| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/05/2007 | WO2007036911A2 Fine-pitch routing in a lead frame based system-in-package (sip) device |
| 04/05/2007 | WO2007036868A2 Wafer with scribe lanes comprising active circuits for die testing of complementary signal processing parts |
| 04/05/2007 | WO2007036867A2 Wafer with scribe lanes comprising external pads and/or active circuits for die testing |
| 04/05/2007 | WO2007036836A1 Method for fixing a light-emitting diode to a metallic heat-radiating element |
| 04/05/2007 | WO2007036757A1 Wire-bonded semiconductor component and manufacturing method thereof |
| 04/05/2007 | WO2007036323A1 Integrated circuit comprising at least one integrated transmission line |
| 04/05/2007 | WO2007036020A1 Semiconductor integrated circuit having current leakage reduction scheme |
| 04/05/2007 | WO2007008682A3 Guardringed scr esd protection |
| 04/05/2007 | WO2007002547A3 Through-wafer vias and surface metallization for coupling thereto |
| 04/05/2007 | WO2006132704A3 High voltage igbt semiconductor device and method of manufacture |
| 04/05/2007 | WO2006127669A3 Integrated circuit die attach using backside heat spreader |
| 04/05/2007 | WO2006124085A3 Memory module system and method |
| 04/05/2007 | WO2006085179A3 Peltier based heat transfer systems |
| 04/05/2007 | WO2006047028A3 Packaged device and method of forming same |
| 04/05/2007 | US20070079261 Integrated circuit device and method for forming the same |
| 04/05/2007 | US20070078256 Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films |
| 04/05/2007 | US20070077908 Fully integrated tuner architecture |
| 04/05/2007 | US20070077722 Flat-type capacitor for integrated circuit and method of manufacturing the same |
| 04/05/2007 | US20070077700 Capacitance process using passivation film scheme |
| 04/05/2007 | US20070077503 Overlay key, method of forming the overlay key and method of measuring overlay accuracy using the overlay key |
| 04/05/2007 | US20070077434 Such as a plasma display panel (PDP) or a light emitting diode (LED); comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell facing the back surface of the device |
| 04/05/2007 | US20070075767 Inductor element containing circuit board and power amplifier module |
| 04/05/2007 | US20070075715 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts |
| 04/05/2007 | US20070075597 Arrangement with an electronically commutated external rotor motor |
| 04/05/2007 | US20070075444 Optical imaging device for optical proximity communication |
| 04/05/2007 | US20070075443 Resonator system for optical proximity communication |
| 04/05/2007 | US20070075442 Method and apparatus for facilitating proximity communication and power delivery |
| 04/05/2007 | US20070075441 Chip package structure |
| 04/05/2007 | US20070075440 Semiconductor device including semiconductor chip with two pad rows |
| 04/05/2007 | US20070075439 Circuit board, and semiconductor device |
| 04/05/2007 | US20070075438 Package board and semiconductor device |
| 04/05/2007 | US20070075437 Relay board and semiconductor device having the relay board |
| 04/05/2007 | US20070075436 Electronic device and manufacturing method of the same |
| 04/05/2007 | US20070075435 Semiconductor device |
| 04/05/2007 | US20070075434 Method for producing a PCM memory element and corresponding PCM memory element |
| 04/05/2007 | US20070075433 Semiconductor device having high-density contact holes with oval plane shape arranged to reduce malfunction resulting from bowing during etching |
| 04/05/2007 | US20070075432 Printed circuit board with differential pair arrangement |
| 04/05/2007 | US20070075431 Power feed device to power pins of electrical component |
| 04/05/2007 | US20070075430 Solder joint intermetallic compounds with improved ductility and toughness |
| 04/05/2007 | US20070075429 Metal interconnection lines of semiconductor devices and methods of forming the same |
| 04/05/2007 | US20070075428 Encapsulated damascene with improved overlayer adhesion |
| 04/05/2007 | US20070075426 Wiring board |
| 04/05/2007 | US20070075425 Semicondictor device and manufacturing method of the same |
| 04/05/2007 | US20070075424 Semiconductor chip and semiconductor device |
| 04/05/2007 | US20070075423 Semiconductor element with conductive bumps and fabrication method thereof |
| 04/05/2007 | US20070075422 Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
| 04/05/2007 | US20070075421 Ultra-thin wafer system |
| 04/05/2007 | US20070075420 Microelectronic package having direct contact heat spreader and method of manufacturing same |
| 04/05/2007 | US20070075419 Semiconductor device having metallic lead and electronic device having lead frame |
| 04/05/2007 | US20070075418 Emi shielding device for pcb |
| 04/05/2007 | US20070075417 MEMS module package using sealing cap having heat releasing capability and manufacturing method thereof |
| 04/05/2007 | US20070075416 Electronic devices and methods for forming the same |
| 04/05/2007 | US20070075415 Semiconductor device and semiconductor device production method |
| 04/05/2007 | US20070075414 Semiconductor device and a manufacturing method of the same |
