Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2007
04/04/2007EP1770764A2 Semiconductor device
04/04/2007EP1770610A2 Semiconductor device
04/04/2007EP1770108A1 Epoxy resin, epoxy resin composition, and cured product thereof
04/04/2007EP1769660A1 Ic socket
04/04/2007EP1769538A2 Semiconductor package having integrated metal parts for thermal enhancement
04/04/2007EP1769532A1 Electronic device comprising an esd device
04/04/2007EP1769531A2 Assembly and method of placing the assembly on an external board
04/04/2007EP1697985B1 Combinations of resin compositions and methods of use thereof
04/04/2007EP1422279B1 Semiconductor package with a die attach adhesive having silane functionality
04/04/2007EP1384261A4 Isolated thermal interface
04/04/2007EP1378932B1 Semiconductor chip mounting apparatus and mounting method
04/04/2007EP1256129A4 Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation
04/04/2007CN2887005Y Micro groove group integration radiator for heating tube
04/04/2007CN2887003Y Buckle connecting chain for radiator
04/04/2007CN2886811Y Heat radiation support structure for LED
04/04/2007CN2886806Y IC chip
04/04/2007CN2886805Y Structure in which LED circuit is integrated in radiation baseplate
04/04/2007CN2886804Y IC board diagram structure with convenient positing in FIB modification
04/04/2007CN2886803Y Heat pipe radiator for 3'' and 4'' non reversible thyristor
04/04/2007CN1943286A Preferential asymmetric through-hole positoning for printed circuit boards
04/04/2007CN1943111A Surface acoustic wave device
04/04/2007CN1943031A An integrated circuit, a method and an assembly for manufacturing the integrated circuit, and a mobile phone having the integrated circuit
04/04/2007CN1943030A Doped alloys for electrical interconnects, methods of production and uses thereof
04/04/2007CN1943029A Semiconductor device and method for manufacturing same
04/04/2007CN1943023A Wiring structure for integrated circuit with reduced intralevel capacitance
04/04/2007CN1943021A Substrate for electronic device and method for processing same
04/04/2007CN1942995A Integrated circuit with analog connection matrix
04/04/2007CN1942732A Heat transport apparatus, method of manufacturing heat transport apparatus, and electronic equipment
04/04/2007CN1942524A Polyimidesiloxane solution composition
04/04/2007CN1942502A Epoxy resin composition
04/04/2007CN1942089A Cooling device and electronic apparatus having cooling device
04/04/2007CN1942088A Heat sink assembly
04/04/2007CN1942054A Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus
04/04/2007CN1941432A Solid-crystal conductive and heat-conductive packing structure of light-emitting diodes
04/04/2007CN1941383A Thin-film transistor array base plate
04/04/2007CN1941374A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/04/2007CN1941372A Semiconductor device and method for fabricating the same
04/04/2007CN1941370A Systems for providing electrostatic discharge protection
04/04/2007CN1941369A Integrated circuit arrangement having a plurality of conductive structure levels and coil, and a method for producing the integrated circuit arrangement
04/04/2007CN1941368A Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement
04/04/2007CN1941367A Method of reducing current leakage in a semiconductor capacitor and corresponding device thereof
04/04/2007CN1941366A Sealed-ring corner design
04/04/2007CN1941365A Light-emitting diodes and light-source device
04/04/2007CN1941364A 半导体器件 Semiconductor devices
04/04/2007CN1941363A Information transfer in electronic modules and device with corresponding structure
04/04/2007CN1941362A Semiconductor power module with excess current protection unit
04/04/2007CN1941361A Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
04/04/2007CN1941360A Packing structure with stacking platform
04/04/2007CN1941359A Porous composite material and method for making same
04/04/2007CN1941358A Circuit substrate, electro-optical device and electronic apparatus
04/04/2007CN1941357A Semiconductor memory device and method of production
04/04/2007CN1941356A Semiconductor memory device and method of production
04/04/2007CN1941355A Integrated circuit element and method for forming same
04/04/2007CN1941354A Wiring board
04/04/2007CN1941353A Circuit board, and semiconductor device
04/04/2007CN1941352A Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
04/04/2007CN1941351A Semiconductor packer and its production
04/04/2007CN1941350A Terminal pad, junction structure thereof, semiconductor device having the junction structure, and method of manufacturing the semiconductor device
04/04/2007CN1941349A Molded semiconductor package
04/04/2007CN1941348A Relay board and semiconductor device having the relay board
04/04/2007CN1941347A High-heat conductive efficency circuit board
04/04/2007CN1941346A High-heat conductive efficiency circuit board
04/04/2007CN1941345A Electronic device
04/04/2007CN1941344A Bond pad structure
04/04/2007CN1941343A Chip structure and stacked chip packing structure
04/04/2007CN1941342A Chip structure and its production
04/04/2007CN1941341A Routing under bond pad for the replacement of an interconnect layer
04/04/2007CN1941340A Semiconductor device and manufacturing method of the same
04/04/2007CN1941339A Semiconductor IC-embedded substrate and method for manufacturing same
04/04/2007CN1941338A Chip structure and wafer structure
04/04/2007CN1941337A Electronic equipment cooling plant and electronic equipment
04/04/2007CN1941336A Thin packing structure for enhancing crystal fin radiation
04/04/2007CN1941335A Heat sink
04/04/2007CN1941334A Radiator and its production
04/04/2007CN1941333A Chip packing structure
04/04/2007CN1941332A Structure for binding local polymer materials and chip
04/04/2007CN1941325A Method for forming wiring structure, wiring structure, method for forming semiconductor device, and display device
04/04/2007CN1941321A Double lineage structure by treating with supercritical fluid and forming method thereof
04/04/2007CN1941309A Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same
04/04/2007CN1941302A Production of scab and chip packing structure
04/04/2007CN1941290A Unpolished semiconductor wafer and manufacture method thereof
04/04/2007CN1941289A Method for forming interconnected electroplating lead wire of nano-carbon tube and metal composite material
04/04/2007CN1941240A Interposer with electrical contact button and manufacturing method thereof
04/04/2007CN1940977A 半导体装置 Semiconductor device
04/04/2007CN1940976A Method for producing radio frequency to discriminate electronic label
04/04/2007CN1309285C High frequency circuit block member, its manufacturing method, high refrequency module device and its manufacturing method
04/04/2007CN1309283C Manufacturing method of circuit device
04/04/2007CN1309281C Circuit board and method for manufacturing the same
04/04/2007CN1309271C Electronic component and mobile communicating device using the same
04/04/2007CN1309079C Semiconductor integrated circuit device
04/04/2007CN1309076C Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction
04/04/2007CN1309075C Electrostatic discharge protection circuit
04/04/2007CN1309074C Electric interconnecting structure on substrate and producing method thereof
04/04/2007CN1309073C High-density chip carrier and its constituent method
04/04/2007CN1309072C Lead frame, its manufacturing method and manufacturing method for semiconductor device using it
04/04/2007CN1309071C Lead frame and method for manufacturing said lead frame
04/04/2007CN1309070C Semiconductor device and its manufacturing method
04/04/2007CN1309069C Semiconductor device and its manufacturing method, circuit substrate and electronic apparatus
04/04/2007CN1309068C Semiconductor device and manufacturing method thereof, circuit board and electronic apparatus
04/04/2007CN1309067C Elastic lug structure and its manufacturing method
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