Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2007
03/29/2007US20070069297 Tri-states one-time programmable memory (OTP) cell
03/29/2007US20070069272 Semiconductor device comprising a Plurality of semiconductor constructs
03/29/2007US20070069270 Top electrode in a strongly oxidizing environment
03/29/2007US20070069242 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
03/29/2007US20070069232 Semiconductor device with a resin-sealed optical semiconductor element
03/29/2007US20070069217 P-i-n diode crystallized adjacent to a silicide in series with a dielectric anitfuse
03/29/2007US20070069208 LSI design support apparatus and LSI design support method
03/29/2007US20070069207 Method and system of trace pull test
03/29/2007US20070068658 Heat pipe type cooler
03/29/2007US20070068656 Flat plate heat transfer device
03/29/2007US20070068173 Application and removal of thermal interface material
03/29/2007US20070067987 Printed circuit board with improved cooling of electrical component
03/29/2007DE19860080B4 Mikroelektronische Struktur Microelectronic structure
03/29/2007DE112005000980T5 Einzelzeilen-Verbindungsfeld-Anordnung eines integrierten Schaltungs Chips Single-line connection field configuration of an integrated circuit chips
03/29/2007DE10229493B4 Integrierte Halbleiterstruktur Integrated semiconductor structure
03/29/2007DE102006037722A1 Verdrahtungsstruktur für einen integrierten Schaltkreis und Verfahren zur Herstellung derselben Wiring structure for an integrated circuit and method of manufacturing the same
03/29/2007DE102006012718A1 Passives wärmeabführendes Lüftersystem sowie damit ausgestattetes elektronisches System Passive heat dissipating fan system and thus equipped electronic system
03/29/2007DE102005047567B3 Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components with a connecting element and an insulating molded body
03/29/2007DE102005045100A1 Verfahren zum Herstellen eines Leistungshalbleitermoduls Method for producing a power semiconductor module
03/29/2007DE102005045059A1 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Spule sowie Verfahren An integrated circuit device having a plurality of conductive structure and coil and method
03/29/2007DE102005045056A1 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Kondensator An integrated circuit device having a plurality of conductive structure and capacitor
03/29/2007DE102005044523A1 Connecting elements using a glass solder used in the manufacture of electronic components comprises soldering the elements together by fusing a glass solder and releasing the oxidant locally during soldering
03/29/2007DE102005044510A1 Semiconductor component with front side metallization, includes thick intermediate layer comprising nickel and copper, which is free of noble metals
03/29/2007DE102005044216A1 Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
03/29/2007DE102005044124A1 Verfahren zur Herstellung einer integrierten Schaltung mit Gate-Selbstschutz, und integrierte Schaltung mit Gate-Selbstschutz A method of fabricating an integrated circuit with self-protection gate, and an integrated circuit with gate self-protection
03/29/2007DE102005043808A1 Außenkontaktmaterial für Außenkontakte eines Halbleiterbauteils und Verwendung des Außenkontaktmaterials External contact material for external contacts of a semiconductor device and use of outer contact material
03/29/2007DE102005039479B3 Halbleiterbauteil mit gedünntem Halbleiterchip und Verfahren zur Herstellung des gedünnten Halbleiterbauteils A semiconductor device comprising gedünntem semiconductor chip and method for producing the thinned semiconductor component
03/29/2007DE102004042784B4 Beschleunigungssensor und Verfahren zum Herstellen eines Beschleunigungssensors Acceleration sensor and method for producing an acceleration sensor
03/29/2007DE102004030813B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement
03/29/2007DE102004005697B4 Herstellungsverfahren für eine widerstandsfähige Via-Struktur und zugehörige Via-Struktur Production method for a durable via structure and associated via structure
03/28/2007EP1768474A1 Printed circuit board and manufacturing method thereof
03/28/2007EP1768183A2 Microdevices with bump contacts on two sides and manufacturing method thereof
03/28/2007EP1768182A2 Semiconductor power module with overcurrent protection means
03/28/2007EP1768181A1 Nitride semiconductor substrate, and method for working nitride semiconductor substrate
03/28/2007EP1768180A2 Integrated circuit with multiple conductor layer structures and method
03/28/2007EP1768179A2 Chip cooling system
