03/22/2007 | WO2007032489A1 Temperature protection circuit, power supply, and electronic device |
| 03/22/2007 | WO2007032486A1 Insulating circuit board and insulating circuit board provided with cooling sink section |
| 03/22/2007 | WO2007032456A1 Semiconductor devices and method of testing same |