Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/29/2007WO2007035295A1 Silicon mems based two-phase heat transfer device
03/29/2007WO2007035234A2 Semiconductor stacked die/wafer configuration and packaging and method thereof
03/29/2007WO2007034929A1 Method for cutting solid-state image pickup device
03/29/2007WO2007034919A1 Member for semiconductor light emitting device and method for manufacturing such member, and semiconductor light emitting device using such member
03/29/2007WO2007034902A1 Resin composition, varnish, resin film and semiconductor device
03/29/2007WO2007034791A1 Solder layer, heat sink using such solder layer and method for manufacturing such heat sink
03/29/2007WO2007034718A1 Semiconductor device
03/29/2007WO2007034713A1 Epoxy resin composition
03/29/2007WO2007034596A1 Active matrix substrate, display, television set, method for producing active matrix substrate, and method for manufacturing display
03/29/2007WO2007015938A3 Method for patterning an underbump metallizattion layer using a dry etc process
03/29/2007WO2007007239A3 Semiconductor device
03/29/2007WO2007006590A3 Micro-structured cooler and use thereof
03/29/2007WO2007002689A3 Semiconductor device having firmly secured heat spreader
03/29/2007WO2006116225A3 The use of solder paste for heat dissipation
03/29/2007WO2006104768A3 Anisotropic electrically conductive structure
03/29/2007WO2006097893A3 Method and system for output matching of rf transistors
03/29/2007WO2006026372A8 Package having integral lens and wafer-scale fabrication method therefor
03/29/2007WO2005074449A3 Structure comprising amorphous carbon film and method of forming thereof
03/29/2007WO2005067684A3 Insulating substrate for ic packages having integral esd protection
03/29/2007US20070074316 Nanowires-based transparent conductors
03/29/2007US20070072470 IC Socket
03/29/2007US20070072405 Semiconductor device and method for manufacturing the same
03/29/2007US20070072384 Plastically deformable irreversible storage medium and method of producing one such medium
03/29/2007US20070072383 Phosphorus Activated NMOS Using SiC Process
03/29/2007US20070072381 Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN, SiCN or SiOCN
03/29/2007US20070072347 Method of assembly for multi-flip chip on lead frame on overmolded ic package
03/29/2007US20070072342 Depopulation of a ball grid array to allow via placement
03/29/2007US20070072339 Process for fabricating chip package structure
03/29/2007US20070072338 Method for separating package of WLP
03/29/2007US20070072328 Method and system for hermetically sealing packages for optics
03/29/2007US20070072321 Device package and methods for the fabrication and testing thereof
03/29/2007US20070072319 Integrated circuit capacitor structure
03/29/2007US20070071994 Surface-treated a1 sheet having excellent solderability, heat sink using the sheet, and method for manufacturing the surface-treated a1 sheet having excellent solderability
03/29/2007US20070071886 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
03/29/2007US20070070229 Semiconductor device with improved design freedom of external terminal
03/29/2007US20070069400 Alignment mark, alignment apparatus and method, exposure apparatus, and device manufacturing method
03/29/2007US20070069399 Overlay mark
03/29/2007US20070069398 Overlay metrology mark
03/29/2007US20070069397 Coil construction
03/29/2007US20070069395 Image sensor module, camera module using the same, and method of manufacturing the camera module
03/29/2007US20070069394 Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
03/29/2007US20070069393 Wiring board embedded with spherical semiconductor element
03/29/2007US20070069392 Modular bonding pad structure and method
03/29/2007US20070069391 Stacked die semiconductor package
03/29/2007US20070069390 Flash memory card
03/29/2007US20070069389 Stackable device, device stack and method for fabricating the same
03/29/2007US20070069388 Semiconductor device featuring large reinforcing elements in pad area, and pattern design apparatus therefor
03/29/2007US20070069387 Semiconductor device and method of forming the same
03/29/2007US20070069386 Memory circuit
03/29/2007US20070069385 MIM capacitor integrated into the damascene structure and method of making thereof
03/29/2007US20070069384 Semiconductor device
03/29/2007US20070069383 Semiconductor device containing a ruthenium diffusion barrier and method of forming
03/29/2007US20070069382 Semiconductor device
03/29/2007US20070069381 Interconnect structure with polygon cell structures
03/29/2007US20070069380 Ohmic contact on p-type GaN
03/29/2007US20070069379 Lead-free solder ball
03/29/2007US20070069378 Semiconductor module and method of forming a semiconductor module
03/29/2007US20070069377 Clock distribution networks and conductive lines in semiconductor integrated circuits
03/29/2007US20070069376 Component with chip through-contacts
03/29/2007US20070069375 Semiconductor device having shield structure
03/29/2007US20070069374 Flash memory card
03/29/2007US20070069373 Device with surface cooling and method of making
03/29/2007US20070069372 Packaged die on PCB with heat sink encapsulant and methods
03/29/2007US20070069370 Semiconductor device
03/29/2007US20070069369 Heat dissipation device and method for making the same
03/29/2007US20070069368 Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink
03/29/2007US20070069367 Reduced stress on SAW die with surrounding support structures
03/29/2007US20070069366 Novel constraint stiffener design
03/29/2007US20070069365 Semiconductor with damage detection circuitry
03/29/2007US20070069363 Semiconductor IC-embedded substrate and method for manufacturing same
03/29/2007US20070069362 Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same
03/29/2007US20070069361 Chip package and substrate thereof
03/29/2007US20070069360 Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
03/29/2007US20070069359 Plasma display panel and the method of manufacturing the same
03/29/2007US20070069358 Gel package structural enhancement of compression system board connections
03/29/2007US20070069357 Device for thermal transfer and power generation
03/29/2007US20070069356 Optical parts cap and method of manufacturing the same
03/29/2007US20070069355 Package with barrier wall and method for manufacturing the same
03/29/2007US20070069354 Semiconductor sensor device with sensor chip and method for producing the same
03/29/2007US20070069353 Semiconductor device with plastic housing composition and method for producing the same
03/29/2007US20070069352 Bumpless chip package and fabricating process thereof
03/29/2007US20070069351 Substrate carrier
03/29/2007US20070069350 Method and apparatus for stacking electrical components using via to provide interconnection
03/29/2007US20070069349 Method for micro-electro mechanical system package
03/29/2007US20070069348 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
03/29/2007US20070069347 Semiconductor chip and process for forming the same
03/29/2007US20070069346 Integrated circuit solder bumping system
03/29/2007US20070069345 Package of leadframe with heatsinks
03/29/2007US20070069344 Semiconductor module
03/29/2007US20070069343 Molded semiconductor package
03/29/2007US20070069342 MEMS element and manufacturing method
03/29/2007US20070069341 Radio recognition semiconductor device and its manufacturing method
03/29/2007US20070069338 Metal oxide dispersion for dye-sensitized solar cells, photoactive electrode and dye-sensitized solar cell
03/29/2007US20070069337 Semiconductor structure and fabricating method thereof
03/29/2007US20070069324 Semiconductor device production method and semiconductor device
03/29/2007US20070069323 Semiconductor device
03/29/2007US20070069319 Solid-state imaging device and method for producing the same
03/29/2007US20070069314 Magnetoresistive Random Access Memory with Improved Layout Design and Process Thereof
03/29/2007US20070069299 Thin film resistors integrated at a single metal interconnect level of die
03/29/2007US20070069298 Mobility enhancement by strained channel CMOSFET with single workfunction metal-gate and fabrication method thereof
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