| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/04/2007 | CN1309066C 半导体装置 Semiconductor device |
| 04/04/2007 | CN1309065C Radiation device for electronic element |
| 04/04/2007 | CN1309064C Structure and process for reducing die corner and edge stresses in microelectronic packages |
| 04/04/2007 | CN1309063C Radiator |
| 04/04/2007 | CN1309062C Functional module with built-in radiating fin |
| 04/04/2007 | CN1309061C Functional module with built-in flat plate type radiating element |
| 04/04/2007 | CN1309060C Semiconductor module and method for producing a semiconductor module |
| 04/04/2007 | CN1309059C Method of machining terminal board |
| 04/04/2007 | CN1309058C Cover for packaging electronic device and its manufacturing method |
| 04/04/2007 | CN1309057C Semiconductor device and method for manufacturing same |
| 04/04/2007 | CN1309052C Method for manufacturing tungsten/polysilicon word line structure in vertical DRAM and device manufactured thereby |
| 04/04/2007 | CN1309042C Method for making semiconductor device |
| 04/04/2007 | CN1309038C High density area array solder microjoining interconnect structure and fabrication method |
| 04/04/2007 | CN1309025C 半导体器件 Semiconductor devices |
| 04/04/2007 | CN1309018C Simple technology for manufacturing semiconductor device |
| 04/04/2007 | CN1309014C Semiconductor device and method of manufacturing the same |
| 04/04/2007 | CN1308950C Voice code device and decode device, as well as transmission and reception method |
| 04/04/2007 | CN1308259C Aluminum nitride sintered compact, metallized substrate, heater, jig and method for producing aluminum nitride sintered compact |
| 04/03/2007 | US7200831 Semiconductor integrated circuit wiring design method and semiconductor integrated circuit |
| 04/03/2007 | US7200830 Enhanced electrically-aligned proximity communication |
| 04/03/2007 | US7200067 Pad arrangement in semiconductor memory device and method of driving semiconductor device |
| 04/03/2007 | US7200007 Power stack |
| 04/03/2007 | US7200006 Compliant thermal interface for electronic equipment |
| 04/03/2007 | US7199664 Integrated switchless programmable attenuator and low noise amplifier |
| 04/03/2007 | US7199648 Semiconductor integrated circuit including first and second switching transistors having operation states corresponding to operation states of first and second logic circuits |
| 04/03/2007 | US7199597 Dual feedback control system for maintaining the temperature of an IC-chip near a set-point |
| 04/03/2007 | US7199479 Chip package structure and process for fabricating the same |
| 04/03/2007 | US7199478 Printed circuit board having an improved land structure |
| 04/03/2007 | US7199477 Multi-tiered lead package for an integrated circuit |
| 04/03/2007 | US7199476 Electronic device |
| 04/03/2007 | US7199475 Protective ceramic metal hydride coatings on copper circuits for soldering without fluxing; bond wires to copper circuits; electronic package; metal hydride layer was formed by reducing with hydrogen |
| 04/03/2007 | US7199474 Damascene structure with integral etch stop layer |
| 04/03/2007 | US7199473 Integrated low-k hard mask |
| 04/03/2007 | US7199472 Semiconductor device |
| 04/03/2007 | US7199471 Method and apparatus for reducing capacitive coupling between lines in an integrated circuit |
| 04/03/2007 | US7199470 Surface-mountable semiconductor component and method for producing it |
| 04/03/2007 | US7199469 Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
| 04/03/2007 | US7199468 Hybrid integrated circuit device with high melting point brazing material |
| 04/03/2007 | US7199467 Semiconductor device with improved heat dissipation, and a method of making semiconductor device |
| 04/03/2007 | US7199466 Package design using thermal linkage from die to printed circuit board |
| 04/03/2007 | US7199465 Wire bonding system and method of use |
| 04/03/2007 | US7199464 Semiconductor device structures including protective layers formed from healable materials |
| 04/03/2007 | US7199463 Method and structure for manufacturing improved yield semiconductor packaged devices |
| 04/03/2007 | US7199462 Substrate for producing semiconductor packages |
| 04/03/2007 | US7199461 Semiconductor package suitable for high voltage applications |
| 04/03/2007 | US7199460 Semiconductor device and method of manufacturing the same |
| 04/03/2007 | US7199459 Semiconductor package without bonding wires and fabrication method thereof |
| 04/03/2007 | US7199458 Stacked offset semiconductor package and method for fabricating |
| 04/03/2007 | US7199457 Thin film circuit board device and its manufacturing method |