| 04/05/2007 | US20070075413 Semiconductor package |
| 04/05/2007 | US20070075412 Mid-plane arrangement for components in a computer system |
| 04/05/2007 | US20070075411 State recognition tag |
| 04/05/2007 | US20070075410 Semiconductor device for radio frequency applications and method for making the same |
| 04/05/2007 | US20070075409 Method of forming a molded array package device having an exposed tab and structure |
| 04/05/2007 | US20070075408 Semiconductor device and radiation detector employing it |
| 04/05/2007 | US20070075407 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
| 04/05/2007 | US20070075406 Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die |
| 04/05/2007 | US20070075405 System and method to control signal line capacitance |
| 04/05/2007 | US20070075404 Integrated circuit package system with multi-surface die attach pad |
| 04/05/2007 | US20070075393 Lateral semiconductor device |
| 04/05/2007 | US20070075373 Radiation tolerant electrostatic discharge protection networks |
| 04/05/2007 | US20070075372 Semiconductor device and manufacturing process therefor |
| 04/05/2007 | US20070075371 Integrated circuit with self-aligned line and via |
| 04/05/2007 | US20070075370 Thermal sensing method and apparatus using existing ESD devices |
| 04/05/2007 | US20070075368 CMOS inverter cell |
| 04/05/2007 | US20070075346 Light emitting diode and the package structure thereof |
| 04/05/2007 | US20070075343 Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same |
| 04/05/2007 | US20070075339 Gas-sensitive field effect transistor for detecting chlorine |
| 04/05/2007 | US20070075058 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 04/05/2007 | US20070075034 Electronic device and method of manufacturing thereof |
| 04/05/2007 | US20070074907 Method of manufacturing an electronic device and an electronic device |
| 04/05/2007 | US20070074384 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 04/05/2007 | DE202006017059U1 Anordnung mit einem Füllstutzen Arrangement with a filling |
| 04/05/2007 | DE112005000952T5 Elektronik-Modul und Verfahren zur Herstellung desselben The same electronic module and method for producing |
| 04/05/2007 | DE112004002827T5 Verfahren zum Bohren von Durchgangslöchern in homogenen und nicht-homogenen Substraten The method of drilling through-holes in homogeneous and non-homogeneous substrates |
| 04/05/2007 | DE10352946B4 Halbleiterbauteil mit Halbleiterchip und Umverdrahtungslage sowie Verfahren zur Herstellung desselben Of the same semiconductor device with the semiconductor chip and rewiring and methods for preparing |
| 04/05/2007 | DE10334576B4 Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse A method of manufacturing a semiconductor device with a plastic housing |
| 04/05/2007 | DE10310842B4 Elektronisches Bauteil mit Halbleiterchip und Kunststoffgehäuse Electronic component with semiconductor chip and the plastic housing |
| 04/05/2007 | DE10260238B4 Adapter zum Testen einer oder mehrerer Leiteranordnungen und Verfahren Adapter for testing one or more printed circuit assemblies and methods |
| 04/05/2007 | DE10241168B4 Analoge Eingangsauswahlschaltung zum Schutz gegen negative Überspannung Analog input selection circuit for protection against negative overvoltage |
| 04/05/2007 | DE102005048100A1 Automotive electrical or electronic control unit is mounted on an extruded metal bar with air vent |
| 04/05/2007 | DE102005046973A1 Superimposed measuring structure used in the production of integrated circuits comprises a first periodic structure formed in a first component layer and a second periodic structure formed in a second component arranged over the first layer |
| 04/05/2007 | DE102005046710A1 Carrier for a semiconductor chip comprises a sintered body made from carbon fibers and a metal |
| 04/05/2007 | DE102005046404A1 Method for reducing scattering in the sagging of rolled metal base plates for semi conductor modules involves rolling base plates in preferential such as longitudinal direction |
| 04/05/2007 | DE102005046280A1 Electronic semiconductor component for electronic circuits has flipchip contacts surrounded by insulating material |
| 04/05/2007 | DE102004062205B4 Schaltungsanordnung zum Schutz einer Schaltung vor elektrostatischen Entladungen Circuitry to protect a circuit from electrostatic discharges |
| 04/05/2007 | DE102004036909B4 Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung Basic semiconductor device having wiring substrate and intermediate wiring board for a semiconductor component stack and process for their preparation |
| 04/04/2007 | EP1771050A1 Printed circuit board and method of manufacturing printed circuit board |
| 04/04/2007 | EP1770786A1 Semiconductor device and method of manufacturing a semiconductor device |
| 04/04/2007 | EP1770777A2 Semiconductor device |
| 04/04/2007 | EP1770776A2 Semiconductor ic-embedded substrate and method for manufacturing same |
| 04/04/2007 | EP1770775A2 Heatsink |
| 04/04/2007 | EP1770774A2 Heatsink Assembly |
| 04/04/2007 | EP1770773A2 Heat spreader module and method of manufacturing same |
| 04/04/2007 | EP1770770A2 Semiconductor module |