03/28/2007EP1768178A2 Optimally shaped spreader plate for electronics cooling assembly
03/28/2007EP1766683A2 Universal interconnect die
03/28/2007EP1766682A2 Improved cooling devices for different applications
03/28/2007EP1766681A1 Memory metal springs for heatsink attachments
03/28/2007EP1766680A1 System and method for encapsulation and protection of components
03/28/2007EP1766679A2 Method for improving heat dissipation in encapsulated electronic components
03/28/2007EP1766675A1 Method of manufacture of electronic or functional devices
03/28/2007EP1766663A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
03/28/2007EP1706666A4 Lighting assembly, heat sink and heat recovery system therefor
03/28/2007EP1265946B1 Poly(phenylene ether) - polyvinyl thermosetting resin
03/28/2007CN2884808Y Airduct of power module
03/28/2007CN2884806Y Radiation module structure of circuit board
03/28/2007CN2884540Y Radiator of LED
03/28/2007CN2884535Y Chip structure with arrangement of side pads
03/28/2007CN2884534Y Improved LED
03/28/2007CN2884533Y Heat conductive medium protective cap with reinforced structure
03/28/2007CN2884532Y Radiating fins group
03/28/2007CN2884531Y Thermal tube radiator for reverse 3 inch-4 inch thyristor
03/28/2007CN2884530Y Chips encapulating structure
03/28/2007CN2884529Y Liquid cooling chips type radiator driven by external dynamic magnet
03/28/2007CN1939108A Mounting system for high-mass heatsinks
03/28/2007CN1938852A Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
03/28/2007CN1938851A Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement
03/28/2007CN1938850A Optimized power delivery to high speed, high pin-count devices
03/28/2007CN1938849A Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
03/28/2007CN1938848A Electronic package having a selaing structure on predetermined area, and the method thereof
03/28/2007CN1938847A Heat sink manufacturing method
03/28/2007CN1938846A Sensor device and sensor system, and manufacturing method therefor
03/28/2007CN1938845A Device and method for joining substrates
03/28/2007CN1938844A A semiconductor apparatus
03/28/2007CN1938838A Heater, reflow apparatus, and solder bump forming method and apparatus
03/28/2007CN1938799A Embedded capacitors using conductor filled vias
03/28/2007CN1938794A Embedded toroidal transformers in ceramic substrates
03/28/2007CN1937905A Peripheral device and electronic device
03/28/2007CN1937903A Radiator module
03/28/2007CN1937902A Cooling structure of heating element
03/28/2007CN1937892A Multi-layered wiring board, fabricating method, electronic device and electronic instrument
03/28/2007CN1937887A Structure and method for reducing warp of substrate
03/28/2007CN1937885A Radiating type printed circuit board and its manufacturing process
03/28/2007CN1937884A Embedded capacitor device having a common coupling area
03/28/2007CN1937306A Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
03/28/2007CN1937269A Surface mounting LED substrate
03/28/2007CN1937245A In-line inserted semiconductor device
03/28/2007CN1937244A Negative electrode branching semiconductor device
03/28/2007CN1937243A Power device explosion-proof method and device
03/28/2007CN1937230A Landscape insulation bar double-pole-type transistor
03/28/2007CN1937225A Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
03/28/2007CN1937224A 半导体装置 Semiconductor device
03/28/2007CN1937223A 半导体装置 Semiconductor device
03/28/2007CN1937221A Stacking structure for semiconductor packaging assembly
03/28/2007CN1937220A Semiconductor component fuse structure and its control method
03/28/2007CN1937219A Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same
03/28/2007CN1937218A Constant temperature electromigration test structure and its fillet optical adjacent correction method
03/28/2007CN1937217A Packaging structure and its packaging method
03/28/2007CN1937216A Packages, anisotropic conductive films, and conductive particles utilized therein
03/28/2007CN1937215A High power integrated ciruit chip cooling device
03/28/2007CN1937214A Liquid-cooled radiating system
03/28/2007CN1937213A Radiating module
03/28/2007CN1937212A GaN device packaging base structure and its manufacturing method
03/28/2007CN1937211A Radiating device
03/28/2007CN1937210A IC packaging structure
03/28/2007CN1937193A Semiconductor device and method of making the same, circuit board, and electronic instrument
03/28/2007CN1937192A Semiconductor device and method of making the same, circuit board, and electronic instrument
03/28/2007CN1937191A Semiconductor device and method of making the same, circuit board, and electronic instrument
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