| 04/03/2007 | US7199456 Injection moulded product and a method for its manufacture |
| 04/03/2007 | US7199455 Molded resin semiconductor device having exposed semiconductor chip electrodes |
| 04/03/2007 | US7199453 Semiconductor package and fabrication method thereof |
| 04/03/2007 | US7199452 Semiconductor device and manufacturing method for same |
| 04/03/2007 | US7199450 Materials and method to seal vias in silicon substrates |
| 04/03/2007 | US7199448 Integrated circuit configuration comprising a sheet-like substrate |
| 04/03/2007 | US7199445 Integrated capacitor on packaging substrate |
| 04/03/2007 | US7199440 Techniques for joining an opto-electronic module to a semiconductor package |
| 04/03/2007 | US7199439 Microelectronic imagers and methods of packaging microelectronic imagers |
| 04/03/2007 | US7199438 Overmolded optical package |
| 04/03/2007 | US7199433 Method of manufacturing semiconductor integrated circuit device having capacitor element |
| 04/03/2007 | US7199432 Semiconductor integrated circuit device |
| 04/03/2007 | US7199420 Semiconductor device |
| 04/03/2007 | US7199418 Diverse band gap energy level semiconductor device |
| 04/03/2007 | US7199416 Systems and methods for a memory and/or selection element formed within a recess in a metal line |
| 04/03/2007 | US7199400 Semiconductor package |
| 04/03/2007 | US7199394 Polymer memory device with variable period of retention time |
| 04/03/2007 | US7199307 Structure and method for embedding capacitors in z-connected multi-chip modules |
| 04/03/2007 | US7199306 Multi-strand substrate for ball-grid array assemblies and method |
| 04/03/2007 | US7199305 Protosubstrates |
| 04/03/2007 | US7199304 Configurable microelectronic package using electrically conductive material |
| 04/03/2007 | US7199058 Method of manufacturing a semiconductor device and apparatus for manufacturing a semiconductor device |
| 04/03/2007 | US7199052 Seed layers for metallic interconnects |
| 04/03/2007 | US7199042 Semiconductor device with multi-layered wiring arrangement including reinforcing patterns, and production method for manufacturing such semiconductor device |
| 04/03/2007 | US7199040 Barrier layer structure |
| 04/03/2007 | US7199039 Interconnect routing over semiconductor for editing through the back side of an integrated circuit |
| 04/03/2007 | US7199038 Method for fabricating semiconductor device |
| 04/03/2007 | US7199037 Microfeature devices and methods for manufacturing microfeature devices |
| 04/03/2007 | US7199036 Under-bump metallization layers and electroplated solder bumping technology for flip-chip |
| 04/03/2007 | US7199035 Interconnect junction providing reduced current crowding and method of manufacturing same |
| 04/03/2007 | US7199025 Fabrication and assembly structures and methods for memory devices |
| 04/03/2007 | US7199015 Rare earth-oxides, rare earth-nitrides, rare earth-phosphides and ternary alloys with silicon |
| 04/03/2007 | US7199006 Planarization method of manufacturing a superjunction device |
| 04/03/2007 | US7199001 Method of forming MIM capacitor electrodes |
| 04/03/2007 | US7198996 Component built-in module and method for producing the same |
| 04/03/2007 | US7198989 Method of producing a COF flexible printed wiring board |
| 04/03/2007 | US7198987 Overmolded semiconductor package with an integrated EMI and RFI shield |
| 04/03/2007 | US7198984 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 04/03/2007 | US7198980 Methods for assembling multiple semiconductor devices |
| 04/03/2007 | US7198979 Method for manufacturing a stack arrangement of a memory module |
| 04/03/2007 | US7198969 Semiconductor chip assemblies, methods of making same and components for same |
| 04/03/2007 | US7198963 Methodologies for efficient inspection of test structures using electron beam scanning and step and repeat systems |
| 04/03/2007 | US7198853 Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device |
| 04/03/2007 | US7198832 Method for edge sealing barrier films |
| 04/03/2007 | US7198823 Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same |
| 04/03/2007 | US7198705 Plating-rinse-plating process for fabricating copper interconnects |
| 04/03/2007 | US7198403 Arrangement for determining a temperature loading of an integrated circuit and method |
| 04/03/2007 | US7198096 Stacked low profile cooling system and method for making same |
| 04/03/2007 | US7198094 Finned device for removing heat from an electronic component |
| 04/03/2007 | US7197817 Method for forming contact bumps for circuit board |
| 03/29/2007 | WO2007035443A1 Miniaturized co-fired electrical interconnects for implantable medical devices |